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IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection to IEC 61000-4-2 level 4
Rev. 01 -- 14 May 2009 Product data sheet
1. Product profile
1.1 General description
The IP4060CX16/LF is a diode array with integrated EMI/RF filters and pull-up resistors, which is designed to protect downstream components from ElectroStatic Discharge (ESD) voltages up to 15 kV, far exceeding IEC 61000-4-2 standard, level 4. The IP4060CX16/LF is fabricated using monolithic silicon semiconductor technology integrating 6 resistors and 13 pseudo back-to-back diodes in a single Wafer-Level Chip-Scale Package (WLCSP) measuring only 1.96 mm by 1.97 mm.These features make the IP4060CX16/LF ideal for applications using miniaturized components, such as mobile phone handsets, cordless telephones and personal digital devices.
1.2 Features
I Pb-free I High-speed MMC card specific ESD protection with integrated EMI/RF filters and pull-up resistors for all channels I All channels with 15 kV ESD contact protection at input terminals exceeding IEC 61000-4-2 standard level 4 I WLCSP with 0.5 mm pitch
1.3 Applications
I ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) reduction and downstream ESD protection for high-speed MultiMediaCards (MMC) in: N Cellular and Personal Communication System (PCS) mobile handsets N PC/notebook card readers N Cordless telephones N Wireless data (WAN/LAN) systems N PDAs
NXP Semiconductors
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection
2. Pinning information
2.1 Pinning
bump A1 index area
IP4060CX16/LF
1 2 3 4
A B C D
001aaj755
Transparent top view
Fig 1. Table 1. Pin
Pin configuration IP4060CX16/LF Pinning Description filter channel 1 filter channel 2 filter channel 3 filter channel 4 filter channel 5 filter channel 6 ground
A2 and A4 A1 and B4 B2 and C4 B1 and C3 C1 and D4 D1 and D3 B3, C2, D2
3. Ordering information
Table 2. Ordering information Package Name IP4060CX16/LF WLCSP16 Description wafer level chip-size package; 16 bumps; 1.96 x 1.97 x 0.7 mm Version IP4060CX16/LF Type number
IP4060CX16LF_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 14 May 2009
2 of 10
NXP Semiconductors
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection
4. Functional diagram
R14
R13
R12
R11
R10
A3
R1
A3 A2
R2
A4 B4
R3
A1 B2
R4
C4 C3
R5
B1 C1
R6
D4 D3
D1 IEC61000-4-2 level 4 protection pins B3 C2 D2
001aaj756
Fig 2.
Schematic diagram IP4060CX16/LF
5. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI VESD Parameter input voltage electrostatic discharge voltage IEC 61000-4-2, level 4; pins A1, A2, A3, B1, B2, C1 and D1 connected to ground contact discharge air discharge IEC 61000-4-2, level 1; all other pins connected to ground contact discharge air discharge Pch Ptot Tstg Tamb
[1]
[1]
Conditions
Min -
Max +5.0
Unit V
-15 -15
+15 +15
kV kV
-2 -2 -55
+2 +2 20 120 260 +85
kV kV mW mW C C
channel power dissipation total power dissipation storage temperature 10 s maximum ambient temperature
+150 C
Treflow(peak) peak reflow temperature
-30
Device withstands at least 1000 pulses of 8 kV contact discharges without degradation, according to the IEC 61000-4-2 model.
IP4060CX16LF_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 14 May 2009
3 of 10
NXP Semiconductors
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection
6. Characteristics
Table 4. Channel characteristics Tamb = 25 C; unless otherwise specified. Symbol Parameter Rs(ch) channel series resistance Conditions -30 C < tc < +85 C R1 to R6 R10 to R13 R14 Cch VBR ILR channel capacitance breakdown voltage reverse leakage current Vbias(DC) = 0 V; f = 1 MHz; pin A3 = +3 V Itest = +1 mA Itest = -1 mA per diode pair VI = +5 V VI = -5 V 100 nA nA -100 40 4.9 7 -10 50 7 18 60 97.5 9.1 20 10 -7 k k pF V V 52.5 75 Min Typ Max Unit
IP4060CX16LF_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 14 May 2009
4 of 10
NXP Semiconductors
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection
7. Package outline
WLCSP16: wafer level chip-size package; 16 bumps; 1.96 x 1.97 x 0.7 mm IP4060CX16/LF
D
bump A1 index area A2 E A A1
detail X
e1 e b
D e C e2 B
A 1 2 3 4 X
0 Dimensions Unit mm A A1 A2 b D E e 0.5 e1 1.5 e2 1.5
1 scale
2 mm
max 0.70 0.26 0.44 0.37 2.01 2.02 nom 0.65 0.24 0.41 0.32 1.96 1.97 min 0.60 0.22 0.38 0.27 1.91 1.92 Outline version
IP4060CX16_lf_po
References IEC JEDEC JEITA
European projection
Issue date 09-02-25 09-03-12
IP4060CX16/LF
Fig 3.
Package outline IP4060CX16/LF (WLCSP16)
(c) NXP B.V. 2009. All rights reserved.
IP4060CX16LF_1
Product data sheet
Rev. 01 -- 14 May 2009
5 of 10
NXP Semiconductors
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection
8. Soldering of WLCSP packages
8.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this package. All NXP WLCSP packages are lead-free.
8.2 Board mounting
Board mounting of a WLCSP requires several steps: 1. Solder paste printing on the PCB 2. Component placement with a pick and place machine 3. The reflow soldering itself
8.3 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 4) than a PbSn process, thus reducing the process window
* Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 5.
Table 5. Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 4.
IP4060CX16LF_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 14 May 2009
6 of 10
NXP Semiconductors
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 4.
Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering description".
8.3.1 Stand off
The stand off between the substrate and the chip is determined by:
* The amount of printed solder on the substrate * The size of the solder land on the substrate * The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip.
8.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to be related to these voids. Solder joint inspection after reflow can be done with X-ray to monitor defects such as bridging, open circuits and voids.
8.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from the substrate, most solder balls of the chip will be damaged. In that case it is recommended not to re-use the chip again.
IP4060CX16LF_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 14 May 2009
7 of 10
NXP Semiconductors
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection
Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. The surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill removed. When a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the substrate. Place and align the new chip while viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering description".
8.3.4 Cleaning
Cleaning can be done after reflow soldering.
9. Abbreviations
Table 6. Acronym EMI ESD LAN MMC PCS PDA RFI WAN WLCSP Abbreviations Description ElectroMagnetic Interference ElectroStatic Discharge Local Area Network MultiMediaCard Personal Communication System Personal Digital Assistant Radio-Frequency Interference Wide Area Network Wafer-Level Chip-Scale Package
10. Revision history
Table 7. Revision history Release date 20090514 Data sheet status Product data sheet Change notice Supersedes Document ID IP4060CX16LF_1
IP4060CX16LF_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 14 May 2009
8 of 10
NXP Semiconductors
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection
11. Legal information
11.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
11.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4060CX16LF_1
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 -- 14 May 2009
9 of 10
NXP Semiconductors
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD protection
13. Contents
1 1.1 1.2 1.3 2 2.1 3 4 5 6 7 8 8.1 8.2 8.3 8.3.1 8.3.2 8.3.3 8.3.4 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 Soldering of WLCSP packages. . . . . . . . . . . . . 6 Introduction to soldering WLCSP packages . . . 6 Board mounting . . . . . . . . . . . . . . . . . . . . . . . . 6 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 6 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Quality of solder joint . . . . . . . . . . . . . . . . . . . . 7 Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 May 2009 Document identifier: IP4060CX16LF_1

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