View BD62321HFP_4901331.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

For brush motors
H-bridge driver
BD62321HFP
Overview BD62321HFP is full bridge driver for brush motor applications. This IC can operate at a wide range of power-supply voltages (from 6V to 32V), supporting output currents of up to 3A. MOS transistors in the output stage allow for PWM signal control. The replacement is also easy because of the pin compatible with BD623XHFP series.
No.09007EAT05
Features 1) Built-in one channel driver 2) Low standby current 3) Supports PWM control signal input (20kHz to 100kHz) 4) Cross-conduction prevention circuit 5) Four protection circuits provided: OCP, OVP, TSD, UVLO and SAP
Applications VCR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals; car audios; car navigation systems; OA equipments
Absolute maximum ratings (Ta=25C, All voltages are with respect to ground) Parameter Supply voltage Output current All other input pins Operating temperature Storage temperature Power dissipation Junction temperature Symbol VCC IOMAX VIN TOPR TSTG Pd Tjmax Ratings 36 3.0 *
1
Unit V A V C C W C
-0.3 ~ VCC -40 ~ +85 -55 ~ +150 1.4 * 150
2
*1 Do not, exceed Pd or ASO. *2 HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/C above 25C.
Operating conditions (Ta=25C) Parameter Supply voltage Symbol VCC Ratings 6 ~ 32 Unit V
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
1/10
2009.10 - Rev.A
BD62321HFP
Electrical characteristics (Unless otherwise specified, Ta=25C and VCC=24V) Limits Parameter Supply current Stand-by current Input high voltage Input low voltage Input bias current Output ON resistance Input frequency range Symbol Min. ICC ISTBY VIH VIL IIH RON FMAX 0.7 2.0 30 0.5 20 Min. 1.4 0 50 1.0 Min. 2.2 10 0.8 100 1.5 100 mA A V V A kHz VIN=5.0V Limits
Technical Note
Conditions Forward / Reverse / Brake Stand-by
IO=1.0A, vertically total FIN / RIN
Block diagram and pin configuration BD62321HFP
VCC 1 PROTECT
Table 1 BD62321HFP
7 FIN 3 CTRL RIN 5 VCC
Pin 1 2
Name VCC OUT1 FIN GND RIN OUT2 VCC GND
Function Power supply Driver output Control input (forward) Ground Control input (reverse) Driver output Power supply Ground
4 FIN GND 2 OUT1 6 OUT2
GND
3 4 5 6 7 FIN
Fig.1 BD62321HFP
Note: Use all VCC pin by the same voltage.
Fig.2 HRP7 package
VCC OUT2 RIN GND FIN OUT1 VCC
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
2/10
2009.10 - Rev.A
BD62321HFP
Electrical characteristic curves (Reference data)
2.0 8 -40C 25C 85C 6 1.5
Technical Note
Stand-by Current:STBY [ A] I
Circuit Current: Icc [mA]
Internal Logic: H/L [-] _
1.0 -40C 25C 85C -40C 25C 85C
1.5
4
0.5
1.0 85C 25C -40C 0.5 6 12 18 24 30 36 Supply Voltage: Vcc [V]
2
0.0
0 6 12 18 24 30 36 Supply Voltage: Vcc [V]
-0.5 0.8 1.2 1.6 2 Input Voltage: VIN [V]
Fig.3 Supply current
1.0 Internal signal: Release [V] _ 85C 25C -40C 9
Fig.4 Stand-by current
54 Internal signal: Release [V] _ 85C 25C -40C 6 45 36 27 18 9 0 0 4.5 5 5.5 6
Fig.5 Input threshold voltage
Input Bias Current: IIH [mA]
0.8
0.6
0.4
3
85C 25C -40C
0.2
0.0 0 6 12 18 24 30 36 Input Voltage: VIN [V]
36
40
44
48
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Fig.6 Input bias current
3 Output Voltage: VCC-VOUT [V] 2.5 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 Output Current: IOUT [A]
Output Voltage:VCC- VOUT [V] 2
Fig.7 Under voltage lock out
1.5
-40C 25C 85C 1.5
Fig.8 Over voltage protection
Internal Logic: H/L [-] _
85C 25C -40C
85C 25C -40C 1.0
1
0.5
0.5
0.0
0 0 0.5 1 1.5 2 2.5 3 Output Current: IOUT [A]
-0.5 4 4.2 4.4 4.6 4.8 5 Load Current [A]
Fig.9 Output high voltage
3 2.5 Output Voltage: VOUT [V] 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 Output Current: IOUT [A] 0 0 85C 25C -40C 2
Fig.10 High side body diode
Fig.11 Over current protection (H side)
1.5
Output Voltage: VOUT [V]
1.5
Internal Logic: H/L [-] _
-40C 25C 85C
85C 25C -40C 1.0
1
0.5
0.5
0.0
-0.5 0.5 1 1.5 2 2.5 3 4 4.2 4.4 4.6 4.8 5 Output Current: IOUT [A] Load Current [A]
Fig.12 Output low voltage
Fig.13 Low side body diode
Fig.14
Over current protection (L side)
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
3/10
2009.10 - Rev.A
BD62321HFP
Functional descriptions 1) Operation modes Table 2 Logic table FIN a b c d e f L H L H PWM L RIN L L H H L PWM OUT1 Hi-Z* H L L H
__________
Technical Note
OUT2 Hi-Z* L H L
__________
Operation Stand-by (idling) Forward (OUT1 > OUT2) Reverse (OUT1 < OUT2) Brake (stop) Forward (PWM control) Reverse (PWM control)
PWM H
PWM
* Hi-Z is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.
