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Bluetooth
SEMCO Issued Checked Approved
TM
Confidential Module Preliminary Approval Sheet
ISSUE REVISION PAGE 07. April. 2006 1.0 20
Preliminary Approval Sheet
Issued
Checked
Approved
CUSTOMER PRODUCT NAME CUSTOMER'S MODEL SEMCO'S MODEL APPROVAL MEMO
# Head Office & Sales Dept. 314, Maetan 3 Dong, Yeongtong-Gu, Suwon-Si, Gyeonggi-Do, Korea TEL : + 82 31 210 6902 FAX : + 82 31 210 5529 # http://www.sem.samsung.com
SEMCO Bluetooth Module
BTVZ0502SA
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
TM
Confidential Module Preliminary Approval Sheet
Revision History
Revision #
Ver 1.0
Date
7th. April. 2006
Change Description
Initial release
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
TM
Confidential Module Preliminary Approval Sheet
Contents
1. General Part 1.1 Overview 1.2 Major Features 1.3 Module Block & Interfaces 1.4 Marking and External Appearance 1.4.1 Marking 1.4.2 External Appearance 1.4.3 Physical Dimension 1.5 PIN Description 2. Specification 2.1 General Specification 2.2 Temperature Specification 2.3 Tx/Rx Specifications 2.4 Reliability test Standard 2.5 Current Consumption 3. Interfaces 3.1 UART Interface 3.2 PCM Interface 3.3 UART Bypass Mode 3.4 Supply Voltage 4. Recommended Reflow temperature Profile 5. Packaging Information 5.1. Carrier dimension 5.2. Taping Package dimension 5.3. Packing Box dimension
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
TM
Confidential Module Preliminary Approval Sheet
1. General Part
1.1 Overview
This specification covers Bluetooth module(class-2) which complies with Bluetooth specification version1.2 and integrates RF & Baseband controller in small package. This module has deployed CSR's BC03-ROM CSP chipset.
1.2 Major Features
-, Bluetooth Spec. v1.2 Complaint -, Flexible Supply Voltage - Supply Voltage(1.8V) : Use VDD_UART and VDD_1.8V or Supply Voltage(2.8V) : Use VDD_UART and VDD_REG -, Contains up to HCI stack -, Class 2 Level Output Power Available (Max. 4dBm) -, UART Bypass Mode Support -, Piconet Support : Up to 7 Slaves -, Support of all Bluetooth packet types(Voice and Data) -, Support of Low power modes: Park, Sniff and Hold -, Wide operating temperature range : -30 to 70 (Storage: -40 to 85) -, UART, PCM Interface Available -, Flexible CODEC Interface: A-Law, u-Law, and Linear -, Low Power Consumption -, Built-in Memory : 4Mbit ROM -, Built-in Reference Clock : 26MHz -, Competitive Size : 6.0mm x 6.4mm x 1.4mm
1.3 Module Block & Interfaces
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
1.4 Marking and External Appearance 1.4.1 Marking
TM
Confidential Module Preliminary Approval Sheet
SAMSUNG
1
BT
2 3
V
4
Z
5
0
6
5
7
0
8
2
9
S
10
A
11
00
a
00
b
00
c
A
d
AA
e f
No. 1 2,3 4 5,6,7 8 9 10 11 Manufacturer
Index
No. a b c d e f
Index Manufactured Year Manufactured Month Manufactured Date Manufactured Line History Manufactured place
Product's Abbreviation (BT: Bluetooth) Interface/Application (V: Firmware modified) Module size (cc) (Z05 : 0.05cc) Hardware Revision (Starting from 0) Class (2: Class-2) Internal Production Code (S : Standard) Firmware Revision (Starting from A)
1.4.2 External Appearance
SAMSUNG
BTVZ0502SA 00 00 00 AAA
Pin No.1 is represented with
indication on the top surface of the module.
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
1.4.3 Physical Dimension
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Confidential Module Preliminary Approval Sheet
The dimension is 6.0mm W X 6.4mm L X 1.4mm H.
