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CERAMIC CHIP INDUCTORS
1. PART NO. EXPRESSION :
C1 SERIES
C1-1N0S-10
(a) (b) (c) (d)
(a) Series code (b) Inductance code : 1N0 = 1.0nH (c) Tolerance code : S = 0.3nH, J = 5%
(d) 10 : Lead Free
2. CONFIGURATION & DIMENSIONS :
A D
B
C
Unit:m/m A 1.00.05 B 0.50.05 C 0.50.05 D 0.1 ~ 0.3
3. GENERAL SPECIFICATION : a) Operating temp. : -40C to +85C b) Storage temp. : -10C to +40C c) Humdity range : 70% RH Max. d) Resistance to solder heat : 265C.6secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
CERAMIC CHIP INDUCTORS
6. ELECTRICAL CHARACTERISTICS : Part Number C1-1N0S-10 C1-1N2S-10 C1-1N5S-10 C1-1N8S-10 C1-2N0S-10 C1-2N2S-10 C1-2N4S-10 C1-2N7S-10 C1-3N0S-10 C1-3N3S-10 C1-3N9S-10 C1-4N7S-10 C1-5N6S-10 C1-6N8J-10 C1-8N2J-10 C1-10NJ-10 C1-12NJ-10 C1-15NJ-10 C1-18NJ-10 C1-22NJ-10 C1-27NJ-10 C1-33NJ-10 C1-39NJ-10 C1-47NJ-10 C1-56NJ-10 C1-68NJ-10 C1-82NJ-10 C1-R10J-10 C1-R12J-10 Tolerance code : S : 0.3nH J : 5% EIA Size 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 Inductance ( nH ) 1.0 1.2 1.5 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 Q Min. 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 Test Frequency ( MHz ) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 SRF ( GHz ) Min. 10 10 6 6 6 6 6 6 6 6 4 4 4 3.9 3.6 3.2 2.7 2.3 2.1 1.9 1.6 1.3 1.2 1.0 0.75 0.75 0.60 0.60 0.60 DCR () Max. 0.08 0.09 0.10 0.12 0.12 0.13 0.13 0.13 0.16 0.16 0.21 0.21 0.23 0.25 0.28 0.31 0.40 0.46 0.55 0.60 0.70 0.80 0.90 1.00 1.00 1.20 1.30 1.50 1.60
C1 SERIES
Rated Current ( mA ) Max. 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 200 200 200 200 180 150 150 150
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
CERAMIC CHIP INDUCTORS
7. CHARACTERISTICS CURVES :
C1 SERIES
Inductance vs. Frequency
Q vs. Frequency
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
CERAMIC CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
C1 SERIES
ITEM
Solder Heat Resistance
PERFORMANCE
Appearance : Cracks should not be allowed. More than 75% of the terminal electrode should be covered with new solder.
TEST CONDITION
Preheat : 100~150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2653C Flux : Rosin Dip Time : 61sec.
265C 150C
Preheating Dipping
Natural cooling
60 seconds
61 seconds
Solderability
More than 90% of the terminal electrode should be covered with new solder.
Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2405C Flux : Rosin Dip Time : 31sec. 240C
150C
Preheating Dipping
Natural cooling
60 seconds
31.0 seconds
Terminal Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
For C Series : Size 1 2 3 4 5 6 Force (Kfg) 0.2 0.5 0.6 1.0 1.0 1.0 1.5 2.0 > 25 Time (sec)
W
W
7 8
Flexture Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
20(.787) Bending 45(1.772) 45(1.772) 40(1.575)
Solder a chip on a test substrate, bend the substrate by 3mm (0.118in) for 10secs and return.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
CERAMIC CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
C1 SERIES
ITEM
Bending Strength
PERFORMANCE
The ferrite should not be damaged by forces applied on the right condition.
R0.5(0.02) 1.0(0.039)
TEST CONDITION
Chip A
High Temperature Resistance
Appearance : No damage. Inductance : Within 20% of initial value.
Temperature : 855C Applied Current : rated current Duration : 100812hrs Measurement : After placing for at least 24hrs. Humidity : 90~95% RH. Temperature : 602C Applied Current : rated current (max.) Duration : 100812hrs Measurement : After placing for at least 24hrs.
Humidity Resistance
Thermal Shock
Appearance : Cracking, chipping or any other defects that are harmful to the characteristics shall not be allowed. Inductance : Within 20% of initial value. Phase 1 Temperature (C) -402C +855C Times (min.) 30 30
For C Series : Condition for 1 cycle Step1 : -402C 30 min. Step2 : +855C 30 min. Number of cycles : 100 Measurement : After placing for at least 24hrs. Temperature : -402C Duration : 100812hrs Measurement : After placing for at least 24hrs.
Low temperature storage test
2
Measured : 100 times
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
CERAMIC CHIP INDUCTORS
9. SOLDERING : 9-1. Reflow soldering conditions
C1 SERIES
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150C max. Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
main heating
A
E
Slope of temp. rise Heat time
1 to 5 50 to 150 120 to 180 1 to 5 90 ~ 120 255 ~ 260 10 max. 3
C/sec sec C C/sec sec C sec times
TEMPERATURE C
230C
B
180C pre-heating normal temperature
A B C D
Heat temperature Slope of temp. rise Time over 230C Peak temperature
120C
C D E
Peak hold time No. of mounting
TIME(sec.)
(Melting area of solder)
9-2. Soldering Iron Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150C. b) 280C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm f) Limit soldering time to 3 secs.
9-3. Solder Volume : Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side.
Upper limit Recommendable
NOTE : Specifications subject to change without notice. Please check our website for latest information.
t
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
CERAMIC CHIP INDUCTORS
10. PACKAGING INFORMATION : 10-1. Carrier Tape Packaging
P2 P0 D0
C1 SERIES
t
E F
P1
A Unreeling direction
B
W
Ko
A(mm) 0.650.1
B(mm) 1.150.1
W(mm) 80.2
F(mm) 3.50.05
E(mm) 1.750.1
P1(mm) 40.1
P2(mm) 20.05
P0(mm) 40.1
D0(mm) 1.5
+0.1 -0
Ko(mm) 0.80.05
t(mm) 0.20.05
10-2. Leader And Trailer Tape
500 to 560mm Blank 10 to 20 pitches Components Blank 440mm Min. Leader
End
110mm or more
Unreeling direction
10-3. Configuration
W t
20.5
1 3 .0 0.8
A(mm)
N
N(mm) O602
W(mm) 101.5
t(mm) 20.5
Qty (pcs) 10000/Reel
A
1782.0
21 8 0.
R1.0
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7

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