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SPECIFICATION
PART NO. : MT5300-BLS 5.0mm ROUND LED LAMP
ATTENTION
OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES
MT5300-BLS
Description
5.0 mm ROUND LED LAMP
This blue lamp is made with InGaN/Sapphire chip and water clear epoxy resin.
0.5 MAX.
4.0 1.2 1.5 TYP. K
A
Notes: 1. All dimensions are in mm. 2. Tolerance is 0.25mm unless otherwise noted.
Description
LED Chip
Part No. Material MT5300-BLS InGaN/Sapphire Emitting Color Blue
24.0 MIN.
1.0
8.6
5.6
Lens Color
Water clear
VER.: 01 Date: 2007/03/22 Page: 1/5
MT5300-BLS
Absolute Maximum Ratings at Ta=25
Parameter
Power Dissipation Reverse Voltage D.C. Forward Current Reverse (Leakage) Current Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature(1.6mm from body) Electrostatic discharge
5.0 mm ROUND LED LAMP
Symbol
PD VR If Ir If(Peak) Topr. Tstg. Tsol. ESD.
Rating
100 5 25 50 100 -40 to +95 -40 to +100 Dip Soldering : 260 Hand Soldering : 350 6000
Unit
mW V mA A mA
for 5 sec. for 3 sec. V
Electrical and Optical Characteristics:
Parameter
Luminous Intensity Forward Voltage Dominant Wavelength Reverse (Leakage) Current Viewing Angle Spectrum Line Halfwidth 2
Symbol
IV Vf d Ir 1/2
Condition
If=20mA If=20mA If=20mA Vr=5V If=20mA If=20mA
Min.
1100
Typ.
1800 3.2
Max.
Unit
mcd
4.0 480 50
V nm A deg nm
465
470
30 26
Notes:
The datas tested by IS tester. 2. Customer's special requirements are also welcome.
VER.: 01 Date: 2007/03/22 Page: 2/5
MT5300-BLS
5.0 mm ROUND LED LAMP
Typical Electrical / Optical Characteristics Curves :
Relative Luminous Intensity(mcd)
2.4 2.8 3.2 3.6 4.0
50 40 30 20 10
2500 2000 1500 1000 500
Forward Current IF(mA)
2.0
0.0
10.0
20.0
30.0
Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE
Forward Current (mA)
FORWARD CURRENT VS. LUMINOUS INTENSITY
50 40
0
10
20 30
Forward Current IF(mA)
40
30
1.0
20 10
R j-a=510
/W
0.9 0.8
50 60 70 80 90 0.5 0.3 0.1 0.2 0.4 0.6
0.7
0 20 40 60 Temperature ( ) 80 100
FORWARD CURRENT VS. AMBIENT TEMPERATURE
RADIATION DIAGRAM
VER.: 01 Date: 2007/03/22 Page: 3/5
MT5300-BLS
Specifications for Bin Grading: Iv(mcd) BIN T U V MIN. 1100 1520 2130
5.0 mm ROUND LED LAMP
MAX. 1520 2130 3000
Specifications for Vf Group: Vf(V) Group V6 V7 V8 V9 V10 V11 V12 MIN. 2.6 2.8 3.0 3.2 3.4 3.6 3.8 MAX. 2.8 3.0 3.2 3.4 3.6 3.8 4.0
*Majority VF bins are highlighted in Yellow.
Specifications for Wavelength Group: D(nm) @20mA Group X4 X5 X6 MIN. 465 470 475 MAX. 470 475 480
VER.: 01 Date: 2007/03/22 Page: 4/5
MT5300-BLS
5.0 mm ROUND LED LAMP
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 . At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) (2) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. Dip soldering : Pre-heat: 90 (3) 3. 4. max. (Backside of PCB), Within 60 seconds. (Solder temperature), Within 5 seconds. max. (Temperature of soldering iron tip), Within 3 seconds. Solder bath: 260 5 Hand soldering: 350
Insertion Pitch of the LED leads and pitch of mounting holes need to be same. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature.
VER.: 01 Date: 2007/03/22 Page: 5/5

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