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
1.5 PIN Description
Pin No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 PIO_0 UART_TX PIO_2 PIO_3 GND PIO_5(UART_RTS2) PIO_4(UART_TX2) RESETB PCM_OUT PIO_6(UART_CTS2) VDD_UART GND PCM_IN UART_RTS PIO_7(UART_RX2) PCM_CLK UART_RX VDD_REG GND PCM_SYNC VDD_1.8V ANT GND GND PIO_1 UART_CTS Pin Name Direction I/O O I/O I/O I I/O I/O I O I/O I I I O I/O I/O I I I I/O I I/O I I I/O I
TM
Confidential Module Preliminary Approval Sheet
Description Programmable input/output line UART data output active high Programmable input/output line Programmable input/output line Ground Programmable input/output line Programmable input/output line Reset if low. Input debounced so must be low for >5ms to cause a reset Synchronous data output Programmable input/output line D.C Input Voltage for UART, PCM and PIO Interface (1.7~3.6V) Ground Synchronous data input UART request to send active low Programmable input/output line Synchronous data clock UART data input active high D.C Input Voltage for Internal Regulator (2.2~3.6V) Ground Synchronous data sync D.C Input Voltage for the operation of Core and RF block (1.7~1.9V) Antenna Port Ground Ground Programmable input/output line UART clear to send active low
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
TM
Confidential Module Preliminary Approval Sheet
2. Specification
2.1 General Specification
No 1 2 3 5 6 7 8 9 10 11 12 13 14 15 16 17 Items Supply Voltage (Regulator In) Supply Voltage (UART, PCM and PIO Interface) Supply Voltage (Core and RF block) Carrier Frequency Modulation Method Maximum Data Rate Maximum number of active slaves Hopping Transmission Power Rx. Sensitivity (BER<0.1%) Baseband Crystal OSC Interfaces Compliant Built in Memory Built in Firmware Masked Firmware Version Specification VDD_REG : 2.2~3.6V VDD_UART : 1.7~3.6V VDD_1.8V : 1.7~1.9V 2400MHz to 2483.5MHz (USA, Europe) GFSK,1Mbps, 0.5BT Gaussian Asynchronous:723.2kbps/57.6kbps Synchronous: 433.9kbps/433.9kbps 7 1600hops/sec, 1MHz channel space Typ 1.0 dBm Typ. -82.0 dBm 26MHz PCM, UART, PIOs Bluetooth Specification v1.2 ROM(4Mbit) Up to HCI HCI 18.4
2.2 Temperature Specification
No 1 2 Item Operating temperature Storage temperature Specification -30 ~ +70C -40 ~ +85C
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
2.3. Tx/Rx Specifications
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Confidential Module Preliminary Approval Sheet
No.
Items
Specification Min. Typ. Max. Unit PART 39ch 78ch
Conditions
TRANSMITTER
Test Channel : 0ch
1 2
TX Output Power TX Frequency Accuracy Tx Frequency Drift
-3.5 -45
1.0 -
3.8 45
dBm kHz
- Conducted - Tested with '01010101' Test Scenario - Tested with '01010101' Test
3
-24
-
24
kHz
Scenario - DH1 packet
140 Tx Frequency 4 Deviation (Test Channel : 39 Only) 120
-
173
kHz
-'00001111' Test Scenario -'01010101' Test Scenario
-
-
kHz
-'01010101' deviation should be greater than 80% of '00001111' deviation
RECEIVER PART Test Channel : All channels hopping - 'ACL Loopback whitened' 5 BER 0.1 % Scenario - RF input : -74 dBm - Freq. Hopping PIO PORT AND AUDIO PART No. Items Decision Conditions
6
PIO Port
PASS, FAIL
- Checked PIO function with GPIB
7
Audio
PASS, FAIL
- Checked audio signal with GPIB
- Requirement - Test equipment should satisfy the specifications required by Bluetooth SIG. - Temperature : normal
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
2.4 Reliability Test Standard
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Confidential Module Preliminary Approval Sheet
Test Item
Reflow
Conditions
step1: 150~170C, 70~175sec step2: 230+/-5C(peak)
Test No.
