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Table S3. Electrical Characteristics for Surface-mount Devices continued
Part Number miniSMD continued Size 4532 mm/1812 mils MINISMDM200F* miniSMDC260 miniSMDM260 miniSMDM260F* miniSMDE Size 11550 mm/4420 mils miniSMDE190 midSMD Size 5050 mm/2018 mils SMD030-2018 SMD050-2018 SMD100-2018 SMD150-2018 SMD200-2018 SMD Size 7555 mm/2920 mils SMD030 SMD050 SMD075 SMD075F* SMD100 SMD100/33 SMD125 SMD260 SMD260-RB SMD300 SMD2 Size 8763 mm/3425 mils SMD150 SMD150/33 SMDH160 SMD185 SMD200 SMD250 Telecom Surface-mount** TSL250-080 TS250-130 TSV250-130 TS600-170 TS600-200-RA TSM600-250 TSM600-250-RA IH (A) IT (A) VMAX (VDC) IMAX (A) PD TYP (W) Max. Time-to-Trip (A) (s) RMIN () RTYP () R1 MAX () Figures for Dimensions
2.00 2.60 2.60 2.60
3.50 5.00 4.55 4.55
8 6 6 6
40 40 40 40
0.6 0.6 0.6 0.6
8.0 8.0 8.0 8.0
3.00 7.00 6.00 6.00
0.020 0.015 0.010 0.010
0.040 0.035 0.030 0.030
0.060 0.047 0.043 0.043
S5 S3 S5 S5
1.90
3.80
16
100
1.4
10
2.0
0.024
0.065
0.080
S3
0.30 0.55 1.10 1.50 2.00
0.80 1.20 2.20 3.00 4.20
60 57 15 15 6
20 10 40 40 40
0.7 1.0 1.2 1.4 1.4
1.5 2.5 8.0 8.0 8.0
1.5 5.0 0.5 1.0 3.0
0.500 0.200 0.100 0.070 0.048
1.40 -- 0.25 0.13 0.07
2.300 1.000 0.400 0.180 0.100
S6 S6 S6 S6 S6
4
0.30 0.50 0.75 0.75 1.10 1.10 1.25 2.60 2.60 3.00
0.60 1.00 1.50 1.50 2.20 2.20 2.50 5.20 5.00 6.00
60 60 30 30 30 33 15 6 6 6
10 10 40 40 40 40 40 40 40 40
1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.3
1.5 2.5 8.0 8.0 8.0 8.0 8.0 8.0 5.0 8.0
3.0 4.0 0.3 0.3 0.5 0.5 2.0 20.0 60.0 35.0
1.200 0.350 0.350 0.350 0.120 0.120 0.070 0.025 0.030 0.015
3.00 0.87 0.67 0.67 0.30 0.27 0.16 0.05 0.055 0.033
4.800 1.400 1.000 1.000 0.480 0.410 0.250 0.075 0.075 0.048
S7 S7 S7 S7 S7 S7 S7 S7 S7 S7
1.50 1.50 1.60 1.80 2.00 2.50 0.08 0.13 0.13 0.17 0.20 0.25 0.25
3.00 3.00 3.20 3.60 4.00 5.00 0.16 0.26 0.26 0.40 0.40 0.86 0.86
15 33 16 33 15 15 250*** 250*** 650 250*** 600*** 600*** 600*** 600***
40 40 70 40 40 40 3.0 3.0 1.1 3.0 3.0 3.0 3.0 3.0
1.7 1.7 2.1 1.2 1.7 1.7 1.2 1.1 1.5 2.5 2.5 2.0 2.0
8.0 8.0 8.0 8.0 8.0 8.0 1.0 1.0 1.0 1.0 1.0 3.0 3.0
5.0 5.0 15.0 5.0 12.0 25.0 1.8 2.5 3.0 21.0 21.0 6.0 6.0
0.060 0.080 0.050 0.065 0.050 0.035 5.0 6.5 4.0 4.0 4.0 1.0 1.0
0.16 0.15 0.10 0.12 0.09 0.06 11.0 12.0 7.0 9.0 7.5 3.5 3.0
0.250 0.230 0.150 0.165**** 0.125 0.085 20.0**** 20.0 12.0**** 18.0 13.5 7.0 5.0
S7 S7 S7 S7 S7 S7 S7 S8 S10 S9 S9 -- --
*F: lead-free device Electrical characteristics determined at 25C. **These products are intended for telecom applications. Time-to-trip is typical, please see Telecom and Networking section for details. ***RMS max. voltage. ****R1 MAX is measured one hour post-trip or 24 hours post-reflow at 20C. IH = Hold current: maximum current device will pass without interruption in 20C still air. IT = Trip current: minimum current that will switch the device from low resistance to high resistance in 20C still air. VMAX = Maximum voltage device can withstand without damage at rated current. IMAX = Maximum fault current device can withstand without damage at rated voltage. PD = Power dissipated from device when in the tripped state in 20C still air. R1 MAX is measured one hour post reflow. RTYP = Typical resistance of device as supplied at 20C unless otherwise specified.
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