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PTFA080551E PTFA080551F Confidential, Limited Internal Distribution Thermally-Enhanced High Power RF LDMOS FETs 55 W, 869 - 960 MHz Description The PTFA080551E and PTFA080551F are 55-watt LDMOS FETs designed for EDGE and CDMA power amplifier applications in the 869 to 960 MHz band. Features include input matching and thermallyenhanced packages with slotted or earless flanges. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability. PTFA080551E Package H-36265-2 PTFA080551F Package H-37265-2 Three-carrier CDMA2000 Performance VDD = 28 V, IDQ = 450 mA, = 960 MHz Features * * -35 -40 -45 Broadband internal matching Typical EDGE performance - Average output power = 26 W - Gain = 18 dB - Efficiency = 44% Typical CW performance - Output power at P-1dB = 75 W - Gain = 17 dB - Efficiency = 67% Integrated ESD protection: Human Body Model, Class 2 (minimum) Excellent thermal stability, low HCI drift Capable of handling 10:1 VSWR @ 28 V, 55 W (CW) output power Pb-free and RoHS compliant 40 35 Adj. Ch. Power Ratio (dBc) Efficiency Drain Efficiency (%) 30 25 * ACP Low 20 15 10 5 0 29 31 33 35 37 39 41 43 -50 -55 -60 ACP Up ALT Up * * * * -65 -70 Output Power, Avg. (dBm) RF Characteristics EDGE Measurements (not subject to production test--verified by design/characterization in Infineon test fixture) VDD = 28 V, IDQ = 450 mA, POUT = 26 W AVG, = 959.8 MHz Characteristic Error Vector Magnitude Modulation Spectrum @ 400 kHz Modulation Spectrum @ 600 kHz Gain Drain Efficiency All published data at TCASE = 25C unless otherwise indicated Symbol EVM (RMS) ACPR ACPR Gps Min -- -- -- -- -- Typ 2.5 -60 -75 18 44 Max -- -- -- -- -- Unit % dBc dBc dB % D *See Infineon distributor for future availability. ESD: Electrostatic discharge sensitive device--observe handling precautions! Data Sheet 1 of 11 Rev. 03, 2008-10-22 PTFA080551E PTFA080551F Confidential, Limited Internal Distribution RF Characteristics (cont.) Two-tone Measurements (tested in Infineon test fixture) VDD = 28 V, IDQ = 600 mA, POUT = 55 W PEP, = 960 MHz, tone spacing = 1 MHz Characteristic Gain Drain Efficiency Intermodulation Distortion Symbol Gps Min 18 46.5 -- Typ 18.5 48 -31 Max -- -- -29 Unit dB % dBc D IMD DC Characteristics Characteristic Drain-Source Breakdown Voltage Drain Leakage Current Conditions VGS = 0 V, IDS = 10 A VDS = 28 V, V GS = 0 V VDS = 63 V, V GS = 0 V Symbol V(BR)DSS IDSS IDSS RDS(on) VGS IGSS Min 65 -- -- -- 2.0 -- Typ -- -- -- 0.15 2.3 -- Max -- 1.0 10.0 -- 3.0 1.0 Unit V A A V V A On-State Resistance Operating Gate Voltage Gate Leakage Current VGS = 10 V, V DS = 0.1 V VDS = 28 V, IDQ = 450 mA VGS = 10 V, V DS = 0 V Maximum Ratings Parameter Drain-Source Voltage Gate-Source Voltage Junction Temperature Total Device Dissipation Above 25C derate by Storage Temperature Range Thermal Resistance (TCASE = 70C) TSTG RJC Symbol VDSS VGS TJ PD Value 65 -0.5 to +12 200 219 1.25 -40 to +150 