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CR5AS-12 Thyristor Medium Power Use REJ03G0346-0200 Rev.2.00 Apr.05.2005 Features * IT (AV) : 5 A * VDRM : 600 V * IGT : 100 A * Lead Mounted Type * Non-Insulated Type * Glass Passivation Type Outline RENESAS Package code: PRSS0004ZD-D (Package name: DPAK(L)-(3)) 4 2, 4 3 1 1 1. Cathode 2. Anode 3. Gate 4. Anode 2 3 Applications Switching mode power supply, regulator for autocycle, protective circuit for TV sets, VCRs, and printers, igniter for autocycle, electric tool, strobe flasher, and other general purpose control applications Maximum Ratings Parameter Repetitive peak reverse voltage Non-repetitive peak reverse voltage DC reverse voltage Repetitive peak off-state voltageNote1 DC off-state voltageNote1 Symbol VRRM VRSM VR(DC) VDRM VD(DC) Voltage class 12 600 720 480 600 480 Unit V V V V V Rev.2.00, Apr.05.2005, page 1 of 7 CR5AS-12 Parameter RMS on-state current Average on-state current Surge on-state current I2t for fusing Peak gate power dissipation Average gate power dissipation Peak gate forward voltage Peak gate reverse voltage Peak gate forward current Junction temperature Storage temperature Mass Symbol IT (RMS) IT (AV) ITSM I2 t PGM PG (AV) VFGM VRGM IFGM Tj Tstg -- Ratings 7.8 5 90 33 0.5 0.1 6 6 0.3 - 40 to +125 - 40 to +125 0.26 Unit A A A A2s W W V V A C C g Conditions Commercial frequency, sine half wave 180 conduction, Tc = 88C 60Hz sine half wave 1 full cycle, peak value, non-repetitive Value corresponding to 1 cycle of half wave 60Hz, surge on-state current Typical value Notes: 1. With gate to cathode resistance RGK = 220 . Electrical Characteristics Parameter Repetitive peak reverse current Repetitive peak off-state current On-state voltage Gate trigger voltage Gate non-trigger voltage Gate trigger current Holding current Thermal resistance Symbol IRRM IDRM VTM VGT VGD IGT IH Rth (j-c) Min. -- -- -- -- 0.1 1 -- -- Typ. -- -- -- -- -- -- 3.5 -- Max. 2.0 2.0 1.8 0.8 -- 100Note3 -- 3.0 Unit mA mA V V V A mA C/W Test conditions Tj = 125C, VRRM applied, RGK = 220 Tj = 125C, VDRM applied, RGK = 220 Tc = 25C, ITM = 15 A, instantaneous value Tj = 25C, VD = 6 V, IT = 0.1 A Tj = 125C, VD = 1/2 VDRM, RGK = 220 Tj = 25C, VD = 6 V, IT = 0.1 A Tj = 25C, VD = 12 V, RGK = 220 Junction to caseNote2 Notes: 2. The measurement point for case temperature is at anode tab. 3. If special values of IGT are required, choose item D or E from those listed in the table below if possible. Item A B C D E IGT (A) 1 to 30 20 to 50 40 to 100 1 to 50 20 to 100 The above values do not include the current flowing through the 220 resistance between the gate and cathode. Rev.2.00, Apr.05.2005, page 2 of 7 CR5AS-12 Performance Curves Maximum On-State Characteristics 102 7 Tc = 25C 5 3 2 101 7 5 3 2 100 7 5 3 2 10-1 0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 100 Rated Surge On-State Current Surge On-State Current (A) 90 80 70 60 50 40 30 20 10 0 100 2 3 4 5 7 101 2 3 4 5 7 102 On-State Current (A) On-State Voltage (V) Conduction Time (Cycles at 60Hz) x 100 (%) Gate Characteristics 102 7 5 3 2 Gate Trigger Current vs. Junction Temperature 103 7 5 3 2 102 7 5 3 2 101 7 5 3 V = 6V 2D RL = 60 100 -60 -40 -20 0 20 40 60 80 100 120 140 #1 Gate Voltage (V) 101 7 5 3 2 VFGM = 6V PGM = 0.5W PG(AV) = 0.1W VGT = 0.8V IGT = 100A IFGM = 0.3A (Tj = 25C) 100 7 5 3 2 -1 7 VGD = 0.1V 5 -2 10 23 5710-1 23 57 100 23 57 10123 57102 23 Gate Current (mA) Gate Trigger Current (Tj = tC) Gate Trigger Current (Tj = 25C) #2 Typical Example IGT(25C) # 1 11A # 2 61A Junction Temperature (C) Maximum Transient Thermal Impedance Characteristics (Junction to case, Junction to ambient) Transient Thermal Impedance (C/W) 100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103 103 7 5 3 2 Junction to ambient 102 7 5 3 2 101 7 5 3 2 Gate Trigger Voltage vs. Junction Temperature 1.0 Gate Trigger Voltage (V) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Tj = 25C Distribution Typical Example 0 -60 -40 -20 0 20 40 60 80 100 120 140 Junction to case 100 10-3 2 3 5 710-2 2 3 5 710-1 2 3 5 7 100 Junction Temperature (C) Time (s) Rev.2.00, Apr.05.2005, page 3 of 7 CR5AS-12 Allowable Case Temperature vs. Average On-State Current (Single-Phase Half Wave) 160 Maximum Average Power Dissipation (Single-Phase Half Wave) 16 Average Power Dissipation (W) 180 Case Temperature (C) 14 12 10 8 6 4 2 0 0 1 2 3 4 90 120 60 140 120 100 80 