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| SMT Devices Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Contact Force: Actuation Force: Series NP437 BGA / CSP 0.40mm Pitch (CMT - Open Top) Part Number (Details) 1,000M min. at 100V DC 100V AC for 1 minute 100m max. at 10mA/20mV max. -40C to +150C 58.8mN (6gf) per pin approx. 29.6N (3kg) Please Contact Yamaichi Materials and Finish Polyetherimide (PEI), glass-filled Polyethersulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Housing: Features Open top socket for BGA / LGA / CSP packages with 0.4mm pitch. 22 x 22 maximum grid size and 11 x 11 maximum body size Depopulation versions available Compression mount 0.4 to 0.6mm fan-out type Outline Socket Dimensions Socket closed Socket open Typical IC Grid Size 22 x 22 (max.) Typical PCB Layout Top View from Socket Detail of Fan-out type 48 Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER |
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