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| GaAs PIN Diode Chips RoHS Compliant Features Rev. V1 May Be Directly Driven By TTL Signals RoHS Compliant Low Series Resistance Fast Switching Speed No Reverse Bias Required Description Anode Gallium Arsenide PIN diodes offer improved performance characteristics over silicon in many microwave semiconductor applications These benefits result from the intrinsic semiconductor properties of GaAs. Its inherent high carrier mobility results in a low resistance fast switching device. The low carrier concentration in the I region layer produces a near zero punch through bias voltage. Gallium Arsenide's high band gap also assures it will operate at high operating temperatures. Switching speeds in the low nanosecond range using an inexpensive TTL buffer logic is attainable with GaAs PIN diodes. This performance can be achieved because GaAs PIN diodes exhibit high impedance at a positive bias (up to .5V). Reverse bias is not required for many GaAs PIN diode applications. Low loss, in switch and phase shifter circuits at frequencies up to 40 GHz is possible as a result of low parasitic series resistance in the conducting and non-conducting states. M/A-COM's GaAs PIN diode chips are also available in several different package styles. See page 4 Full Area Cathode MIL-STD 750 Environmental Ratings Parameter Temp. Cycling Vibration Constant Acceleration Moisture Resistance (Packaged diodes) Method 1051 2056 2006 Level 5cycles -65C to +150C 15g's 20,000g"s Absolute Maximum Ratings1 Parameter Operating Temperature Storage Temperature Power Dissipation Junction Temperature Mounting Temperature 1 Maximum Value -65C to +175C -65C to +175C 0.25W @ 25C +175C +320C for 10 seconds 1021 10 Days 1. Exceeding these limits may cause permanent damage. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. GaAs PIN Diode Chips RoHS Compliant GaAs Chip Specification @ TAMB = +25C Rev. V1 Nominal Characteristics Part Number Max. Rev. Volt.1 VR < 10 A VDC MA4GP022-277 MA4GP030-277 50 100 Max. Cap. 1 MHz Cj @ -10 V pF 0.15 0.06 Max. Series Res. 1 GHz RS @ 20 mA 1.0 2.0 2 Carrier Lifetime Switching Speed 3 TL @ IFOR = 10 mA 7 GHz IREV = 6 mA S 5 10 S 15 25 Notes: 1. VR ( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10A. 2. Chip is mounted into case style ODS 30 ceramic package. 3. Switching speed is measured between 1 dB and 20 dB loss in a shunt mounted switch Case Style 277 (Chip) A B Typical TTL Driver Circuit B C Anode Dimension A B C 2 Mils 7 .5 11 1 2.2 .3 Millimeters .178 .013 .279 .025 .056 .008 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. GaAs PIN Diode Chips RoHS Compliant Typical Performance @ TAMB = +25C Rev. V1 MA4GP022 MA4GP030 Figure 3. Typical Capacitance vs. Voltage at 1 GHz 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. GaAs PIN Diode Chips RoHS Compliant Ordering Information The GaAs Chip specifications shown in the table on page 2 are for the stand alone die, package style 277. Note that the table lists the bare die junction capacitance and that the total capacitance for the base part in an alternative package will differ. The total capacitance in an alternative package can be computed by adding the capacitance shown in the table on page 2 to the parasitic capacitance of the alternative package as defined in the Package Parasitic Capacitance table below. The base part numbers are only available in the case styles shown in the Package Availability Table below. To order, indicate the base part number followed by a dash and the desired package style. For example: The MA4GP030-30 is the MA4GP030 chip in the 30 style package. Rev. V1 Package Parasitic Capacitance Package Style 30 120 137 276 277 1056 Inductance (nH) 0.40 0.40 0.40 0.40 N/A (Chip) 0.20 Cap. (pF) 0.18 0.13 0.13 0.13 N/A (Chip) 0.20 Dimension A B Style 120 B A Package Availability Table Base Part Number MA4GP022 MA4GP030 Available Package Styles 137, 277 30, 120, 276, 277, 1056 Mils 53 2 45 5 Millimeters 1346 51 1143 127 Style 30 B F G C D C B Style 137 A Cathode E E D H A G Dimension Millimeters 3073 102 1575 51 5461 254 2311 152 1575 51 1575 51 508 102 2057 51 A B C D E F G Mils 100 10 20 2 100 5 41 50 max. 14 max. Millimeters 2540 254 508 51 2540 127 102 25 1270 max. 356 max. Dimension A B C D E F G H Mils 121 4 62 2 215 10 91 6 62 2 62 2 20 4 81 2 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. GaAs PIN Diode Chips RoHS Compliant Package Styles Rev. V1 Style 137 C B A Style 1056 Cathode A A E D Cathode F Dimension A B C D E F Mils 100 10 20 2 100 5 41 50 max. 14 max. Millimeters 2540 254 508 51 2540 127 102 25 1270 max. 356 max. C E F D B Dimension Mils 70 5 37 4 33 3 15 2 12 2 48 5 Millimeters 1778 127 940 102 838 76 381 51 305 51 1219 127 Style 276 A B C D A B C D E F F E Dimension A B C D E F Mils 15 5 45 5 5 max. 53 2 200 min. 20 1 Millimeters 381 127 1143 127 127 max. 1346 51 5080 min. 508 25 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. GaAs PIN Diode Chips RoHS Compliant Rev. V1 Die Handling and Mounting Information Handling: All semiconductor chips should be handled with care to avoid damage or contamination from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform or electrically conductive silver epoxy. The metal RF and D.C. ground plane mounting surface must be free of contamination and should have a surface flatness of < 0.002". Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is recommended. When hot forming gas is applied, the work area temperature should be approximately 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 10 seconds. Eutectic Die Attachment Using Reflow Oven: See Application Note M541, "Bonding and Handling Procedures for Chip Diode Devices" at www.macom.com for recommended time-temperature profile. Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive, silver epoxy, approximately 1-2 mils in thickness, should be used to minimize ohmic and thermal resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to ensure full area coverage. Cure conductive epoxy per manufacturer's schedule. Typically 150C for 1 hour. Wire and Ribbon Bonding: It is recommended that thermo-compression or thermo-sonic bonding be used with little or no ultrasonics. The bonding tool and wire or ribbon used should be smaller than the anode contact diameter. A bonder heat stage temperature setting of 200oC, tool tip temperature of 150C and a force of 18 to 50 grams is suggested. If ultrasonic scrubbing is necessary it should be adjusted to the minimum required to achieve a good bond. Excessive energy may cause the anode metallization to separate from the chip. For more detailed handling and assembly instructions, see Application Note M541, "Bonding and Handling Procedures for Chip Diode Devices" at www.macom.com. 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. |
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