60 40 20 360 Resistive, inductive loads = 30 360 Resistive, inductive loads 5 6 7 8 = 30 60 0 1 2 3 90 120 4 180 0 5 6 7 8 Average On-State Current (A) Allowable Ambient Temperature vs. Average On-State Current (Single-Phase Half Wave) 160 160 Average On-State Current (A) Allowable Ambient Temperature vs. Average On-State Current (Single-Phase Half Wave) Ambient Temperature (C) 360 Resistive, inductive loads Natural convection Ambient Temperature (C) 140 120 100 80 60 140 120 100 80 60 360 Resistive, inductive loads Natural convection = 30 40 60 90 120 20 180 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 = 30 60 90 20 120 180 0 0 1 2 40 Aluminum Board 80x80xt2.3 3 4 5 6 7 8 Average On-State Current (A) Average On-State Current (A) Allowable Case Temperature vs. Average On-State Current (Single-Phase Full Wave) 160 Maximum Average Power Dissipation (Single-Phase Full Wave) 16 Average Power Dissipation (W) Resistive loads 14 12 360 90 = 30 60 180 120 Case Temperature (C) 140 120 100 80 60 40 20 360 10 Resistive loads 8 6 4 2 0 0 1 2 = 30 60 90 120 180 3 4 5 6 7 8 0 0 1 2 3 4 5 6 7 8 Average On-State Current (A) Average On-State Current (A) Rev.2.00, Apr.05.2005, page 4 of 7 CR5AS-12 Allowable Ambient Temperature vs. Average On-State Current (Single-Phase Full Wave) 160 160 Allowable Ambient Temperature vs. Average On-State Current (Single-Phase Full Wave) Aluminum Board 80x80xt2.3 Ambient Temperature (C) Ambient Temperature (C) 140 120 100 80 60 = 30 60 40 90 120 20 180 0 0 140 120 100 80 60 40 20 0 0 360 Resistive loads Natural convection 360 Resistive loads Natural convection = 30 60 90 120 180 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1 2 3 4 5 6 7 8 Average On-State Current (A) Average On-State Current (A) Breakover Voltage (RGK = rk) Breakover Voltage (RGK = 220) x 100 (%) x 100 (%) Breakover Voltage vs. Junction Temperature 160 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 100 120 140 160 Breakover Voltage vs. Gate to Cathode Resistance 103 7 Typical Example 5 3 2 102 7 5 3 2 101 7 5 3 2 100 10-2 2 3 5 710-1 2 3 5 7100 2 3 5 7 101 Typical Example RGK = 220 Tj = 125C Breakover Voltage (Tj = tC) Breakover Voltage (Tj = 25C) Junction Temperature (C) Gate to Cathode Resistance (k) x 100 (%) Breakover Voltage vs. Rate of Rise of Off-State Voltage 160 140 120 100 80 60 40 20 0 100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103 Holding Current vs. Junction Temperature 102 7 5 4 Distribution 3 2 Typical Example 101 7 5 4 3 2 100 7 5 4 3 VD = 12V 2 RGK = 220 10-1 -60 -40 -20 0 20 40 60 80 100 120 140 Tj = 125C RGK = 220 Breakover Voltage (dv/dt = vV/s) Breakover Voltage (dv/dt = 1V/s) Rate of Rise of Off-State Voltage (V/s) Holding Current (mA) Junction Temperature (C) Rev.2.00, Apr.05.2005, page 5 of 7 CR5AS-12 Holding Current (RGK = r) Holding Current (RGK = 220) x 100 (%) 400 x 100 (%) Holding Current vs. Gate to Cathode Resistance Typical Example IGT(25C) IH(1k) 350 14A 1.7mA #1 48A 2.7mA 300 # 2 250 200 150 100 50 0 -2 10 2 3 5 710-1 2 3 5 7 100 2 3 5 7 101 Repetitive Peak Reverse Voltage vs. Junction Temperature 160 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 100 120 140 160 #1 #2 Repetitive Peak Reverse Voltage (Tj = tC) Repetitive Peak Reverse Voltage (Tj = 25C) Tj = 25C Typical Example Gate to Cathode Resistance (k) Junction Temperature (C) Gate Trigger Current vs. Gate Current Pulse Width x 100 (%) 104 7 5 3 2 103 7 5 3 2 #1 #2 Typical Example IGT(DC) # 1 11A # 2 61A Gate Trigger Current (tw) Gate Trigger Current (DC) 102 7 5 V = 6V 3D R = 60 2L Ta = 25C 101 0 10 2 3 4 5 7 101 2 3 4 5 7 102 Gate Current Pulse Width (s) Rev.2.00, Apr.05.2005, page 6 of 7 CR5AS-12 Package Dimensions JEITA Package Code RENESAS Code PRSS0004ZD-D Package Name DPAK(L)-(3)/DPAK(L)-(3)V MASS[Typ.] 0.36g Unit: mm 6.5 0.5 2.3 0.2 5.4 0.5 0.55 0.1 8.2 0.6 6.9 0.5 1.15 0.1 0.8 0.1 0.6 0.1 0.6 0.1 5.5 0.5 4.7 0.5 (1.3) 1.2 0.3 0.55 0.1 0.55 0.1 0.55 0.1 2.29 2.29 Order Code Lead form Standard packing Quantity Standard order code Standard order code example CR5AS-12-A1 Straight type Vinyl sack 100 Type name - A1 Note : Please confirm the specification about the shipping in detail. Rev.2.00, Apr.05.2005, page 7 of 7 16.2 0.5 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 http://www.renesas.com (c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .2.0 |
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