Test 1
Temperature Drift High Temperature(Storage) Low Temperature(Storage) High Humidity(Storage) High Temperature(Operating) Low Temperature(Operating) High Humidity(Operating) Thermal Shock
25 -> 0 -> -30 -> 50->70C, 2Hr/step 85C, 120Hr -40C, 120Hr 50C, 95% RH, 120Hr 70C, 120Hr (supply operating voltage) -30C, 120Hr (supply operating voltage) 40C, 95%RH, 120Hr (supply operating voltage) -40C/1Hr <-> 85C/1Hr
Test 2 Test 3 Test 4 Test 5 Test 6 Test 7 Test 8 Test 9
(50 cycle) Press Cooker Test 121C, 100%RH, 2kf/cm square, 12Hr Vibration Frequency: 20, 80, 350, 2000Hz Vibration + Temperature & Humidity Cycle Acceleration: 6.98Grms (X,Y,Z - each 50min, 2cycle) -20 ~ 50C, 50 ~ 80%RH, 10 Cycle Acceleration:3000G, Time:0.2ms, Mechanical Shock 5 times at each sides Height: 152cm Drop Test 8 times ESD Test ANT and GND PIN : Contact discharge +/-2kV, 5times(100pF,1.5kohm) Test 14 Test 13 Test 12 Test 11 Test 10
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
2.5 Current Consumption
Test Equipment : Agilent 66319D Test Condition : Temp. = Room temperature Mode wse_0x1 wse_0x2 wse_0x3 inquiry stand_by(Host Connection) stand_by(No Host Connection) Sniff Mode with 1.28s interval as Master Sniff Mode with 1.28s interval as Slave Sniff Mode with 40ms interval as Master Sniff Mode with 40ms interval as Slave Park Mode with 1.28s interval as Slave ACL Connection_Master_No traffic ACL Connection_Slave_No traffic ACL DH1 with CMU200_Loopback ACL DH1 with CMU200_TX Mode ACL DH3 with CMU200_Loopback ACL DH3 with CMU200_TX Mode ACL DH5 with CMU200_Loopback ACL DH5 with CMU200_TX Mode SCO HV1 with CMU200 SCO HV1_No_Codec SCO HV1_Real Connection SCO HV2_No_Codec SCO HV2_Real Connection SCO HV3_No_Codec SCO HV3_Real Connection
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Confidential Module Preliminary Approval Sheet
Interface BCSP, 115.2kbps " " " " " " " " " " " " " " " " " " " " " " " " " "
Average 2.8v 313.09 303.17 609.76 32.47 28.51 8.67 145.90 144.48 6.24 5.95 72.74 6.17 13.29 35.86 33.20 38.52 39.02 38.66 40.94 36.51 31.95 36.60 20.56 24.40 16.07 19.20 1.8v 307.63 288.41 564.13 33.21 20.32 9.00 103.27 106.24 6.32 4.51 61.43 6.96 14.02 36.33 33.81 38.95 39.96 38.92 41.84 37.15 33.35 35.87 21.91 23.61 17.40 17.24
Unit uA uA uA mA uA mA uA uA mA mA uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
TM
Confidential Module Preliminary Approval Sheet
3. Interface
3.1 UART Interface
Four signals are used to implement the UART function. UART_RX and UART_TX transfer data and UART_CTS and UART_RTS can be used to implement RS232 hardware flow control where both are active low indicators. The interface consists of four-line connection as described in below:
Signal name
UART_TX UART_RX UART_RTS UART_CTS
Driving source
BTVZ0502SA module Host BTVZ0502SA module Host
Description
Data from BTVZ0502SA module Data from Host Request to send output of BTVZ0502SA module Clear to send input of BTVZ0502SA module
Host Controller
HOST_RX HOST_TX HOST_CTS HOST_RTS
Bluetooth Module
UART_RX UART_TX UART_CTS UART_RTS
Possible UART Settings Bluetooth Module can handle UART baudrate from 9.6kbps up to 1.5Mbps. User can change data format the following selection using PSKEY. However, host shall communicate with default setting UART connection initiated at first time. Baud Rate = (PSKEY_UART_BAUD_RATE) / (0.004096)
Property BCSP- Specific Hardware Baudrate Flow Control Data bit length Parity Number of Stop Bits
Possible Values Enable or Disable Min 9600 Baud, Max 1.5M Baud RTS/CTS or None 8bit None, Odd or Even 1 or 2
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
Default Data Format Property BCSP- Specific Hardware Baudrate Flow Control Data bit length Parity Number of Stop Bits
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Confidential Module Preliminary Approval Sheet
Possible Values Enable 115.2kbps None 8bit Even 1
3.2 PCM Interface
Bluetooth module offers a bi-directional digital audio interface that routes directly into the baseband layer and does not pass through the HCI protocol layer. It allows the data to be sent to and recevied from a SCO connection. This interface consists of four signals : a clock(PCM_CLK), a data input(PCM_IN), a data output(PCM_OUT), and a frame-synchronization signal(PCM_SYNC) Bluetooth module interfaces directly to PCM audio devices including the following : - Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices - OKI MSM7705 four channel A-law and u-low CODEC - Motorola MC145481 8-bit A-law and u-law CODEC - Motorola MC145483 13-bit linear CODEC
Possible PCM settings Bluetooth module can operate as the PCM interface master generating an output clock of 256kHz. When configured as PCM interface slave it can operate with input clock up to 2048kHz. User can change data format the following selection using PSKEY.