a) Stand-by mode In stand-by mode, all internal circuits are turned off, including the output power transistors. Motor output goes to high impedance. If the motor is running at the switch to stand-by mode, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50s before shutting down all circuits. b) Forward mode This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. c) Reverse mode This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. d) Brake mode This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to the stand-by mode (rather than the brake mode) to save power and reduce consumption.
OFF M OFF
OFF
ON M
OFF OFF M ON ON
ON
OFF M
OFF
OFF OFF
OFF
ON
ON
a) Stand-by mode
b) Forward mode
c) Reverse mode
d) Brake mode
Fig.15 Four basic operations (output stage)
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
4/10
2009.10 - Rev.A
BD62321HFP
Technical Note
e) f) PWM control mode The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the low side output does the switching, corresponding to the input signal. The switching operates by the output state toggling between "L" and "Hi-Z". The PWM frequency can be input in the range between 20kHz and 100kHz. Note that control may not be attained by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. Also, circuit operation may not respond correctly when the input signal is higher than 100kHz. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10F or more is recommended) between VCC and ground.
ON M OFF
OFF
ON M
OFF
ON
OFF
OFF
Control input : H
Control input : L
Fig.16 PWM control operation (output stage)
FIN RIN OUT1 OUT2
Fig.17 PWM control operation (timing chart)
2) Cross-conduction protection circuit In the full bridge output stage, when the upper and lower transistors are turned on at the same time, and this condition exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to ground, resulting in a loss. This circuit protects against the rush current by providing a dead time (about 800ns, nominal) at the transition. 3) Output protection circuits a) Under voltage lock out (UVLO) circuit To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.3V (nominal) or below, the controller forces all driver outputs to high impedance. When the voltage rises to 5.5V (nominal) or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation. b) Over voltage protection (OVP) circuit When the power supply voltage exceeds 45V (nominal), the controller forces all driver outputs to high impedance. The OVP circuit is released and its operation ends when the voltage drops back to 40V (nominal) or below. This protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
5/10
2009.10 - Rev.A
BD62321HFP
Technical Note
c) Thermal shutdown (TSD) circuit The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175C nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (150C nominal). Thus, it is a self-returning type circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. d) Over current protection (OCP) circuit To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current for the circuit's monitoring time (10s, nominal). When the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290s, nominal). The IC returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit works independently for each channel.
Threshold Iout
0 CTRL Input Internal status Monitor / Timer ON mon. OFF off timer ON
Fig.18
Over current protection (timing chart)
e) Safe area protection (SAP) circuit To protect the output MOS transistors from ASO, ground faults, power supply line faults and load short circuits, the SAP circuit monitors the conditions for the circuit's monitoring time (10s, nominal). When the protection circuit detects to exceed ASO, the controller forces all driver outputs to high impedance and latch in the state. It is released that via standby mode during 150s or more by the control inputs FIN and RIN.
ASO (Area of Safety Operation) ~Reference data~
10
T ON=100ms TON=10ms T ON1ms
10
T ON=10ms TON=1ms TON100s T ON=100ms
3 IDS [A]
IDS [A]
3
1
1
0.1 1 10 VDS [V] 36 100
0.1 1 10 VDS [V] 36 100
Fig.19 ASO curve (Ta=25C)
Fig.20 ASO curve (Tj=150C)
When using this IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. The output protection circuits are effective only in the area of safety operation.
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
6/10
2009.10 - Rev.A
BD62321HFP
Thermal design
10.0
iv) 4 layers PCB(copper foil: 70mm x 70mm) iii) 2 layers PCB (copper foil: 70mm x 70mm) ii) 2 layers PCB (copper foil: 15mm x 15mm) i) 1 layer PCB (copper foil: 10.5mm x 10.5mm) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
Technical Note
8.0
iv) 7.3W
Table 3 Thermal resistance Board Board (4) j-a [C/W] 17.1 22.7 54.4 89.3
