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XC2401A8167R-G 1.6 GHz Low Noise Amplifier ETR2701-004 GENERAL DESCRIPTION The XC2401A8167R-G is an ultra-low-noise amplifier (LNA) with low operating voltage, low nose figure (NF), low power consumption using CMOS process. The device offers easy output matching to 50 for input and output with less external components. An internal self bias function eliminates external bias setting. The device operates at 1.2V. For higher power supplies such as 1.8V and 2.85V, the device can operate with a self bias of one adding resister. . APPLICATIONS GPS RF module FEATURES Noise Figure Low Power Consumption High Gain Operation Voltage Range Output Operating Temperature Range Ultra Small Package Environmentally Friendly NF=0.69dB(TYP.) (@ 1.575GHz) 6.6mW (TYP.) @ VDD=1.2V, Fixed Bias S21 =15dB(TYP.) (@ 1.575GHz) 1.14V 1.26V @ Fixed Bias CMOS Output, 50 driver built-in -40 +85 USPN-4B02 EU RoHS Compliant, Pb Free TYPICAL APPLICATION CIRCUIT Figure 1: Fixed Bias TYPICAL PERFORMANCE CHARACTERISTICS XC2401A816 17.0 16.0 15.0 S21 [dB] 14.0 13.0 12.0 11.0 10.0 1.375 VDD =1.2V Ta=25 2.8 2.4 2 NF [dB] 1.6 1.2 0.8 0.4 Figure 2: Self Bias 1.475 1.575 Frequency [GHz] 1.675 0 1.775 VIN [V] 3.00 2.85 1.80 * RBIAS should be in Rbias [] 560 470 160 1% tolerance and 200ppm/ temperature stability. 1/16 XC2401A8167R-G PIN CONFIGURATION USPN-4B02 BOTTOM VIEW PIN ASSIGNMENT PIN NUMBER USPN-4B02 1 2 3 4 PIN NAME VDD RF_OUT VSS RF_IN FUNCTION Power Supply RF RF Signal Output Ground RF Signal Input PRODUCT CLASSIFICATION Ordering Information PRODUCT NAME XC2401A8167R-G (*1) *1 PACKAGE USPN-4B02 ORDER UNIT 5,000/Reel The "-G" suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. 2/16 XC2401A8167R-G BLOCK DIAGRAM ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage Supply Circuit RF Input Power RF_IN Input Voltage RF_OUT Input Voltage Power Dissipation Operating Temperature Range Storage Temperature Range SYMBOL VDD IDD PIN RF_IN RF_OUT Pd Topr Tstg RATINGS 1.60 VSS - 0.3 30 10 VDD + 0.3 VSS - 0.3 VDD + 0.3 VSS - 0.3 100 -40 +85 -55 +125 Ta=25 UNITS V mA dBm V V mW o C o C 3/16 XC2401A8167R-G ELECTRICAL CHARACTERISTICS DC Characteristics Fixed Bias (refer to TYPICAL APPLICATION CIRCUIT, Figure 1) PARAMETER Power Supply Pin Voltage Current Circuit SYMBOL VDD IDD CONDITIONS VDD=1.2V MIN. 1.14 TYP. 1.20 5.5 MAX. 1.26 10.5 UNITS V mA Ta=25 CIRCUIT Self Bias (refer to TYPICAL APPLICATION CIRCUIT, Figure 2) PARAMETER Input Power Supply Voltage 1 Input Power Supply Voltage 2 Input Power Supply Voltage 3 Power Supply Pin Voltage Current Circuit SYMBOL VIN1 VIN2 VIN3 VDD IDD CONDITIONS Rbias=560 1 200ppm/ Rbias=470 1, 200ppm/ Rbias=160 1, 200ppm/ VIN = VIN1, VIN2, VIN3 VIN = VIN1, VIN2, VIN3 MIN. 2.850 2.708 1.710 0.90 TYP. 3.000 2.850 1.800 1.12 4.25 MAX. 3.150 2.992 1.890 1.32 5.50 UNITS V V V V mA CIRCUIT * When the device is used in self bias, please use the specified RBIAS and CBIAS. 4/16 XC2401A8167R-G ELECTRICAL CHARACTERISTICS (Continued) AC Characteristics PARAMETER Power Gain Input Return Loss Output Return Loss Isolation Noise Figure (*1) Input Power IP3 Input Power @ 1dB Gain Compression SYMBOL S21 S11 S22 S12 NF IIP3 P1dB CONDITIONS f=1.575 GHz f=1.575GHz f=1.575GHz f=1.575GHz f=1.575GHz f=1.575GHz, 1.576GHz Pin = -30dBm f=1.575GHz MIN. 11.5 TYP. 15.0 6 6 -20 0.69 -1.0 -12 MAX. VDD=1.2V UNITS dB dB dB dB dB dBm dBm Ta=25 CIRCUIT *1: NF is the value excluding the PCB loss. Note 1. In case symptoms of transient voltage drop and rise temporarily, please use this IC within the stated maximum ratings. The IC is liable to malfunction should the ratings be exceeded. 