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Product Specification
PE43503
Product Description
The PE43503 is a HaRPTM-enhanced, high linearity, 5-bit RF Digital Step Attenuator (DSA) covering a 31 dB attenuation range in 1 dB steps. The Peregrine 50 RF DSA provides a serial CMOS control interface. It maintains high attenuation accuracy over frequency and temperature and exhibits very low insertion loss and low power consumption. Performance does not change with Vdd due to on-board regulator. This next generation Peregrine DSA is available in a 4x4 mm 24-lead QFN footprint. The PE43503 is manufactured on Peregrine's UltraCMOSTM process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS. 50 RF Digital Attenuator 5-bit, 31 dB, DC-6.0 GHz Features * HaRPTM-enhanced UltraCMOSTM device
* Attenuation: 1 dB steps to 31 dB * High Linearity: Typical +58 dBm IP3
*
Excellent low-frequency performance
* 3.3 V or 5.0 V Power Supply Voltage * Fast switch settling time * Programming Modes:
* * *
Direct Parallel Latched Parallel Serial
* High-attenuation state @ power-up (PUP) * CMOS Compatible
Figure 1. Package Type
24-lead 4x4x0.85 mm QFN Package
* No DC blocking capacitors required * Packaged in a 24-lead 4x4x0.85 mm QFN
Figure 2. Functional Schematic Diagram
Switched Attenuator Array RF Input RF Output
Parallel Control Serial In
5
Control Logic Interface CLK LE
A0
A1
A2
P/S
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Document No. 70-0252-04 www.psemi.com
PE43503
Product Specification
Table 1. Electrical Specifications @ +25C, VDD = 3.3 V or 5.0 V
Parameter Frequency Range Attenuation Range Insertion Loss 0dB - 31dB Attenuation settings 0dB - 21dB Attenuation settings 22dB - 31dB Attenuation settings 0dB - 31dB Attenuation settings All States Input Two tones at +18 dBm, 20 MHz spacing 1 dB Step DC 6 GHz DC 4 GHz 4 GHz 6 GHz 4 GHz 6 GHz 4 GHz 6 GHz DC 6 GHz 20 MHz - 6 GHz 20 MHz - 6 GHz DC 6 GHz 50% DC CTRL to 10% / 90% RF 1 MHz 30 72 32 +58 17 650 -115 10 10% / 90% RF RF settled to within 0.05 dB of final value RBW = 5 MHz, Averaging ON. 400 4 Test Conditions Frequency Min. Typical DC - 6 0 - 31 2.4 2.9 (0.3+3%) +0.4+9% +2.4+0% -0.2-3% Max. Units GHz dB dB dB dB dB dB dBm dBm dB ns dBm mVpp ns s
Attenuation Error
Relative Phase P1dB Input IP3 Return Loss Switching Speed Typical Spurious Value Video Feed Through RF Trise/Tfall Settling Time
Performance Plots Figure 3. 1dB Step Error vs. Frequency *
1.6 1.4 1.2 Step Error (dB.) 1 0.8 0.6 0.4 0.2 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 Attenuation Setting (dB.)
Figure 4. 1dB Attenuation vs. Attenuation State
Attenuation
35 30
900 MHz 2200 MHz 3800 MHz 5800 MHz
200MHz 4000MHz
900MHz 5000MHz
1800MHz 6000MHz
2200MHz
Attenuation (dB) dB
25 20 15 10 5 0 0
5
10
15
20
25
30
35
*Monotonicity is held so long as Step-Error does not cross zero
Attenuation State
Figure 5. 1dB Major State Bit Error
1dB State 8dB State
2.00 1.50 1.00 Bit Error (dB.) 0.50 0.00 -0.50 -1.00 -1.50 -2.00 0.0 1.0 2.0 3.0 Frequency (GHz) 4.0 5.0 6.0
Figure 6. 1dB Attenuation Error vs. Frequency
2 1.5 1 Attenuation Error (dB.) 0.5 0 -0.5 -1 -1.5 -2 0 5 10 15 20 25 30 35 Attenuation Setting (dB.) 200MHz 4000MHz 2200MHz 5000MHz 3000MHz 6000MHz
2dB State 16dB State
4dB State 31dB State
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Document No. 70-0252-04
UltraCMOSTM RFIC Solutions
PE43503
Product Specification
Figure 7. Insertion Loss vs. Temperature
-40C 0 -0.5 +25C +85C
Figure 8. Input Return Loss vs. Attenuation @ T = +25C
0 -5 Input Return Loss (dB.) -10 -15 -20 -25 -30 -35 -40
0dB 4dB 0.5dB 8dB 1dB 16dB 2dB 31dB
Insertion Loss (dB)
-1 -1.5 -2 -2.5 -3 -3.5 0 2 4 6 8 10 Frequency (GHz.)
