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| Specification TE -module HPE-288-10-05 Issue 2 Issued: 29/05/2008 1/2 SPECIFICATION ProductThermoelectric module Part NumberHPE-288-10-05 1 Scope 1--1 1--2 This specification is applied to Multicomp thermoelectric modules Revision of these specifications is carried out after consent. 2 Specification 21 Parameters Parameters Internal resistance Imax. Vmax. Th=25 Qmax. Tmax. solder melting point Maximum. compress. 196.0 W 68 138 1MPa Note-4 Note-5 Note-6 Note-7 3.10 10% 9.0 A 35.9 V Remarks Note-1 Note-2 Note-3 Note-1 Measured by AC 4-terminal method at 25. Note-2 Maximum current at Tmax. Note-3 Maximum voltage at Tmax. Note-4 Maximum cooling capacity at Imax.,Vmax. and T0. Note-5 Maximum temperature difference at Imax.,Vmax. and Q0W. Maximum parameters are measured in a vacuum 1.3P Note-6 The solder melting point of thermoelectric module Note-7 Recommended maximum compression (not destruction limit) 2 -2 Recommendations: - high cooling capacity from a small surface and long lifetime in power cycling applications with change of current polarity - operation temperature up to 90 for long lifetime; up to 110 degC for short periods - with operation current close to 0.5 Imax extremely high COP (coefficient of performance possible) - preferable application; high cooling capacity at high temperatures / cycling 3 Performance Graph (298K) 4 Performance Graph (323K) |
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