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| QHDZ-2X-1.95G QUAD HYBRID REV: 001, 03/29/06 TECHNICAL DESCRIPTION * 1.7 - 2.0 GHz * LOW LOSS * HIGH ISOLATION * EXCELLENT PHASE/AMPLITUDE BALANCE * SURFACE MOUNT * TAPE & REEL AVAILABLE The Multi-Mix(R) QHD series provides a 3 dB 90 coupling with low insertion loss, low VSWR, and high isolation. Accurate phase and amplitude balance make this series ideal for use in IQ networks, power amplifiers, radio transceivers, receiver multicouplers and RF signal distribution and processing. QHD quad hybrids are fusion bonded multilayer stripline devices. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques. GENERAL SPECIFICATIONS FREQUENCY RANGE GHz 1.7 - 1.8 1.8 - 2.0 AMPLITUDE BALANCE (dB MAX) 0.40 0.30 PHASE BALANCE (MAX) ISOLATION (dB MIN) 18 INPUT POWER (CW, MAX) 30 W INSERTION LOSS (dB MAX) VSWR (MAX) 1.28:1 0.25 RF INTERFACE OPERATING TEMPERATURE 903 Surface Mount -55 - +85 C PACKAGE OUTLINE PORT 2 0.250 PORT 1 0.020 0.200 QHDZ-2X-1.95G Top View PORT 3 0.058 REF. PORT 4 Side View THE MULTI-MIX MICROTECHNOLOGY(R) GROUP IS ISO 9001:2000 REGISTERED U.S. Patent 6,099,677 and other Patents Pending. Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006 Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: crm@merrimacind.com / www.merrimacind.com TYPICAL PERFORMANCE QHDZ-2X-1.95G VSWR Port 1 1.5 1.4 1.3 1.2 1.1 1 1700 Coupling (dB) Coupling Port 3 Port 4 -2 -2.25 -2.5 Direct Coupled Port 2 VSWR -2.75 -3 -3.25 -3.5 -3.75 1725 1750 1775 1800 1825 1850 1875 Frequency (MHz) 1900 1925 1950 1975 2000 -4 1700 1725 1750 1775 1800 1825 1850 1875 1900 1925 1950 1975 2000 Frequency (MHz) Phase Balance 0 -85 -86 -87 Phase (degrees) -88 -89 -90 -91 -92 -93 -94 -95 1700 1725 1750 1775 1800 1825 1850 1875 1900 1925 1950 1975 2000 -30 1700 1725 1750 1775 1800 -25 Isolation (dB) -10 -15 -20 -5 Isolation 1825 1850 1875 1900 1925 1950 1975 2000 Frequency (MHz) Frequency (MHz) MOUNTING CONFIGURATION 50 OHM LINE .032 DIELECTRIC THICKNESS ER= 3.38 0.180 [4.57] GROUND VIAS PLATED THRU Ground plane of unit should be soldered to ground plane of circuit board for optimum performance 0.034 TYP. [0.86] 0.200 [5.08] 0.100 [2.54] 0.063 [1.60] 0.050 [1.27] 0.068 [1.73] GROUND PLANE TRUTH TABLE TRUTH TABLE 1 1 2 3 4 Input Iso -90 0 2 Iso Input 0 -90 3 -90 0 Input Iso 4 0 -90 Iso Input Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006 Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: crm@merrimacind.com / www.merrimacind.com |
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