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| Solder Profile and Pattern 1) Dip Types (LA, LB ,LAP,LBP series) Please keep the preheat and peak temperatures with dip units as low as possible and the times as short as is feasible, since the products are susceptible to heat during flow soldering. As a guide, ensure that the internal temperature of the LED numeric display does not exceed 100C. Soldering Example 300 3s or less Temperature C 250 200 150 100 50 0 Preheat 30s or less Conditions General flow conditions A single wave is better than a double wave, while stationary flow method is the best. Solder Pattern Example LA-301 series 1.5 +0.1 0 land shape 260C or less After soldering, immediately lower the temperature of the substrate 0.8 +0.1 0 hole shape Other series 2.0 +0.1 0 land shape 0 20 40 60 80 Time (s) 100 120 140 1.0 +0.1 0 hole shape Item Solder dip Conditions At least 2mm from the base of the lead pin. Solder Temperature Preheat temperature must be no greater than 80C. Process Duration 30 seconds or less 3 seconds or less 3 seconds or less No more than 260C. Solder iron Reflow At least 2mm from the base of the lead pin. Power: No more than 30W. No more than 300C. Reflow cannot be used. (other than the LF-301 series) Please use a resin-based flux, since flux that is acidic or highly alkaline could cause corrosion. 2) Surface Mount Type (LF-301 series) Please refer to the following reflow soldering profile and pattern examples for surface mount units. Reflow Soldering Example Substrate Surface Temperature (C) D: Peak Temperature Solder Pattern Example LF-301 A/K series 1.8 250 200 150 100 C: Heat Slope 2 B: Preheat A: Heat Slope 1 50 1.8 0 0 50 100 150 Time (s) C (Heat Slope 2) 4C/s max. 200 250 300 (10.4) E: 200C + range 14 10-0.6 D (Peak temperature, peak time) 250C max, 5s max. E (200C + range) 50s max. P=1.27 Type LF-301A/K series A (Heat Slope 1) 4C/s max B (Preheat) 140 to 160C (1 min. or less) |
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