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| Surface Mount PPTC FSMD1206 Series FEATURES *1206 size, Surface mount *Application: All high-density boards *Maximum Voltage: 8V ~ 60V *Temperature Range: -40C to 85C *RoHS Compliant RoHS u AGENCY RECOGNITION *UL (E211981) *C-UL (E211981) *TUV (R50090556) ELECTRICAL CHARACTERISTICS (23C) Part Number FSMD005-1206 FSMD010-1206 FSMD020-1206 FSMD035-1206 FSMD050-1206 Hold Current IH, A 0.05 0.10 0.20 0.35 0.50 Trip Current IT, A 0.15 0.25 0.40 0.75 1.00 Rated Voltage VMAX, Vdc 60 60 30 16 8 Maximum Current IMAX, A 10 10 10 40 40 Typical Power Pd, W 0.4 0.4 0.4 0.4 0.4 Max Time to Trip Current Amp 0.25 0.50 8.0 8.0 8.0 Time Sec 1.50 1.00 0.05 0.10 0.10 Resistance Tolerance RMIN R1MAX OHMS 3.60 1.60 0.60 0.30 0.15 OHMS 50.00 15.00 2.50 1.20 0.70 *Devices with hold current up to 1.5amps are in development IH=Hold current-maximum current at which the device will not trip at 23C still air. IT=Trip current-maximum current at which the device will always trip at 23C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23C still air environment. R MIN=Minimum device resistance at 23C prior to tripping. R1MAX=Maximum device resistance at 23C measured 1 hour post trip. Termination pad characteristics Termination pad materials: Tin-plated copper FSMD1206 PRODUCT DIMENSIONS (MILLIMETERS) D B A Top and bottom view Side view C Part Number FSMD005-1206 FSMD010-1206 FSMD020-1206 FSMD035-1206 FSMD050-1206 Min 3.0 3.0 3.0 3.0 3.0 A Max 3.5 3.5 3.5 3.5 3.5 Min 1.5 1.5 1.5 1.5 1.5 B Max 1.8 1.8 1.8 1.8 1.8 Min C Max 0.45 0.75 0.45 0.75 0.45 0.75 0.45 0.75 0.25 0.55 D Min 0.10 0.10 0.10 0.10 0.10 RFE International * Tel:(949) 833-1988 * Fax:(949) 833-1788 * E-Mail Sales@rfeinc.com C5ED01 REV 2007.8.14 Surface Mount PPTC FSMD1206 Series THERMAL DERATING CURVE Thermal Derat ing Curve, FSMD1206 Series 200% RoHS u Percent of Rated Hold and Trip Current 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Tempera ture (C) TYPICAL TIME-TO-TRIP AT 23C A 100 Time-to-trip (S) 10 1 Z 0.1 0.01 0.001 0.1 B CD Z A B C D 1 Fault current (A) 10 100 = = = = = FSMD005-1206 FSMD010-1206 FSMD020-1206 FSMD035-1206 FSMD050-1206 PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimension in the table below provide the recommended pad layout for each FSMD1206 device NOMINAL PAD DIMENSIONS (MILLIMETERS) SOLDER REFLOW 20 to 40 Seconds 260 C 1.9 217 C f Ramp-up 3C/Second Max Ramp-down 6C/Second Max 200 C 150 C Preheat 1.0 2.0 1.0 25 C 60 to 180 Seconds 60 to 150 Seconds Solder Reflow Due to "Lead Free" nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only) 3. Recommended maximum paste thickness is 0.25mm. 4. Devices can be cleaned by using standard industry methods and solvents. 5. Storage Environment: <30C / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet performance requirements. Rework: Use standard industry practices. NOTE: All Specification subject to change without notice. RFE International * Tel:(949) 833-1988 * Fax:(949) 833-1788 * E-Mail Sales@rfeinc.com C5ED01 REV 2007.8.14 |
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