0.8 Unit V V C W W/C C C/W Ordering Information Type and Version PTFA080551E PTFA080551F V4 V4 Package Outline H-36265-2 H-37265-2 Package Description Thermally-enhanced, slotted flange, single-ended Thermally-enhanced, earless flange, single-ended Shipping Tray Tray Marking PTFA080551E PTFA080551F *See Infineon distributor for future availability. Data Sheet 2 of 11 Rev. 03, 2008-10-22 PTFA080551E PTFA080551F Confidential, Limited Internal Distribution Typical Performance (data taken in a production test fixture) Edge EVM and Modulation Spectrum vs. Quiescent Current VDD = 28 V, = 959.8 MHz, POUT = 22 W 2.1 1.9 -20 EDGE Modulation Spectrum Performance VDD = 28 V, IDQ = 450 mA, = 959.8 MHz 0 55 Modulation Spectrum (dBc) EVM -30 -40 -50 Modulation Spectrum (dBc) Efficiency Drain Efficiency (%) -20 -40 45 35 EVM RMS (avg. %) . 1.7 1.5 1.3 1.1 0.9 0.7 0.35 400 kHz -60 -70 400 kHz -60 -80 25 15 5 32 34 36 38 40 42 44 46 600 kHz 0.40 0.45 0.50 0.55 -80 600 kHz -90 0.60 -100 Quiescent Current (A) Output Power (dBm) EDGE EVM Performance VDD = 28 V, IDQ = 450 mA, = 959.8 MHz Intermodulation Distortion vs. Output Power (as measured in a broadband circuit) VDD = 28 V, IDQ = 450 mA, 1 = 959 MHz, 2 = 960 MHz 55 45 35 25 15 5 -20 -30 10 8 6 4 2 0 32 34 36 38 40 42 44 46 EVM RMS (avg. %) . Drain Efficiency (%) IMD (dBc) Efficiency -40 -50 3rd Order 5th -60 EVM 7th -70 30 33 36 39 42 45 48 Output Power (dBm) Output Power, Avg. (dBm) Data Sheet 3 of 11 Rev. 03, 2008-10-22 PTFA080551E PTFA080551F Confidential, Limited Internal Distribution Typical Performance (cont.) IM3 vs. Output Power at Selected Biases VDD = 28 V, 1 = 959, 2 = 960 MHz Linear Broadband Performance VDD = 28 V, IDQ = 600 mA, POUT Avg = 44.39 dBm -20 51 40 30 -30 Efficiency (%) IMD (dBc) 300 mA 450 mA Gain 49 48 47 46 45 20 10 0 -10 -20 Efficiency -40 -50 Return Loss -60 29 31 33 35 37 39 41 43 45 47 44 860 880 900 920 940 -30 960 Output Power, Avg. (dBm) Frequency (MHz) Power Sweep VDD = 28 V, = 960 MHz Gain & Efficiency vs. Output Power VDD = 28 V, IDQ = 600 mA, = 960 MHz 19 21 70 60 IDQ = 600 mA Power Gain (dB) 18 20 19 Gain 50 40 18 17 16 15 30 17 IDQ = 450 mA 16 IDQ = 300 mA Efficiency 20 10 15 36 38 40 42 44 46 48 50 14 36 38 40 42 44 46 48 50 Output Power (dBm) Output Power (dBm) Data Sheet 4 of 11 Rev. 03, 2008-10-22 Drain Efficiency (%) Gain (dB) Gain, Return Loss (dB) 600 mA 50 PTFA080551E PTFA080551F Confidential, Limited Internal Distribution Typical Performance (cont.) Output Power (P-1dB) vs. Drain Voltage IDQ = 600 mA, = 960 MHz IS-95 CDMA Performance VDD = 28 V, IDQ = 450 mA, = 960 MHz TCASE = 25C 45 40 51 50 TCASE = 90C Efficiency 0 Output Power (dBm) 49 48 47 46 45 24 26 28 30 32 Drain Efficiency (%) 35 30 25 20 15 10 5 0 29 31 33 35 37 39 41 43 -20 -30 ACP FC - 0.75 MHz -40 -50 -60 -70 ACPR FC + 1.98 MHz -80 -90 Drain Voltage (V) Output Power, Avg. (dBm) Bias Voltage vs. Temperature Voltage normalized to typical gate voltage, series