Pd [W]
6.0
iii) 5.5W
4.0
ii) 2.3W
Board (3) Board (2) Board (1)
50 75 100 125 150
2.0
i) 1.4W
0.0 0 25 AMBIENT TEMPERATURE [C]
* Transient thermal resistance is measured data only; values are not guaranteed.
Fig.21 Thermal derating curve (HRP7 package) Thermal design needs to meet the following operating conditions. In creating the thermal design, sufficient margin must be provided to guarantee the temperature conditions below. 1. The ambient temperature Ta must be 85C or below 2. The junction temperature Tj must be 150C or below The junction temperature Tj can be determined using the following equation. Tj Ta + j-a x Pc [C] The power consumption Pc can be determined using the following equation. Refer to page 3 about VON(H) and VF(H).
2 Pc (IOUT x RON) x D + IOUT x (VON(H) + VF(H)) x (1 - D) + VCC x ICC [W]
Example) Conditions: Ta=50C, VCC=24V, Iout=0.5A, D (on duty)=100%. The power consumption of the IC and the junction temperature are as follows:
2 Pc 0.5 x 1.0 + 24 x 1.7m = 290.8mW Tj 50 + 89.3 x 290.8m = 76 [C]
Where the Tjmax parameter is 150C and the derating is set to 80 percents, the maximum ambient temperature Tamax is determined as follows. Ta Tjmax x 0.8 - j-a x Pc 94 [C] In this example, thermal design can be considered satisfactory (meaning that there are no problems in thermal design), since the system meets the operating temperature conditions.
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
7/10
2009.10 - Rev.A
BD62321HFP
Interfaces
VCC
Technical Note
FIN RIN
100k 100k
OUT1 OUT2
GND
Fig.22 FIN / RIN
Fig.23 OUT1 / OUT2
Notes for use 1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures - such as adding fuses - if any value in excess of absolute maximum ratings is to be implemented. 2) Connecting the power supply connector backward Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode. 3) Power supply lines Return current generated by the motor's Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10F, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors - including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND. 4) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set's reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the same way, care must be taken to avoid changes in the GND wire pattern in any external connected component. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error, or if pins are shorted together. 7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields.
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
8/10
2009.10 - Rev.A
BD62321HFP
Technical Note
8) ASO - Area of Safety Operation When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9) Built-in thermal shutdown (TSD) circuit The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. 10) Capacitor between output and GND In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1F between output and GND. 11) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 12) Switching noise When the operation mode is in PWM control, PWM switching noise may effects to the control input pins and cause IC malfunctions. In this case, insert a pulled down resistor (10k is recommended) between each control input pin and ground. 13) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Do not force the voltage of the input pins in excess of 5.5V when the power does not supply to the IC.
Pin A Resistor Pin A
N N P+ P P+ N N P+ N P P
+
Pin B
C
B E
Transistor (NPN)
Pin B
B N
C E
P substrate Parasitic element
GND
P substrate Parasitic element
GND GND GND
Parasitic element
Other adjacent elements
Appendix: Example of monolithic IC structure
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
9/10
2009.10 - Rev.A
BD62321HFP
Ordering part number
Technical Note
B
D
6
Type
2
3
2
1
H
F
P
-
T
R
ROHM part number
Package HFP: HRP7
Packaging spec. TR: Embossed taping
HRP7

9.3950.125 (MAX 9.745 include BURR)
1.0170.2
Tape
1.9050.1
Embossed carrier tape 2000pcs TR
The direction is the 1pin of product is at the upper right when you hold
8.820.1 (5.59)
Quantity Direction of feed
1.5230.15
0.8350.2
10.540.13
8.00.13
(7.49)
( reel on the left hand and you pull out the tape on the right hand
1pin
)
0.8875
12 34 5 6 7
+5.5 4.5 -4.5 0.730.1 +0.1 0.27 -0.05 S
0.080.05
1.27
0.08 S
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
www.rohm.com
c 2009 ROHM Co., Ltd. All rights reserved.
10/10
2009.10 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com (c) 2009 ROHM Co., Ltd. All rights reserved.
R0039A

▲Up To Search▲

Price & Availability of BD62321HFP

	To Download BD62321HFP Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .