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 1/4 Structure Product Name Silicon monolithic integrated circuit PCM CODEC IC
Product No.
Physical dimentions Features
BU8925MUV
Figure1 (VQFN032V5050) * 16bit Linear */A-Law codec * Built-in PLL circuit for system clock generation * Support for below frequency about PCM data transmission clock. /A-Law Linear 64kHz - 2048 kHz 128 kHz - 2048 kHz
* Built-in Output amplifier for line drives (600) * Power down control using NRST pin Absolute Maximum Ratings Parameter Digital supply voltage Analog supply voltage Input voltage for digital terminal Input voltage for analog terminal Input current Power dissipation *1 Storage temperature range Symbol Rating Unit
(*1) Note: Reduce to mW/ when Ta = 25 or above Recommended Operating Power Supply Voltage and temperature Range Parameter Digital supply voltage Analog supply voltage Operating temperature range
Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority.
Symbol opr
Min
Rating Typ -
Max
Unit
This product is not designed to protect itself against radioactive rays.
REV. A
2/4
Electrical Characteristics Specified Value Typ
Unless otherwise noted, Ta = 25, AVDD=2.8, DVDD=1.8V, FSYNC=8kHz, DCLK=256kHz. Parameter Current consumption Standby current consumption Full Operation DC Characteristics Digital H level input voltage Digital L level input voltage Digital H level input current Digital L level input current Digital H level output voltage Digital L level output voltage VIH VIL IIH IIL VOH VOL DVDD0.75
NRST=DVSS and
Symbol
Min
Max
Unit
Condition
IDD1 IDD2
-
0.1 2.5
3.0 3.8 4.5 DVDD0.25 1 -1 DVDD0.2
uA
FSYNC,DCLK=DVSS
mA uA uA
NRST,BST=DVDD and No input signal
-0.3 DVDD0.8
-
VIH=DVDD VIL=DVSS IOH= -1mA IOL= 1mA
Unless otherwise noted, Ta=25C, AVDD=2.8, 1.8, FSYNC=8kHz, DCLK=256kHz and linear mode. Parameter Transmit signal-to-distortion ratio (AUX1INPCMOUT) Receive signal-to-distortion ratio (PCMINAUDOUT) Transmit Gain Tracking (1) Receive Gain Tracking (PCMINAUDOUT) Transmit reference level Receive reference level 1020HzReference level=-100 3 1020HzReference level=-100 1020Hz0dBm0 1020Hz0dBm0 1020Hz 2 symbol Condition 0dBm0 1020Hz 2,3 -30dBm0 -40dBm0 -45dBm0 0dBm0 -30dBm0 -40dBm0 -45dBm0 +3.00.5dBm0 +0.5-40dBm0 -40-50dBm0 -50-55dBm0 +3.0-40dBm0 -40-50dBm0 -50-55dBm0
AUX1INPCMOUT PCMINAUDOUT
Specified Value Min 45 35 29 24 45 35 29 24 -3.0 -1.0 -2.0 -2.0 -1.0 -2.0 -2.0 0.375 0.400 24 0 -0.3 -0.3 -0.3 0 6.5 24 0 -0.3 -0.3 -0.3 0 6.5 Typ 0.500 0.475 Max 3.0 1.0 2.0 2.0 1.0 2.0 2.0 0.667 0.564 2.5 0.5 0.3 0.9 2.5 0.3 0.5 0.9 -76 -85
Unit

0.06kHz Transmit Gain Loss relative to Frequency (AUX1INPCMOUT) 0.2kHz 0.30.4kHz 1020Hz 0.43.0kHz 3.4kHz 3.6kHz 3.78kHz 0.06kHz 0.2kHz 0.32.8kHz 1020Hz 2.83.0kHz 3.4kHz 3.6kHz 3.78kHz AUX1IN= AGND level. 2 PCMIN="L", Using A-Weight filter.
Receive Gain Loss relative to Frequency (PCMINAUDOUT)
Transmit noise level Receive noise level 2 Using C-MESSAGE filter
VNTX VNRX
dBV dBV
3 Specified that 0dBm0 is 0.5Vrms.
REV. A
3/4
Physical dimentions (Figure1)
Pin assignment Pin No 1 Pin name NC DVSS DVDD BST NRST DSEL FRM2 TEST FRM1 NC NC NC NC NC NC NC Pin No 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Pin name AUX1IN AVSS AVDD AUDOUT AVDD AVSS BGFLT NC AGND VREF PLLCAP PCMSEL FSYNC DCLK PCMIN PCMOUT
BU8925
2 3 4 5
LOT No
6 7 8 9 10 11 12 13 14 15 16
Power down control using only NRST pin. NRST = L : Power down mode NRST = H : Active mode
VQFN032V5050 Unit: mm Block diagram (Figure2)
BGFLT (23) AVDD (19,21)
NC : This pin is not connected with internal.
DVDD (3) NRST (5) BST (4)
BIAS
AUX1IN (17)
AAF S to D
ADC
BPF
PCM P to S
PCMOUT (32)
FSYNC (29) VREF (26) System clock AGND (25) PLL
DCLK (30) PLLCAP (27)
+
AUDOUT (20)
+
SMF D to S
DAC
BPF
PCM S to P
PCMIN (31)
TEST (8)
PCMSEL DSEL FRM1 FRM2 AVSS (28) (6) (9) (7) (18,22)
DVSS (2)
: Pin NO
REV. A
4/4
Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC's power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9)Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Others In case of use this LSI, please peruse some other detail documents, we called ,Technical note, Functinal description, Application note.
REV. A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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