0
1
2
3
4
5
6
7
8
9
Frequency (GHz.)
Figure 9. Output Return Loss vs. Attenuation @ T = +25C
0 -5 -10 Return Loss (dB.) -15 -20 -25 -30 -35 -40 -45 0 1 2 3 4 5 6 7 8 9 Frequency (GHz.) 0dB 4dB 0.5dB 8dB 1dB 16dB 2dB 31dB
Figure 10. Relative Phase vs. Frequency
140 120 100 80 60 40 20 0 0 1 2 3 4 5 6 7 8 Frequency (GHz.) 0dB 8dB 1dB 16dB 2dB 31dB 4dB
Figure 11. Attenuation Error vs. Temperature @ 6 GHz
-40C 2 1.5 Attenuation Error (dB.) 1 +25C +85C
Figure 12. Input IP3 vs. Frequency
0dB 8dB 1dB 16dB 2dB 31dB 4dB
Relative Phase Error (Deg.)
70 65 60 Input IP3 (dBm.) 55 50 45 40 35 30
0 5 10 15 20 25 30 35
0.5 0 -0.5 -1 -1.5 -2 Attenuation Setting (dB.)
0
500
1000
1500
2000
2500
3000
3500
4000
4500
Frequency (MHz)
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PE43503
Product Specification
Figure 13. Pin Configuration (Top View)
GND C1 C2 C4 C8 C16 24 NC VDD P/S GND RF1 GND 1 2 3 4 5 6 7 GND 8 GND 9 GND 10 GND 11 GND 12 GND 23 22 21 20 19 18 17 SI CLK LE GND RF2 GND
Table 3. Operating Ranges
Parameter VDD Power Supply Voltage VDD Power Supply Voltage IDD Power Supply Current Digital Input High PIN Input power (50): 1 Hz 20 MHz 20 MHz 4 GHz TOP Operating temperature range Digital Input Low Digital Input Leakage1 -40 0 25 2.6 Min 3.0 Typ 3.3 5.0 70 5.5 350 5.5 Fig. 14 +23 85 1 15 Max Units V V A V dBm dBm C V A
Exposed Solder Pad
16 15 14 13
Table 2. Pin Descriptions
Pin No.
1 2 3 4 5 6 7 - 12 13 14 15 16 17 18 19 20 21 22 23 24
Pin Name
NC VDD P/S GND RF1 GND GND GND RF2 GND LE CLK SI C16 C8 C4 C2 C1 GND No Connect
Description
Power supply pin Serial/Parallel mode select Ground RF1 port Ground Ground Ground RF2 port Ground Latch Enable input Serial interface clock input Serial Interface input Attenuation control bit, 16 dB Attenuation control bit, 8 dB Attenuation control bit, 4 dB Attenuation control bit, 2 dB Attenuation control bit, 1 dB Ground
Note 1. Input leakage current per Control pin
Table 4. Absolute Maximum Ratings
Symbol VDD VI TST PIN VESD Parameter/Conditions Power supply voltage Voltage on any Digital input Storage temperature range Input power (50) 1 Hz 20 MHz 20 MHz 4 GHz ESD voltage (HBM)1 ESD voltage (Machine Model) Min -0.3 -0.3 -65 Max 6.0 5.8 150 Fig. 14 +23 500 100 Units V V C dBm dBm V V
Note: 1. Human Body Model (HBM, MIL_STD 883 Method 3015.7)
Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability.
Figure 14. Maximum Power Handling Capability
30.0 25.0
Ground C1 C2, C4, C8, C16 if not in use.
Exposed Solder Pad Connection
Pin dBm
20.0 15.0 10.0
The exposed solder pad on the bottom of the package must be grounded for proper device operation.
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the PE43503 in the 24-lead 4x4 QFN package is MSL1.
5.0 0.0 1.0E+03 1.0E+04 1.0E+05 1.0E+06 Hz 1.0E+07 1.0E+08 1.0E+09
Switching Frequency
The PE43503 has a maximum 25 kHz switching rate. Switching rate is defined to be the speed at which the DSA can be toggled across attenuation states.
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOSTM device, observe the same precautions that you would use with other ESDsensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the specified rating.
