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STB12NM50N,STD12NM50N,STI12NM50N STF12NM50N, STP12NM50N N-channel 500 V, 0.29 , 11 A MDmeshTM II Power MOSFET TO-220 - DPAK - D2PAK - I2PAK - TO-220FP Features Type STB12NM50N STD12NM50N STI12NM50N STF12NM50N STP12NM50N VDSS (@Tjmax) 550 V 550 V 550 V 550 V 550 V RDS(on) max 0.38 0.38 0.38 0.38 0.38 ID 3 11 A 11 A 11 A 11 A (1) 11 A 1 2 3 12 TO-220 3 1 IPAK DPAK 3 3 1 2 100% avalanche tested Low input capacitance and gate charge Low gate input resistance 1 DPAK TO-220FP Application Figure 1. Internal schematic diagram Switching applications Description This series of devices is realized with the second generation of MDmeshTM technology. This revolutionary Power MOSFET associates a new vertical structure to the company's strip layout to yield one of the world's lowest on-resistance and gate charge. It is therefore suitable for the most demanding high efficiency converters. Table 1. Device summary Marking B12NM50N D12NM50N I12NM50N F12NM50N P12NM50N Package DPAK DPAK IPAK TO-220FP TO-220 Packaging Tape and reel Tape and reel Tube Tube Tube Order codes STB12NM50N STD12NM50N STI12NM50N STF12NM50N STP12NM50N July 2008 Rev 8 1/19 www.st.com 19 Contents STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 4 5 6 Test circuit ................................................ 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2/19 STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Electrical ratings 1 Electrical ratings Table 2. Symbol Absolute maximum ratings Value Parameter TO-220 / IPAK TO-220FP DPAK / DPAK 500 25 11 6.7 44 100 15 --55 to 150 150 2500 11(1) 6.7(1) 44 (1) 25 Unit VDS VGS ID ID IDM (2) Drain-source voltage (VGS = 0) Gate-source voltage Drain current (continuous) at TC = 25 C Drain current (continuous) at TC=100 C Drain current (pulsed) Total dissipation at TC = 25 C Peak diode recovery voltage slope Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1 s;TC=25 C) Storage temperature Max. operating junction temperature V V A A A W V/ns V C C PTOT dv/dt(3) VISO Tstg TJ 1. Limited only by maximum temperature allowed 2. Pulse width limited by safe operating area 3. ISD 11A, di/dt 400A/s, VDD =80%V(BR)DSS Table 3. Symbol Thermal data Value Parameter TO-220 IPAK DPAK DPAK TO-220FP Thermal resistance junctioncase max Thermal resistance junction-amb max Thermal resistance junction-pcb max Maximum lead temperature for soldering purposes -62.5 -Unit Rthj-case Rthj-amb Rthj-pcb Tl 1.25 -50 300 -30 5 62.5 -- C/W C/W C/W C Table 4. Symbol IAS EAS Avalanche characteristics Parameter Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max) Single pulse avalanche energy (starting Tj=25C, Id=Ias, Vdd=50V) Value 5 350 Unit A mJ 3/19 Electrical characteristics STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N 2 Electrical characteristics (TCASE=25 C unless otherwise specified) Table 5. Symbol V(BR)DSS dv/dt(1) IDSS IGSS VGS(th) RDS(on) On/off states Parameter Drain-source breakdown voltage Test conditions ID = 1 mA, VGS= 0 Min 500 44 1 100 100 2 3 0.29 4 0.38 Typ. Max Unit V V/ns A A nA V Peak diode recovery voltage VDD=400 V, ID=11 A, slope VGS=10 V Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance VDS = max rating, VDS = max rating@125 C VGS = 20 V VDS= VGS, ID = 250 A VGS= 10 V, ID= 5.5 A 1. Characteristic value at turn off inductive load Table 6. Symbol gfs (1) Ciss Coss Crss Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Test conditions VDS =15 V, ID = 5.5 A VDS =50 V, f=1 MHz, VGS=0 Min Typ. 8 940 100 10 130 30 6 15 Max Unit S pF pF pF pF nC nC nC Coss eq(2) Equivalent output capacitance Qg Qgs Qgd Rg Total gate charge Gate-source charge Gate-drain charge VGS=0, VDS =0 to 400 V VDD=400 V, ID = 11 A VGS =10 V (see Figure 17) f=1 MHz Gate DC Bias=0 test signal level=20 mV open drain Gate input resistance 4.5 1. Pulsed: pulse duration=300 s, duty cycle 1.5% 2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS 4/19 STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Electrical characteristics Table 7. Symbol td(on) tr td(off) tf Switching times Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions VDD=250 V, ID= 5.5 A, RG=4.7 , VGS=10 V (see Figure 16) Min Typ. 15 15 60 14 Max Unit ns ns ns ns Table 8. Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current ISD=11 A, VGS=0 ISD=11 A, VDD=100 V di/dt = 100 A/s, (see Figure 18) ISD=11 A, di/dt = 100 A/s, VDD=100 V, Tj=150 C (see Figure 18) 340 3.5 20 420 4 20 Test conditions Min Typ. Max 11 44 1.3 Unit A A V ns C A ns C A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300 s, duty cycle 1.5% 5/19 Electrical characteristics STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N 2.1 Figure 2. Electrical characteristics (curves) Safe operating area for TO-220/ DPAK/ DPAK / IPAK Figure 3. Thermal impedance for TO-220/ DPAK/ DPAK / IPAK Figure 4. Safe operating area for TO-220FP Figure 5. Thermal impedance for TO-220FP Figure 6. Output characteristics Figure 7. Transfer characteristics 6/19 STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Figure 8. Transconductance Figure 9. Electrical characteristics Static drain-source on resistance Figure 10. Gate charge vs gate-source voltage Figure 11. Capacitance variations Figure 12. Normalized gate threshold voltage vs temperature Figure 13. Normalized on resistance vs temperature 7/19 Electrical characteristics STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Figure 15. Normalized BVDSS vs temperature Figure 14. Source-drain diode forward characteristics 8/19 STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Test circuit 3 Test circuit Figure 17. Gate charge test circuit Figure 16. Switching times test circuit for resistive load Figure 18. Test circuit for inductive load Figure 19. Unclamped Inductive load test switching and diode recovery times circuit Figure 20. Unclamped inductive waveform Figure 21. Switching time waveform 9/19 Package mechanical data STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/19 STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Package mechanical data TO-220 mechanical data mm Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 P Q 4.40 0.61 1.14 0.48 15.25 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ Max 4.60 0.88 1.70 0.70 15.75 Min 0.173 0.024 0.044 0.019 0.6 inch Typ Max 0.181 0.034 0.066 0.027 0.62 0.050 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 0.151 0.116 11/19 Package mechanical data STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N TO-220FP mechanical data Dim. A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia 28.6 9.80 2.9 15.90 9 3 mm. Min. 4.40 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.40 10 16 30.6 10.60 3.6 16.40 9.30 3.2 1.126 0.385 0.114 0.626 0.354 0.118 Typ Max. 4.60 2.7 2.75 0.70 1.00 1.50 1.50 5.20 2.70 10.40 Min. 0.173 0.098 0.098 0.017 0.030 0.045 0.045 0.195 0.094 0.393 0.630 1.204 0.417 0.141 0.645 0.366 0.126 inch Typ. Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.204 0.106 0.409 A B L3 L6 L7 Dia F1 D F G1 H F2 E L2 L5 123 L4 7012510-I 12/19 G STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Package mechanical data IPAK (TO-262) mechanical data mm Dim Min A A1 b b1 c c2 D e e1 E L L1 L2 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 Typ Max 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 Min 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.194 0.393 0.511 0.137 0.050 inch Typ Max 0.181 0.107 0.034 0.066 0.027 0.052 0.368 0.106 0.202 0.410 0.551 0.154 0.055 13/19 Package mechanical data STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N DPAK (TO-263) mechanical data mm Dim Min A A1 b b2 c c2 D D1 E E1 e e1 H J1 L L1 L2 R V2 4.40 0.03 0.70 1.14 0.45 1.23 8.95 7.50 10 8.50 2.54 4.88 15 2.49 2.29 1.27 1.30 0.4 0 8 0 5.28 15.85 2.69 2.79 1.40 1.75 0.192 0.590 0.099 0.090 0.05 0.051 Typ Max 4.60 0.23 0.93 1.70 0.60 1.36 9.35 10.40 Min 0.173 0.001 0.027 0.045 0.017 0.048 0.352 0.295 0.394 0.334 inch Typ Max 0.181 0.009 0.037 0.067 0.024 0.053 0.368 0.409 0.1 0.208 0.624 0.106 0.110 0.055 0.069 0.016 8 0079457_M 14/19 STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Package mechanical data TO-252 (DPAK) mechanical data DIM. A A1 A2 b b4 c c2 D D1 E E1 e e1 H L L1 L2 L4 R V2 0o 0.60 0.20 8o 4.40 9.35 1 2.80 0.80 1 6.40 4.70 2.28 4.60 10.10 mm. min. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 5.10 6.60 typ max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 0068772_G 15/19 Packaging mechanical data STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N 5 Packaging mechanical data DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 16.4 50 22.4 18.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0.795 0.645 0.724 1.968 0.881 BULK QTY 2500 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 B1 D D1 E F K0 P0 P1 P2 R W BASE QTY 2500 mm MIN. 6.8 10.4 1.5 1.5 1.65 7.4 2.55 3.9 7.9 1.9 40 15.7 16.3 inch MIN. MAX. 7 0.267 0.275 0.409 0.417 0.476 0.059 0.063 0.059 0.065 0.073 0.291 0.299 0.100 0.108 0.153 0.161 0.311 0.319 0.075 0.082 1.574 0.618 0.641 MAX. 10.6 12.1 1.6 1.85 7.6 2.75 4.1 8.1 2.1 16/19 STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956 BASE QTY 1000 * on sales type 17/19 Revision history STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N 6 Revision history Table 9. Date 24-May-2005 10-Jun-2005 28-Sep-2005 14-Oct-2005 06-Mar-2006 29-Mar-2006 14-Nov-2006 24-Jul-2008 Document revision history Revision 1 2 3 4 5 6 7 8 Initial release Inserted new row in Table 7.: Switching times Document status promoted from preliminary data to datasheet. Modified Figure 6, Figure 9 Modified Figure 8 Modified value on Table 5. Document reformatted no content change - Added IPAK; - Table 3: Thermal data has been updated; - Figure 11: Capacitance variations changed. Changes 18/19 STB12NM50N - STD12NM50N - STI/F12NM50N - STP12NM50N Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 19/19 |
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