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SS5817 THRU SS5819 SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS Reverse Voltage - 20 to 40 V Forward Current - 1 A Features * Plastic package has Underwriters Laboratory Classification 94V-0 * Metal silicon junction, majority carrier conduction * For surface mount applications * Guard ring for overvoltage protection * Low power loss, high efficiency * High current capability, Low forward voltage drop * High surge capability Mechanical Data * Case: SMA (DO-214AC) molded plastic case * Terminals: Solder plate, solderable per MIL-STD -750, method 2026 * Polarity: Color band denotes cathode end * Mounting Position: Any Maximum Ratings and Electrical Characteristics Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, resistive or inductive load, for capacitive load, derate by 20% Parameter Symbols SS5817 SS5818 SS5819 Units Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current 0.375" (9.5 mm) Load Length at TL = 90 OC Peak Forward Surge Current 8.3mS Single Half Sine-wave Superimposed on Rated Load (JEDEC Method) at TL = 70 OC Maximum Instantaneous Forward Voltage at 1 A O Maximum Instantaneous Reverse Current at Rated at TA = 25 C DC Blocking Voltage at TA =100 OC VRRM VRMS VDC I(AV) IFSM VF IR CJ RJA TJ ,TS 20 14 20 30 21 30 1 25 40 28 40 V V V A A 0.45 0.55 0.5 10 110 88 - 65 to + 125 0.6 V mA mA pF O Typical Junction Capacitance Typical Thermal Resistance 2) 1) C/W O Operating and Storage Temperature Range 1) 2) C Measured at 1 MHz and reverse voltage of 4 volts. Thermal Resistance (from Junction to Ambient) Vertical P.C.B Mounted, with 1.5 X 1.5" (38 X 38 mm) copper pads. SEMTECH ELECTRONICS LTD. (Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724) (R) Dated : 01/07/2008 J SS5817 THRU SS5819 SEMTECH ELECTRONICS LTD. (Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724) (R) Dated : 01/07/2008 J |
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