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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
BIPOLAR TYPE LED LAMPS
Pb
Lead-Free Parts
LHRFUG3362/H26-PF/TRS-13
DATA SHEET
DOC. NO : REV. DATE :
QW0905- LHRFUG3362/H26-PF/TRS-13-0808 A
: 19 - Aug. - 2009
DCC
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFUG3362/H26-PF/TRS-13 Page 1/7
Package Dimensions
P2
G H
H2 H1 L W0
W2
W1 W3
D
21 P1 F P
HRF
UG
T
2
1
LHRFUG3362/H26-PF
5.0 5.9
7.6
8.6
1.5MAX HRF
1/4
0.5 TYP
25.0MIN UG 1 2
1.0MIN 2.54TYP 12 Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFUG3362/H26-PF/TRS-13 Page 2/7
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol RED Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Electrostatic Discharge( * ) Reverse Current @5V Operating Temperature Storage Temperature IF IFP PD ESD Ir Topr Tstg 25 75 65 2000 10 -40 ~ +85 -40 ~ +100 GREEN 25 75 65 mA mA mW V UNIT
g A J J
Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 J)
PART NO
COLOR
MATERIAL
Emitted AlGaInP Red
LHRFUG3362/H26-PF/TRS-13
Lens
Luminous Forward Viewing Dominant Spectral intensity voltage angle wave halfwidth @20mA(V) @20mA(mcd) 2c 1/2 length f nm (deg) f Dnm Min. Max. Min. Typ. 630 20 20 1.5 1.7 2.4 2.6 120 38 220 65 60 60
White Diffused
AlGaInP Green
574
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFUG3362/H26-PF/TRS-13 E Dimensions Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
------------------ -------------------------
Page 3/7
Minimum mm inch
0.15 0.09
-------------------------------------------------------
Maximum mm
4.2 3.0 2.0
-------------------------------------------------
inch
0.17 0.12 0.08
-------------------------------------------------
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F H
3.8 2.3
-------------------------------
Feed Hole To Bottom Of Component
-------------------------
H1
-------------------------
TRS-13
-------
18.0
-------
0.71
-------------
19.0
-------
0.75
-------
Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
-------------------------------------------------------------
H2 L P P1 P2 T W0 W1 W2 W3
-------
36 11.0
1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75
W0 12.4 4.4 5.1
-------
0.49 0.17 0.2
-------
13.0 5.8 7.7 1.42 9.75 15.5 4.0 19.0
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TRS=Tape And Reel Straight Leads
E Dimensions Symbol Information
Specification Description Symbol minimum mm
Reel Diameter Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Overall Reel Thickness Iside Reel Flange Thickness
E Package Dimensions
maxmum D3 mm 380 102 88.0 38.1 57.2 inch 14.96 4.02 3.46 1.5 2.25 1.97 T1 T2 D MARKING D2 D1
inch 3.08 1.37 1.13 0.54
D D1 D2 D3 T2 T1
78.2 34.9 28.6 13.8
30.0
1.18 1000PCS
50.0
Quantity/Reel
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFUG3362/H26-PF/TRS-13 Page 4/7
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
60
2.0
Forward Current(mA)
40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0
Relative Intensity Normalize @20mA
50
1.0
0.0 1.0 10 100 1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA Normalize @25J
Forward Voltage@20mA Normalize @25J
1.2 1.1 1.0 0.9
2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80
0.8 -20 0 20 40 60 80
Ambient Temperature(J)
Ambient Temperature(J)
Fig.5 Relative Intensity vs. Wavelength
1.0
Fig.6 Directivity Radiation
Relative Intensity@20mA
-30X
0X 30X
0.5
-60 X
X 60
0.0 550 600 650 700
100X 75X 50X 25X 0
25X 50X 75X 100X
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFUG3362/H26-PF/TRS-13 Page 5/7
Typical Electro-Optical Characteristics Curve
UG CHIP
Fig.1 Forward current vs. Forward Voltage
60
Fig.2 Relative Intensity vs. Forward Current
2.0
Forward Current(mA)
50 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0
Relative Intensity Normalize @20mA
1.0
0 1.0 10 100 1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80
Relative Intensity @20mA Normalize @25J
Forward Voltage@20mA Normaliz @25J
2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80
Ambient Temperature(J)
Ambient Temperature(J)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
Relative Intensity @20mA
1.0
-30X
0X 30X
0.5
-60 X
X 60
0 500 550 600 650
100X 75X 50X 25X 0
25X 50X 75X 100X
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFUG3362/H26-PF/TRS-13 Page 6/7
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max C Temperature 350XMax Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile Dip Soldering C Preheat: 120XMax Preheat time: 120seconds Max Ramp-up C/sec(max) 2X C/sec(max) Ramp-Down:-5X C Solder Bath:260XMax Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case)
Temp(X C) 260X C3sec Max
260X
5X /sec max
120X
2X /sec max Preheat
25X 0X 0
100
200
250
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHRFUG3362/H26-PF/TRS-13 Page 7/7
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65JO 5J 2.RH=90 %~95 % 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 J O 5J&-40JO 5J (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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