Document No. 70-0252-04 UltraCMOSTM RFIC Solutions
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOSTM devices are immune to latch-up.
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PE43503
Product Specification
Table 5. Control Voltage
State
Low High
Bias Condition
0 to +1.0 Vdc at 2 A (typ) +2.6 to +5 Vdc at 10 A (typ)
Table 6. Latch and Clock Specifications
Latch Enable
X
Shift Clock
X
Function
Shift Register Clocked Contents of shift register transferred to attenuator core
Table 7. Parallel Truth Table
Parallel Control Setting D6
L L L L L H H
Table 8. Attenuation Word Truth Table
Attenuation Word D7
X X X X X X X
D5
L L L L H L H
D4
L L L H L L H
D3
L L H L L L H
D2
L H L L L L H
Attenuation Setting RF1-RF2
Reference I.L. 1 dB 2 dB 4 dB 8 dB 16 dB 31 dB
D6
L L L L L H H
D5
L L L L H L H
D4
L L L H L L H
D3
L L H L L L H
D2
L H L L L L H
D1
L L L L L L H
D0 (LSB)
L L L L L L H
Attenuation Setting RF1-RF2
Reference I.L. 1 dB 2 dB 4 dB 8 dB 16 dB 31 dB
Table 9. Serial Register Map
MSB (last in) Q7 D7 Q6 D6 Q5 D5 Q4 D4 Q3 D3 Q2 D2 LSB (first in) Q1 D1 Q0 D0 Bits can either be set to logic high or logic low
Attenuation Word
Attenuation Word is derived directly from the attenuation value. For example, to program the 13 dB state: Attenuation Word: Multiply by 4 and convert to binary 4 *13 dB 52 X0110100 Serial Input: X0110100
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PE43503
Product Specification
Programming Options Parallel/Serial Selection Either a parallel or serial interface can be used to control the PE43503. The P/S bit provides this selection, with P/S=LOW selecting the parallel interface and P/S=HIGH selecting the serial interface. Parallel Mode Interface The parallel interface consists of five CMOScompatible control lines that select the desired attenuation state, as shown in Table 7. The parallel interface timing requirements are defined by Fig. 16 (Parallel Interface Timing Diagram), Table 11 (Parallel Interface AC Characteristics), and switching speed (Table 1). For latched-parallel programming the Latch Enable (LE) should be held LOW while changing attenuation state control values, then pulse LE HIGH to LOW (per Fig. 16) to latch new attenuation state into device. For direct parallel programming, the Latch Enable (LE) line should be pulled HIGH. Changing attenuation state control values will change device state to new attenuation. Direct Mode is ideal for manual control of the device (using hardwire, switches, or jumpers). Serial Interface The serial interface is a 8-bit serial-in, parallel-out shift register buffered by a transparent latch. The 8-bits make up the Attenuation Word that controls the DSA. Fig. 15 illustrates a example timing diagram for programming a state. When the DSA is used in serial mode, ground all parallel control pins (pins 19-23).
The serial-interface is controlled using three CMOS-compatible signals: Serial-In (SI), Clock (CLK), and Latch Enable (LE). The SI and CLK inputs allow data to be serially entered into the shift register. Serial data is clocked in LSB first. The shift register must be loaded while LE is held LOW to prevent the attenuator value from changing as data is entered. The LE input should then be toggled HIGH and brought LOW again, latching the new data into the DSA. Attenuation Word truth table is listed in Table 8. A programming example of the serial register is illustrated in Table 9. The serial timing diagram is illustrated in Fig. 15. Power-up Control Settings The PE43503 will always initialize to the maximum attenuation setting (31 dB) on power-up for the latched-parallel mode of operation and will remain in this setting until the user latches in the next programming word. In direct-parallel mode, the DSA can be preset to any state within the 31 dB range by pre-setting the parallel control pins prior to power-up. In this mode, there is a 400-s delay between the time the DSA is powered-up to the time the desired state is set. During this power-up delay, the device attenuates to the maximum attenuation setting (31 dB) before defaulting to the user defined state. If the control pins are left floating in this mode during power-up, the device will default to the minimum attenuation setting (insertion loss state).