2. Please eliminate static electricity from the operational table, people, and soldering iron. 3. Please use noiseless power supply for stable operation. 4. Please use 1% Rbias with 200ppm/ temperature stability and 10nF Cbias. 5. Please connect Cbias to VDD pin as close as possible. 6. Please ensure to use an external component which does not depend on bias or temperature too much. 7. We will improve the product quality and improve reliability, however please make sure to design fail safe or pre-aging treatment on the system. 5/16 XC2401A8167R-G TEST CIRCUITS Circuit (DC Characteristics: Power Supply Pin Voltage, Circuit Current, Input Power Supply Voltage) * Fixed Bias: Rbias=0, VIN=VDD ** Pin / Pout is 50 Circuit (Power Gain, Input Return Loss, Output Return Loss, Isolation, Input Power @ 1dB Gain Compression) *1: Refer to the circuit for the block detail. Circuit (Noise Figure) *1: Refer to the circuit for the block detail. 6/16 XC2401A8167R-G TEST CIRCUITS (Continued) Circuit (Input Power IIP3) *1: Refer to the circuit for the block detail. Circuit (XC2401 series, the circuit of the block) 100pF RF_IN RF_OUT Rbias VDD VSS VIN Cbias=10nF VIN(V) 3.00 2.85 1.80 Rbias( 560 470 160 ) * ** Fixed Bias: Rbias=0, VIN=VDD Rbias: Should be in 1% tolerance and 200ppm/ temperature stability. 7/16 XC2401A8167R-G EVALUATION BOARD 18mm VDD VSS R1 C2 Pout C1 L2 L1 Pin 20mm SYMBOL C1 C2 L1 L2 R1 (Rbias) (*1) SPEC 100pF 10nF 9.1nH 6.2nH (*1) COMMENT MURATA (GRM1552C1H) TDK (GLQ1005type) TDK ( GLQ1005type) Less than Less than 200ppm/ 1% tolerance, temperature stability PCB(FR-4) MICROSTRIPLINE WIDTH = 0.6mm t = 0.018mm PCB size = 20mm 18mm *1: Fixed Bias: Rbias=0 * Please use an external component which does not depend on bias or temperature too much. 8/16 XC2401A8167R-G TYPICAL PERFORMANCE CHARACTERISTICS (1) Supply Circuit vs. Supply Voltage XC2401A816 Ta=25 (2) Power Gain vs. Supply Voltage XC2401A816 Ta=25Pin=-35dBm 12.0 Supply Current: IDD (mA) Power Gian S21(dB) 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply V oltage: V DD(V ) 10.0 8.0 6.0 4.0 2.0 0.0 16.5 16.0 15.5 15.0 14.5 14.0 13.5 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply V oltage: V DD(V ) (3) Input Return Loss vs. Supply Voltage XC2401A816 Ta=25Pin=-35dBm (4) Output Return Loss vs. Supply Voltage XC2401A816 Ta=25Pin=-35dBm -5.0 -5.5 -6.0 -6.5 -7.0 -7.5 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply V oltage: V DD(V ) Outtput Return Loss S22 (dB) -4.5 Intput Return Loss S11 (dB) -5.0 -5.5 -6.0 -6.5 -7.0 -7.5 -8.0 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply V oltage: V DD(V ) (5) Reverse Isolation vs. Supply Voltage XC2401A816 Ta=25Pin=-35dBm (6) Noise Figure vs. Supply Voltage XC2401A816 Ta=25f=1.575GHz -21.0 Reverse Isolation S12 (dB) Noise Figure: NF (dB) 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply V oltage: V DD(V ) -21.5 -22.0 -22.5 -23.0 -23.5 -24.0 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply V oltage: V DD(V ) 9/16 XC2401A8167R-G TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) Input 3 Order Intercept Point vs. Supply Voltage XC2401A816 0.0 Input 3Order Intercept Point: IIP3(dBm) -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 -50 -25 0 25 50 75 100 A mbient Temperature:Ta( ) VDD=1.2V,Pin=-30dBm f =1.5751.576GHz (8) Input Power @ 1dB Gain compression vs. Power Supply Voltage XC2401A816 Ta=25f=1.575GHz -10.5 Input Power @1dB Gian Compression: P1dB (dBm) -11.0 -11.5 -12.0 -12.5 -13.0 -13.5 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply V oltage: V DD(V ) (9) Supply Current vs. Ambient Temperature XC2401A816 VD D =1.2V (10) Power Gain vs. Ambient Temperature XC2401A816 VD D = 1.2V Pin=-35dBm 12.0 Supply Current: IDD (mA) 16.5 Power Gian S21(dB) -50 -25 0 25 50 75 100 10.0 8.0 6.0 4.0 