show current 0.778 A 1.03 1.55 A 3.11 A 3.88 A 4.66 A 5.44 A 0.99 0.98 0.97 0.96 -20 0 20 40 60 80 100 6.22 A 7.00 A Normalized Bias Voltage (V) 1.02 1.01 1.00 Case Temperature (C) Data Sheet 5 of 11 Rev. 03, 2008-10-22 Adj. Ch. Power Ratio (dBc) -10 PTFA080551E PTFA080551F Confidential, Limited Internal Distribution Broadband Circuit Impedance D Z Source Z Load G S Frequency MHz 869 880 894 920 960 R Z Source jX -10.93 -8.28 -5.43 -7.16 -5.57 8.91 3.72 5.93 4.87 6.05 Z Load R 7.42 4.65 4.61 4.88 4.89 jX -1.63 -1.74 0.16 -0.59 0.86 See next page for circuit information Data Sheet 6 of 11 Rev. 03, 2008-10-22 PTFA080551E PTFA080551F Confidential, Limited Internal Distribution Reference Circuit C1 0.001F R2 1.3K V R1 1.2K V Q1 BCP56 C2 0.001F C3 0.001F R3 2K V R4 2K V R5 5.1 V C4 10F 35V QQ1 LM7805 VDD R6 10 V C5 0.1F R7 5.1K C6 0.1F C7 0.01F C8 33pF C12 33pF C13 1F C14 10F 50V L1 VDD C15 0.1F C16 10F 50V l5 R8 10 V C9 33pF DUT l6 C23 33pF R F_IN l1 l2 l3 C10 3.3pF l4 C11 1.0pF l8 l9 l10 C22 0.3pF L2 l11 a 001f c 0- 85e_h601 s_ 33 R F_OUT l7 C17 33F C18 1F C19 10F 50V C20 0.1F C21 10F 50V Reference circuit schematic diagram for = 960 MHz Circuit Assembly Information DUT PCB PTFA080551E or PTFA080551F 0.76 mm [.030"] thick, r = 4.5 LDMOS Transistor Rogers TMM4 2 oz. copper Microstrip Electrical Characteristics at 960 MHz1 0.070 0.122 0.031 0.063 0.162 0.150 0.198 0.145 0.009 0.026 , 50.0 , 50.0 , 50.0 , 7.5 , 67.0 , 55.0 , 11.1 , 38.0 , 38.0 , 50.0 Dimensions: L x W (mm) 12.19 x 1.37 20.93 x 1.37 5.31 x 1.37 9.58 x 16.21 28.45 x 0.79 25.65 x 1.17 30.73 x 10.46 24.21 x 2.16 1.52 x 2.16 4.50 x 1.37 Dimensions: L x W (in.) 0.480 0.824 0.209 0.377 1.120 1.010 1.210 0.953 0.060 0.177 x x x x x x x x x x 0.054 0.054 0.054 0.638 0.031 0.046 0.412 0.085 0.085 0.054 l1 l2 l3 l4 l5 l6, l7 l8 l9 l10 l11 1Electrical characteristics are rounded. Data Sheet 7 of 11 Rev. 03, 2008-10-22 PTFA080551E PTFA080551F Confidential, Limited Internal Distribution Reference Circuit (cont.) R5 C4 C5 C8 C7 C6 R6 R4 R3 C3 C1 QQ1 R7 R1R2 Q1 R8 C2 C12 L1 C13 C14 C16 C15 C22 C23 C9 C10 C11 C19 C17 C18 L2 C21 C20 A080551in_01 A080551out_01 a080551ef assy- 06-03-14 _ Reference circuit assembly diagram (not to scale)* Component C1, C2, C3 C4 C5, C6, C15, C20 C8, C9, C12, C17, C23 C7 C10 C11 C13, C18 C14, C16, C19, C21 C22 L1, L2 Q1 QQ1 R1 R2 R3 R4 R5, R7 R6, R8 Description Capacitor, 0.001 F Tantalum capacitor, 10 F, 35 V Capacitor, 0.1 F Ceramic capacitor, 33 pF Capacitor, 0.01 F Ceramic capacitor, 3.3 pF Ceramic capacitor, 1.0 pF Capacitor, 1.0 F Tantalum capacitor, 10 F, 50 V Ceramic capacitor, 0.3 pF Ferrite, 8.9 mm Transistor Voltage regulator Chip Resistor 1.2 k-ohms Chip Resistor 1.3 k-ohms Chip Resistor 2 k-ohms Potentiometer 2 k-ohms Chip Resistor 5.1 k-ohms Chip Resistor 10 ohms Suggested Manufacturer Digi-Key Digi-Key Digi-Key ATC ATC ATC ATC ATC Garrett Electronics ATC Elna Magnetics Infineon Technologies National