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EMIF04-EAR02M8 4-line IPADTM EMI filter and ESD protection for headset Features Lead-free package High attenuation: -30 dB at 900 MHz Low cut-off frequencies: 60 MHz for speaker lines High current capability: 50 mA per line Very low PCB space consumption: 1.5 mm x 1.7 mm Very thin package: 0.6 mm maximum High efficiency in ESD suppression IEC6 1000-4-2 level 4 High reliability offered by monolithic integration Figure 1. Pin configuration (bottom side) MIC_P_Int Micro QFN 8 leads MIC_P_Ext Complies with following standards: EAR_Ext EAR_Ext GND MIC_N_Ext MIC_N_Int EAR_Int EAR_Int IEC 61000-4-2 level 4 input pins - 15 kV (air discharge) - 8 kV (contact discharge) Applications Figure 2. Equivalent circuit R C MIC Mobile phones L_MIC Description The EMIF04-EAR02M8 chip is a highly integrated device designed to suppress EMI/RFI noise for headset mobile phone. The new LC architecture on the speaker lines provides a high attenuation value maintaining a very low serial resistance. The 8-lead micro-QFN package offers the possibility to integrate the whole function in a very small PCB space. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV. R C MIC L_MIC L C EAR L_EAR L C EAR L_EAR TM: IPAD is a trademark of STMicroelectronics March 2009 Rev 1 1/12 www.st.com 12 Characteristics EMIF04-EAR02M8 1 Characteristics Table 1. Symbol VPP IEAR Tj Tstg ESD IEC 61000-4-2 air discharge contact discharge Maximum rms current per channel Operating junction temperature Storage temperature range Absolute maximum ratings (Tamb = 25 C) Parameter Value 30 30 50 -30 to 125 -55 to +150 Unit kV mA C C Figure 3. Electrical symbols and parameters VBR Breakdown voltage VRM Stand-off voltage IRM Leakage current @ VRM VBR VRM IRM I V IRM VRM VBR Table 2. Symbol VBR IRM LEAR RL RMIC CL_EAR CL_MIC Fc_EAR Fc_MIC Electrical characteristics (Tamb = 25 C) Test conditions IR = 1 mA VRM = 3 V 1.5 Parasitic resistance of inductor LEAR 54 VR = 0 V DC, 1 MHz VR = 0 V DC, 1 MHz Cut-off frequency earphone line: ZSOURCE = ZLOAD = 50 Cut-off frequency microphone line: ZSOURCE = ZLOAD = 50 84 60 0.30 68 105 76 60 70 0.6 82 126 92 Min. 7 100 Typ. Max. Unit V nA nH pF pF MHz MHz 2/12 EMIF04-EAR02M8 Characteristics Figure 4. 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 100k S21 attenuation measurement Figure 5. 0 -10 -20 -30 Analog cross talk measurements dB dB MIC_N MIC_P EAR_R EAR_L F (Hz) -40 -50 -60 -70 MIC_N - MIC_P EAR_L - MIC_P 100k 1M 10M 100M F (Hz) 1G 1M 10M 100M 1G Figure 6. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one MIC input (Vin) and on one MIC output Figure 7. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one MIC input (Vin) and on one MIC output IN 5.00 V/div 5.00 V/div IN 5.00 V/div OUT 5.00 V/div 100 ns/div OUT 100 ns/div Figure 8. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one EAR input (Vin) and on one EAR output Figure 9. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one EAR input (Vin) and on one EAR output 5.00 V/div IN 5.00 V/div IN OUT 5.00 V/div 100 ns/div 5.00 V/div OUT 100 ns/div 3/12 Characteristics EMIF04-EAR02M8 Figure 10. Relative line capacitance variation versus applied voltage C/C0 Figure 11. Total harmonic distortion with noise: MIC lines, R = 10 k 0 THD + N (dB) 1.0 MIC lines EAR lines 0.8 -50 0.6 0 1 2 3 4 VR(V) 5 -100 100 1k F (Hz) 10 k Figure 12. Total harmonic distortion with noise: MIC lines, R = 32 0 THD + N (dB) Figure 13. Total harmonic distortion with noise: EAR lines, R = 32 0 THD + N (dB) -50 -50 F (Hz) -100 100 F (Hz) 1k 10 k -100 100 1k 10 k Figure 14. Total harmonic distortion with noise: EAR lines, R = 8 0 THD + N (dB) -50 -100 100 1k F (Hz) 10 k 4/12 EMIF04-EAR02M8 Application information 2 Application information Figure 15. Example of application scheme using EMIF04-EAR02M8 EMIF04-EAR02M8 VDD MIC_P MIC_P MIC_P_Ext MIC_P_Int MIC_N_Ext MIC_N_Int MIC_P MIC_N MIC_N MIC_N EAR_R EAR_R EAR_Ext GND EAR_Int EAR_R EAR_L EAR_L EAR_Ext EAR_Int EAR_L Audio sub-system Cable Headset connector 3 Ordering information scheme Figure 16. Ordering information scheme EMIF EMI Filter Number of lines Information xxx = application zz = version Package Mx = Micro QFN x leads yy xxx zz Mx 5/12 Package information EMIF04-EAR02M8 4 Package information Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 3. Micro QFN dimensions Dimensions D N Ref. Millimeters Min. Typ. 0.55 0.02 0.18 1.70 1.3 1.50 0.20 0.40 0.20 0.25 0.30 0.35 0.008 Max. 0.60 0.05 0.25 1.75 1.4 1.55 0.30 Min. Inches Typ. Max. E A A1 b 0.50 0.00 0.15 1.65 1.15 1.45 0.05 0.020 0.022 0.024 0.000 0.001 0.002 0.006 0.007 0.001 0.067 0.045 0.051 0.055 0.059 0.002 0.008 0.012 0.016 1 2 A A1 1 D D2 2 D2 L E2 k E E2 e N b e k L 0.010 0.012 0.014 Figure 17. Footprint 0.40 0.20 Figure 18. Marking Dot: Pin1 identification XX = Marking 0.60 0.32 0.26 2.10 XX 1.32 6/12 EMIF04-EAR02M8 Figure 19. Tape and reel specification 0.25 0.05 Package information 1.95 0.1 8.0 0.3 KA KA KA 1.75 0.1 0.70 0.05 4.0 0.1 All dimensions in mm User direction of unreeling Note: Product marking may be rotated by 90 for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. 3.5 - 0.1 1.75 0.1 2.0 0.05 4.0 0.1 O 1.55 0.05 7/12 Recommendation on PCB assembly EMIF04-EAR02M8 5 5.1 Recommendation on PCB assembly Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 20. Stencil opening dimensions L T W b) General design rule Stencil thickness (T) = 75 ~ 125 m W Aspect Ratio = ---- 1.5 T LxW Aspect Area = --------------------------- 0.66 2T ( L + W ) 2. Reference design a) b) c) Stencil opening thickness: 100 m Stencil opening for central exposed pad: Opening to footprint ratio is 50%. Stencil opening for leads: Opening to footprint ratio is 90%. Figure 21. Recommended stencil window position 5 m 5 m 15 m T=100 m 600 m 570 m 190 m 15 m 200 m 1320 m 50 m 260 m 160 m 1080 m 50 m 120 m Footprint Stencil window Footprint 120 m 8/12 EMIF04-EAR02M8 Recommendation on PCB assembly 5.2 Solder paste 1. 2. 3. 4. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m. 5.3 Placement 1. 2. 3. 4. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5. 6. 5.4 PCB design preference 1. 2. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 9/12 Recommendation on PCB assembly EMIF04-EAR02M8 5.5 Reflow profile Figure 22. ST ECOPACK(R) recommended soldering reflow profile for PCB mounting Temperature (C) 260C max 255C 220C 180C 125 C 2C/s recommended 2C/s recommended 6C/s max 6C/s max 3C/s max 3C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec 90 sec max 6 7 Time (min) Note: Minimize air convection currents in the reflow oven to avoid component movement. 10/12 EMIF04-EAR02M8 Ordering information 6 Ordering information Table 4. Ordering information Marking KA(1) Package Micro QFN Weight 3.8 mg Base qty 3000 Delivery mode Tape and reel Order code EMIF04-EAR02M8 1. The marking can be rotated by 90 to differentiate assembly location 7 Revision history Table 5. Date 24-Mar-2009 Document revision history Revision 1 Initial release Changes 11/12 EMIF04-EAR02M8 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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