Property Mode Clock rate Clock formats Sample formats
Possible Values Slave, Master Master mode : 128, 256, 512kHz Slave mode : up to 2048kHz Long Frame Sync, Short Frame Sync 13 or 16-bit linear, 8-bit u-law or A-law
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
Default Data Format Property Mode Clock rate Clock formats Sample formats Possible Values Master 256kHz Long Frame Sync 13-bit linear
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Confidential Module Preliminary Approval Sheet
3.3 UART Bypass Mode
- For devices that do not tri-state the UART bus, the UART bypass mode on bluetooth module can be used. - The default state of the module after reset is de-asserted is for the host UART bus to be connected to its UART. - In order to apply the UART bypass mode, a BCCMD command will be issued to the module upon this, it will switch the bypass to PIO(4,5,6,7). Once the bypass mode has been invoked, it will enter the deep sleep state indefinitely. - In order to re-establish communication with the module, it must be reset so that the default configuration takes affect. - It is important for the host to ensure a clean bluetooth disconnection of any active links before the bypass mode is invoked. Therefore it is not possible to have active bluetooth links while operating the bypass mode.
RXD CTS RTS TXD
UART_TX UART_RTS UART_CTS UART_RX
PIO4 PIO5 PIO6 PIO7
TX RTS CTS RX
RESETB
HOST HOST Processor Processor
UART
Another Another Device Device
Bluetooth Module Bluetooth Module
Test Interface Test Interface
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
3.4 Supply Voltage
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Confidential Module Preliminary Approval Sheet
There are three pins for supply voltage; VDD_UART, VDD_REG, VDD_1.8V VDD_UART is D.C Input Voltage for UART, PCM and PIO Interface and covers 1.7V to 3.6V. VDD_REG is D.C Input Voltage for Internal Regulator and covers 2.2V to 3.6V. VDD_1.8V is D.C Input Voltage for the operation of Core and RF block and covers 1.7V to 1.9V. CASE I : The voltage of operation is only 1.8V In this case, VDD_UART and VDD_1.8V need to be connected for correct operation. You must not connect VDD_REG and must maintain OPEN state.
Bluetooth Module
VDD_UART
DC Source (1.8V) N.C.
VDD_1.8V
VDD_REG
CASE I : 1.8V Supply Voltage
CASE II : The voltage of operation is only 2.8V In this case, VDD_UART and VDD_REG need to be connected for correct operation. You must not connect VDD_1.8V and must maintain OPEN state. And for the purpose of stable RF characteristics, the RF choke of 15nH inductor should be connected directly to the VDD_REG pin.
Bluetooth Module
VDD_UART
DC Source (2.8V) N.C.
VDD_1.8V
VDD_REG
15nH
CASE II : 2.8V Supply Voltage
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
TM
Confidential Module Preliminary Approval Sheet
4. Recommended Reflow Temperature Profile
45s
SOLDER ()
Pb_Free( SnAgCu ) PEAK ZONE 262 max. 3s N2
DRY ZONE PREHEAT(SORK) ZONE REFLOW ZONE 150~180 89s BLUETOOTH 220~220 45s
() (min)
** Lead free devices will withstand up to 1 reflow to a maximum temperature of 260
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
TM
Confidential Module Preliminary Approval Sheet
5. Packaging Information
5.1. Carrier dimension
B
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
5.2 Taping Package/Reel dimension
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Confidential Module Preliminary Approval Sheet
B
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
5.3 Packing Box dimension
TM
Confidential Module Preliminary Approval Sheet
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006
Bluetooth
TM
Confidential Module Preliminary Approval Sheet
Status of Approval Sheet
The progression of Samsung Electo-Mechanics BluetoothTM Module Approval Sheet follows the following format.
Preliminary Approval Sheet
All detailed specifications may be changed by Samsung Electro-Mechanics without notice. Version of Approval sheet may be upgraded without any prior notice.
Production Approval Sheet
Final Approval sheet.
The status of this Approval sheet is Preliminary Approval Sheet.
BluetoothTM Module BTVZ0502SA Preliminary Approval Sheet
Revision 1.0 April 2006
Copyright 2004 Samsung Electro-Mechanics Co.,LTD. ALL DETAILED SPECIFICATIONS MAY BE CHANGED BY SAMSUNG-EM WITHOUT NOTICE. REV 1.0 April 2006

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