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MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
LOW THERMAL STRESS STRUCTURE - PASS 5 CYCLE (-55 C TO +150 C) THERMAL SHOCK TEST
DIOTEC ELECTRONICS CORP
2#1 0)&"! | (c) |('% $# (c) D SEU T&Q P)GEC)4 A8653 SR IHF D B @97 4 i v u s r i gf d b Y W cg wEt 0q pEche 0caXXV
PROPRIETARY HIGH TEMPERATURE JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
PRESS FIT INTO HEAT SINK TO FURTHER ENHANCE HEAT HANDLING CAPABILITY
HUGE ROUND DIE FOR ULTRA HIGH POWER & HEAVY DUTY PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 5% of Die Area)
MECHANICAL DATA
FEATURES
75 AMP PRESS FIT HIGH VOLTAGE DIODES
0.505"/502" OVER KNURL
0.007" 0.005"
DT B7504A 0452
70 Typ.
MECHANICAL SPECIFICATION
78 Places Equally Spaced
_ 0.052" + 0.002"
ALL DIMENSIONS IN INCHES
RoH
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0.173" 0.157"
0.194" 0.184"
Data Sheet No. B75PF-1A
AN PLI OM SC
ROUND DIE 0.250"
0.401" 0.385" 0.039" 0.031"
1.02" 0.98"
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