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| MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Number DSE-231-009 REV. 1.0 ECN Page: 1/8 Features Package in 8mm tape on 7" diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. Mono-color type. Description The 23-21 SMD Taping is much smaller than leaded components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. Besides, lightweight makes them ideal for miniature application, etc. Package Dimensions Applications Automotive: backlighting in dashboard and switch. Telecommunication: indicator and backlighting in telephone and fax. Flat backlight for LCD, switch and symbol. General use. Notes Tolerances Unless Dimension Angle 0.5 Unit = mm 0.1mm PART NO 23-21UBGC/TR8 CHIP Material Emitted Color GaN/SiC Super Blue Green Substrate Lens Color Water Clear MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Number DSE-231-009 REV. 1.0 ECN Page: 2/8 Package Dimensions Loaded quantity per reel 2000 pcs/reel MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Number DSE-231-009 REV. 1.0 ECN Page: 3/8 Absolute Maximum Ratings at Ta = 25 Parameter Reverse Voltage Forward Current Operating Temperature Storage Temperature Soldering Temperature : Rating Unit V mA Symbol Vr If Topr Tstg Tsol ESD Pd 5 30 -20 ~ +80 -30 ~ +90 260 (for 5 second) 1000 120 100 Electrostatic Discharge Power Dissipation Peak Forward Current(Duty 1/10 @ 1KHZ) V mW If(Peak) mA Electronic Optical Characteristics : Parameter Luminous intensity Symbol Iv Min. Typ. Max. Unit mcd mcd deg nm nm Condition If=2mA If=20mA If=20mA If=20mA If=20mA ----34 ----------------- 3 58 130 502 505 30 3.5 ----- ------------------------4.0 50 Viewing Angle Peak Wavelength Dominant Wavelength 2 1/2 p d Spectrum Radiation Bandwidth Forward Voltage Reverse Current nm V A If=20mA If=20mA Vr=5V Vf Ir --------- MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Number DSE-231-009 REV. 1.0 ECN Page: 4/8 Reliability Test Item And Condition : Test Hours/Cycle NO Item Solder Heat Temperature Cycle Test Conditions TEMP : 260 H : +85 5 30min 5 min L : -55 H : +100 30min 5min Sample Size 76 Pcs 76 Pcs Ac/Re 0/1 0/1 1 2 5 SEC 50 CYCLE 3 Thermal Shock 10 sec L : -10 5min 50 CYCLE 76 Pcs 0/1 4 5 6 7 High Temperature Storage Low Temperature Storage DC Operating Life High Temperature / High Humidity TEMP : 100 TEMP : -55 If = 20 mA 85 /85% RH 1000 HRS 1000 HRS 1000 HRS 1000 HRS 76 Pcs 76 Pcs 76 Pcs 76 Pcs 0/1 0/1 0/1 0/1 MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Number DSE-231-009 REV. 1.0 ECN Page: 5/8 Typical Electro-Optical Characteristic Curves : MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Number DSE-231-009 REV. 1.0 ECN Page: 6/8 Test Circuit : R LED Precautions For Use : 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage time 2.1 The operation of temperature and R.H. are : 5 ~35 , R.H.60%. 2.2 Once the package is opened, the products should be used within a week. Otherwise, they should be keeping in a dampproof box with desiccants. Considering the tape life , we suggest our customers to use our products within a year(from production date). 2.3 If opened more than one week in an atmosphere 5 ~35 , R.H.60%, they should be treated at 60 5 for 15hrs. 2.4 When you discover that the desiccant in the package has a pink color (normal = blue) , you should treat them in the same conditions as 2.3. MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Number DSE-231-009 REV. 1.0 ECN Page: 7/8 Soldering heat reliability ( DIP ) : Please refer to the following figure : Soldering Iron : Basic spec is 5 sec when 260 .If temperature is higher, time should be shorter (+10 -1sec). Power dissipation of iron should be smaller than 15 W , and temperature should be controllable. Surface temperature of the device should be under 230 . Rework : 1. Customer must finish rework within 5 sec under 260 . 2. The head of iron can not touch copper foil. 3. Twin-head type is preferred. MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Number DSE-231-009 REV. 1.0 ECN Page: 8/8 Reflow Temp / Time to rise cooling preheat |
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