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Document No. 70-0252-04
UltraCMOSTM RFIC Solutions
PE43503
Product Specification
Figure 15. Serial Timing Diagram
Bits can either be set to logic high or logic low
TDISU
TDIH
P/S
TPSSU TPSIH
SI
TSISU TSIH
D[6]
D[5]
D[4]
D[3]
D[2]
D[1]
D[0]
CLK
TCLKL TCLKH TLESU
LE
TLEPW TPD VALID
Figure 16. Latched-Parallel/Direct-Parallel Timing Diagram
P/S
TPSSU TPSIH VALID TDISU TDIH
DI[6:0]
LE
TLEPW
DO[6:0]
TDIPD
VALID TPD
Table 10. Serial Interface AC Characteristics
VDD = 3.3 or 5.0 V, -40 C < TA < 85 C, unless otherwise specified Symbol
FCLK TCLKH TCLKL TLESU TLEPW TSISU TSIH TDISU TDIH TASU TAH TPSSU TPSH TPD
Table 11. Parallel and Direct Interface AC Characteristics
VDD = 3.3 or 5.0 V, -40 C < TA < 85 C, unless otherwise specified Symbol
TLEPW TDISU TDIH
Parameter
Serial clock frequency Serial clock HIGH time Serial clock LOW time Last serial clock rising edge setup time to Latch Enable rising edge Latch Enable min. pulse width Serial data setup time Serial data hold time Parallel data setup time Parallel data hold time Address setup time Address hold time Parallel/Serial setup time Parallel/Serial hold time Digital register delay (internal)
Min
30 30 10 30 10 10 100 100 100 100 100 100 -
Max
10 10
Unit
MHz ns ns ns ns ns ns ns ns ns ns ns ns ns
Parameter
Latch Enable minimum pulse width Parallel data setup time Parallel data hold time Parallel/Serial setup time Parallel/Serial hold time Digital register delay (internal) Digital register delay (internal, direct mode only)
Min
30 100 100 100 100 -
Max
10 5
Unit
ns ns ns ns ns ns ns
TPSSU TPSIH TPD TDIPD
Note: fClk is verified during the functional pattern test. Serial programming sections of the functional pattern are clocked at 10 MHz to verify fclk specification. Document No. 70-0252-04 www.psemi.com (c)2008-2009 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 11
PE43503
Product Specification
Evaluation Kit
The Digital Attenuator Evaluation Kit board was designed to ease customer evaluation of the PE43503 Digital Step Attenuator. Direct-Parallel Programming Procedure For automated direct-parallel programming, connect the test harness provided with the EVK from the parallel port of the PC to the J1 & Serial header pin and set the D0-D6 SP3T switches to the `MIDDLE' toggle position. Position the Parallel/Serial (P/S) select switch to the Parallel (or left) position. The evaluation software is written to operate the DSA in either Parallel or Serial-Addressable Mode. Ensure that the software is set to program in Direct-Parallel mode. Using the software, enable or disable each setting to the desired attenuation state. The software automatically programs the DSA each time an attenuation state is enabled or disabled. For manual direct-parallel programming, disconnect the test harness provided with the EVK from the J1 and Serial header pins. Position the Parallel/Serial (P/S) select switch to the Parallel (or left) position. The LE pin on the Serial header must be tied to VDD. Switches D0-D6 are SP3T switches which enable the user to manually program the parallel bits. When any input D0-D6 is toggled `UP', logic high is presented to the parallel input. When toggled `DOWN', logic low is presented to the parallel input. Setting D0-D6 to the `MIDDLE' toggle position presents an OPEN, which forces an on-chip logic low. Table 9 depicts the parallel programming truth table and Fig. 16 illustrates the parallel programming timing diagram. Latched-Parallel Programming Procedure For automated latched-parallel programming, the procedure is identical to the direct-parallel method. The user only must ensure that LatchedParallel is selected in the software. For manual latched-parallel programming, the procedure is identical to direct-parallel except now the LE pin on the Serial header must be logic low
Figure 17. Evaluation Board Layout
Peregrine Specification 101-0310
Note: Reference Figure 18 for Evaluation Board Schematic
as the parallel bits are applied. The user must then pulse LE from 0V to VDD and back to 0V to latch the programming word into the DSA. LE must be logic low prior to programming the next word. Serial Programming Procedure Position the Parallel/Serial (P/S) select switch to the Serial (or right) position. The evaluation software is written to operate the DSA in either Parallel or Serial Mode. Ensure that the software is set to program in Serial mode. Using the software, enable or disable each setting to the desired attenuation state. The software automatically programs the DSA each time an attenuation state is enabled or disabled.
