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| 58.42mm [2.300"] 1.27mm [0.050"] 32 31 26 25 7.00mm [0.276"] 1.27mm [0.050"] 21 Pin 1 23 24 TOP VIEW 45.72mm [1.800"] 87 17 18 32.51mm [1.280"] 9 10 15 16 1 6.50mm [0.256"] 43.94mm [1.730"] 4 SIDE VIEW 21.26mm [0.837"] 3 2 3.19mm [0.126"] 1 Substrate: 1.59mm 0.18mm [0.0625" 0.007"] per IPC 4101/21, gold surface finish. Substrate: 3.18mm 0.18mm [0.125" 0.007"] FR4/G10 or equivalent high temp material. Non-clad. Pins: shellmaterial- Brass Alloy 360 1/2 hard; finish- 0.25m [10"] Au over 1.27m [50"] Ni (min.). Contact material- BeCu; finish 0.25m [10"] Au over 2.54m [100"] Ni (min. ). Test points: material- Phosphor Bronze; platingSn over 1.27m [50"] Ni. Gold flash on contact end. 2 RoHS COMPLIANT 3 4 Description: Carrier Adaptor (CA) 32 position QFP ZIF socket (mini-grid on 0.040" centers) to 32 position mini grid socket with test points. Tolerances: diameters 0.03mm [0.001"], PCB perimeters 0.13mm [0.005"], PCB thicknesses 0.18mm [0.007"], pitches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CA-QFE32SA-M-Z-T-02F Drawing (c) 2008 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Drawing: E Smolentseva Scale: 1.5:1 Rev: A Date: 02/11/08 Modified: File: CA-QFE032SA-M-Z-T-02F Dwg |
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