2.0 0.0 A mbient Temperature:Ta( ) 16.0 15.5 15.0 14.5 14.0 13.5 -50 -25 0 25 50 75 100 A mbient Temperature:Ta( ) (11) Input Return Loss vs. Ambient Temperature XC2401A816 VDD= 1.2V Pin=-35dBm (12) Output Return Loss vs. Ambient Temperature XC2401A816 VD D = 1.2V Pin=-35dBm Outtput Return Loss S22 (dB) Intput Return Loss S11 (dB) -4.5 -5.0 -5.5 -6.0 -6.5 -7.0 -7.5 -50 -25 0 25 50 75 100 A mbient Temperature:Ta( ) -5.0 -5.5 -6.0 -6.5 -7.0 -7.5 -8.0 -50 -25 0 25 50 75 100 A mbient Temperature:Ta( ) 10/16 XC2401A8167R-G TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) Reverse Isolation vs. Ambient Temperature XC2401A816 -21.0 Reverse Isolation: S12 (dB) -21.5 -22.0 -22.5 -23.0 -23.5 -24.0 -50 -25 0 25 50 75 100 A mbient Temperature:Ta( ) VD D = 1.2V Pin=-35dBm (14) Noise Figure vs. Ambient Temperature XC2401A816 1.2 Noise Figure: NF (dB) 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 100 A mbient Temperature:Ta( ) VDD=1.2Vf =1.575GHz (15) Input 3 Order intercept point vs. Ambient Temperature XC2401A816 0.0 Input 3Order Intercept Point: IIP3(dBm) -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply V oltage: V DD(V ) Ta=25,Pin=-30dBm f =1.575 1.576GHz (16) Input Power @ 1dB Gain Compression vs. Ambient Temperature XC2401A816 VDD= 1.2V Pin=-35dBm -10.5 Input Power @1dB Gian Compression: P1dB (dBm) -11.0 -11.5 -12.0 -12.5 -13.0 -13.5 -50 -25 0 25 50 75 100 A mbient Temperature:Ta( ) (17) Power Gain vs. Frequency XC2401A816 VD D = 1.20V Pin=-35dBm (18) Input Return Loss vs. Frequency XC2401A816 VD D = 1.20V Pin=-35dBm 20 Power Gian S21(dB) 18 16 14 12 10 8 1.00 25 85 -40 Intput Return Loss S11 (dB) -1.5 -2.5 -3.5 -4.5 -5.5 -6.5 -7.5 1.00 25 1.20 85 -40 1.80 2.00 1.20 1.40 1.60 Frequency f [GHz] 1.80 2.00 1.40 1.60 Frequency f [GHz] 11/16 XC2401A8167R-G TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (19) Output Return Loss vs. Frequency XC2401A816 VD D = 1.20V Pin=-35dBm (20) Isolation vs. Frequency XC2401A816 VD D = 1.20V Pin=-35dBm -4 Outtput Return Loss S22 (dB) -5 -6 -7 -8 -9 -10 1.00 25 -40 1.20 1.40 1.60 Frequency f [GHz] 1.80 2.00 85 Reverse Isolation S12 (dB) -20 -21 -22 -23 -24 -25 -26 1.00 25 -40 85 1.20 1.40 1.60 Frequency f [GHz] 1.80 2.00 (21) Noise Figure vs. Frequency XC2401A816 VD D = 1.20V Pin=-35dBm (22) Power Gain vs. Input Power XC2401A816 VD D = 1.20V , f=1.575GHz 6 5 Noise Figure: NF (dB) 4 3 2 1 0 1.00 25 -40 85 18 -40 16 Power Gian :P(dB) 14 25 12 10 8 -40 85 1.20 1.40 1.60 Frequency f [GHz] 1.80 2.00 -35 -30 -25 -20 -15 Input Pow er:Pin(dBm) -10 -5 (23) Output Power / IM3 vs. Input Power XC2401A816 VD D =1.2VTa=25 20 O utput Power:Pout(dBm) 0 -20 -40 -60 -80 IM3 -50 -40 -30 -20 -10 0 10 Undesire Desire 120 100 80 60 40 20 0 Inter-Modulation distortion: IM3(dB) -100 Input Pow er: Pin(dBm) 12/16 XC2401A8167R-G TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (24) Input Return Loss vs. Frequency (Smith Chart) XC2401A816 VDD=1.2V, Pin=-35dBm (25) Output Return Loss vs. Frequency (Smith Chart) XC2401A816 VDD=1.2V, Pin=-35dBm 1.575GHz 1.575GHz 13/16 XC2401A8167R-G PACKAGING INFORMATION USPN-4B02 +0.02 0.38 -0.03 0.950.05 14/16 0.20.05 0.3250.05 XC2401A8167R-G PACKAGING INFORMATION (Continued) USPN-4B02 Reference Pattern Layout USPN-4B02 Reference Metal Mask Design MARKING RULE USPN-4B02 4 3 represents product series. MARK PRODUCT SERIES 8 XC2401******-G represents product. MARK PRODUCT SERIES 1 2 A XC2401A816**-G represents production lot number. 01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order. (G, I, J, O, Q, W excepted) *No character inversion used. 0.35 0.2 0.35 0.5 15/16 XC2401A8167R-G 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 16/16 |
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