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Document No. 70-0252-04
UltraCMOSTM RFIC Solutions
PE43503
Product Specification
Figure 18. Evaluation Board Schematic
Peregrine Specification 102-0379
VDD
4
6
1
2
4
1
2
4
1
2
4
1
2
4
1
2
4
1
2
4
1
2 D6 3
P/S 5
D0 3
D1 3
D2 3
D3 3
D4 3
D5 3
D6
D3
D4
P/ S
D0
D1
J1 HEADER 14 2 4 6 8 10 12 14 2 4 6 8 10 12 14 1 3 5 7 9 11 13 1 3 5 7 9 11 13 D0 D1 D2 D3 D4 D5 D6
C5 100pF C1 100pF J3 CON2 1 2 C9 0.1F C10 100pF C8 100pF VDD C2 100pF
D2
C6 100pF C3 100pF
C7 100pF C4 SERIAL HEADER 4 CLK DATA LE 1 2 3 4 CLOCK DATA LE GND D1 D2 D3 D4 D5 D6
D5
4
24
23
22
21
20 C8
C1
C2
C4
D0
CP5
C16
100pF
19
1 2 3 4 5
CP25 VDD S/P GND RF1 GND GND GND GND GND GND GND
U1 43X0X DSA 50 Ohm 4x4 MLP24
SI CLK LE GND RF2 GND
18 17 16 15 14 13
Z=50 Ohm 1 2 J5 SMA
VDD
P/S C13 100pF C14 100pF
J4 SMA 1 De-embeding trace Z=50 Ohm 1 2 1 2 2
Z=50 Ohm
6
7
8
9
10
11
J6 SMA
J7 SMA
Note: Capacitors C1-C8, C13, & C14 may be omitted.
Figure 19. Package Drawing
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12
PE43503
Product Specification
Figure 20. Tape and Reel Drawing
Tape Feed Direction
Pin 1
A0 = 4.35 B0 = 4.35 K0 = 1.1
Device Orientation in Tape
Top of Device
Figure 21. Marking Specifications
43503 YYWW ZZZZZ
YYWW = Date Code ZZZZZ = Last five digits of Lot Number
Table 12. Ordering Information Order Code Part Marking
EK-43503-01 PE43503 MLI PE43503 MLI-Z PE43503 -EK 43503 43503
Description
PE43503 - 24QFN 4x4mm-EK PE43503 G - 24QFN 4x4mm-75A PE43503 G - 24QFN 4x4mm-3000C
Package
Evaluation Kit Green 24-lead 4x4mm QFN Green 24-lead 4x4mm QFN
Shipping Method
1 / Box Bulk or tape cut from reel 3000 units / T&R
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PE43503
Product Specification
Sales Offices
The Americas Peregrine Semiconductor Corporation
9380 Carroll Park Drive San Diego, CA 92121 Tel: 858-731-9400 Fax: 858-731-9499
Peregrine Semiconductor, Asia Pacific (APAC)
Shanghai, 200040, P.R. China Tel: +86-21-5836-8276 Fax: +86-21-5836-7652
Peregrine Semiconductor, Korea
#B-2607, Kolon Tripolis, 210 Geumgok-dong, Bundang-gu, Seongnam-si Gyeonggi-do, 463-943 South Korea Tel: +82-31-728-3939 Fax: +82-31-728-3940
Europe Peregrine Semiconductor Europe
Batiment Maine 13-15 rue des Quatre Vents F-92380 Garches, France Tel: +33-1-4741-9173 Fax : +33-1-4741-9173
Peregrine Semiconductor K.K., Japan
Teikoku Hotel Tower 10B-6 1-1-1 Uchisaiwai-cho, Chiyoda-ku Tokyo 100-0011 Japan Tel: +81-3-3502-5211 Fax: +81-3-3502-5213
High-Reliability and Defense Products
Americas San Diego, CA, USA Phone: 858-731-9475 Fax: 848-731-9499 Europe/Asia-Pacific Aix-En-Provence Cedex 3, France Phone: +33-4-4239-3361 Fax: +33-4-4239-7227
For a list of representatives in your area, please refer to our Web site at: www.psemi.com
Data Sheet Identification
Advance Information
The product is in a formative or design stage. The data sheet contains design target specifications for product development. Specifications and features may change in any manner without notice. The information in this data sheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user's own risk. No patent rights or licenses to any circuits described in this data sheet are implied or granted to any third party. Peregrine's products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp.
Document No. 70-0252-04 UltraCMOSTM RFIC Solutions
Preliminary Specification
The data sheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product.
Product Specification
The data sheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a DCN (Document Change Notice).
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