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SMD Schottky Barrier Diode
SMD Diodes Specialist
CDBU54-HF (RoHS Device)
Io = 200 mA VR = 30 Volts Features
Halogen free. Low forward voltage. Designed for mounting on small surface. Extremely thin / leadless package. Majority carrier conduction.
0.039(1.00) 0.031(0.80) 0.071(1.80) 0.063(1.60)
0603(1608)
Mechanical data
0.033(0.85)
Case: 0603(1608) standard package, molded plastic. Terminals: Gold plated, solderable per MIL-STD-750,method 2026. Marking code: cathode band & BF Mounting position: Any Weight: 0.003 gram(approx.).
0.027(0.70)
0.014(0.35) Typ.
0.012 (0.30) Typ.
0.028(0.70) Typ.
Dimensions in inches and (millimeter)
Maximum Rating (at TA=25 C unless otherwise noted)
O
Parameter
Peak reverse voltage Reverse voltage RMS reverse voltage Average forward rectified current Repetitive peak forward current Forward current,surge peak Power dissipation Storage temperature Junction temperature
Conditions
Symbol Min Typ Max Unit
VRM VR VR(RMS) IO IFRM 30 30 21 200 0.3 0.6 150 -65 +125 +125 V V V mA A A mW
O
8.3 ms single half sine-wave superimposed on rate load(JEDEC method)
IFSM PD TSTG Tj
C C
O
Electrical Characteristics (at TA=25 C unless otherwise noted)
O
Parameter
Forward voltage IF = 0.1mA IF = 1mA IF = 10mA IF = 30mA IF = 100mA VR = 25V
Conditions
Symbol Min Typ Max Unit
VF 0.24 0.32 0.4 0.5 1 2 10 5 V
Reverse current Capacitance between terminals Reverse recovery time
IR CT Trr
uA pF nS
REV:A
f = 1 MHz, and 1 VDC reverse voltage IF=IR=10mA,Irr=0.1xIR,RL=100 Ohm
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Comchip Technology CO., LTD.
SMD Schottky Barrier Diode
RATING AND CHARACTERISTIC CURVES (CDBU54-HF)
Fig. 1 - Forward characteristics
1000 1m
Fig. 2 - Reverse characteristics
Reverse current ( A )
Forward current (mA )
100u
125 C
O
100
10u
75 C
O
10
1u
1
C
75 C
C
O
125
O
-25
O
C
100n
25 C -25 C
O
O
O
0.1 0 0.2 0.4 0.6 0.8
25
10n 0 5 10 15 20 25 30
Forward voltage (V)
Reverse voltage (V)
Fig.3 - Capacitance between terminals characteristics
Capacitance between terminals (PF)
14 12 10 8 6 4 2 0 0 5 10 15 20 25 30
120
Fig.4 - Current derating curve
Average forward current(%)
f=1MHz O TA=25 C
Mounting on glass epoxy PCBs
100
80
60
40
20
0
0 25 50 75 100
O
125
150
Reverse voltage (V)
Ambient temperature ( C)
REV:A
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Comchip Technology CO., LTD.
SMD Schottky Barrier Diode
Reel Taping Specification
P0 P1 d Index hole E T
F B
Polarity
W C
P
A
12 0
o
D2
D1 D
W1
Trailer ....... .......
10 pitches (min)
Device ....... ....... ....... .......
Leader ....... .......
10 pitches (min)
End
Start
Direction of Feed
SYMBOL
A
1.00 0.10
0.039 0.004
B
1.85 0.10
0.073 0.004
C
1.00 0.10
0.039 0.004
d
1.55 0.05
0.061 0.002
D
178 1
7.008 0.04
D1
60.0 MIN.
2.362 MIN.
D2
13.0 0.20
0.512 0.008
U/0603
(mm) (inch)
SYMBOL
E
1.75 0.10
0.069 0.004
F
3.50 0.05
0.138 0.002
P
4.00 0.10
0.157 0.004
P0
4.00 0.10
0.157 0.004
P1
2.00 0.05
0.079 0.004
T
0.23 0.05
0.009 0.002
W
8.00 0.20
0.315 0.008
W1
13.5 MAX.
0.531 MAX.
U/0603
(mm) (inch)
REV:A
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Comchip Technology CO., LTD.
SMD Schottky Barrier Diode
Marking Code
Park Number CDBU54-HF Marking Code
BF
BF
Suggested PAD Layout
U/0603 SIZE (mm) A B C D E 1.70 0.60 0.80 2.30 1.10 (inch) 0.067 0.024 0.031
C D A E
0.091
B
0.043
Standard Package
Qty per Reel Case Type (Pcs) U/0603 4000 Reel Size (inch) 7
REV:A
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Page 4
Comchip Technology CO., LTD.

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