Semiconductor Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key P/N or Comment PCC1772CT-ND 399-1655-2-ND PCC104BCT-ND 100B 330 200B 103 100B 3R3 100B 1R0 920C105 TPSE106K050R0400 100B 0R3 BDS 4.6/3/8.9-4S2 BCP56 LM7805 P1.2KGCT-ND P1.3KGCT-ND P2KECT-ND 3224W-202ETR-ND P5.1KECT-ND P10ECT-ND *Gerber Files for this circuit available on request Data Sheet 8 of 11 Rev. 03, 2008-10-22 PTFA080551E PTFA080551F Confidential, Limited Internal Distribution Package Outline Specifications Package H-36265-2 45 X 2.03 [.080] 2X 7.11 [.280] 6. ALL FOUR CORNERS D S FLANGE 9.78 [.385] 3.05 [.120] C L 2.66.51 [.105.020] LID 10.16.25 [.400.010] 15.49.51 [.610.020] 2X R1.52 [R.060] 4X R0.63 [R.025] MAX C L G C66065-A2326-C001-01-0027 H-36265-2.dwg 15.23 [.600] 4X R1.52 [R.060] SPH 1.57 [.062] 10.16.25 [.400.010] 3.61.38 [.142.015] 0.0381 [.0015] -A1.02 [.040] 20.31 [.800] 6. Diagram Notes--unless otherwise specified: 1. 2. 3. 4. 5. 6. 7. Interpret dimensions and tolerances per ASME Y14.5M-1994. Primary dimensions are mm. Alternate dimensions are inches. Pins: D = drain, S = source, G = gate. Lead thickness: 0.10 +0.051/-0.025 [.004 +.002/-.001]. Gold plating thickness: S, D, G - flange & leads: 1.14 0.38 micron [45 15 microinch] Exposed metal plane on top and bottom of ceramic insulator. All tolerances 0.1 [.025] / 0.127 [.005] unless specified otherwise. Data Sheet 9 of 11 Rev. 03, 2008-10-22 PTFA080551E PTFA080551F Confidential, Limited Internal Distribution Package Outline Specifications (cont.) Package H-37265-2 45 X 2.03 [.080] 6. 2X 7.11 [.280] ALL FOUR CORNERS D 2.66.51 [.105.020] FLANGE 10.16 [.400] C L LID 10.16.25 [.400.010] 15.49.51 [.610.020] G 4X R0.63 [R.025] MAX C66065-A2327-C001-01-0027 H-37265-2.dwg C L SPH 1.57 [.062] 10.16.25 [.400.010] 3.61.38 [.142.015] 0.0381 [.0015] -A1.02 [.040] 10.16 [.400] S 1. 2. 3. 4. 5. 6. 7. Diagram Notes--unless otherwise specified: Interpret dimensions and tolerances per ASME Y14.5M-1994. Primary dimensions are mm. Alternate dimensions are inches. Pins: D = drain, S = source, G = gate. Lead thickness: 0.10 +0.051/-0.025 [.004 +.002/-.001]. Gold plating thickness: S, D, G - flange & leads: 1.14 0.38 micron [45 15 microinch] Exposed metal plane on top and bottom of ceramic insulator. All tolerances 0.1 [.025] / 0.127 [.005] unless specified otherwise. Find the latest and most complete information about products and packaging at the Infineon Internet page http://www.infineon.com/rfpower Data Sheet 10 of 11 Rev. 03, 2008-10-22 PTFA080551E/F Confidential, Limited Internal Distribution Revision History: 2008-10-22 2008-10-14, Data Sheet Previous Version: Page 5 9, 10 11 Subjects (major changes since last revision) Remeasure Voltage vs. Temperature Update package outline diagrams and information Update company information. Data Sheet We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: highpowerRF@infineon.com To request other information, contact us at: +1 877 465 3667 (1-877-GO-LDMOS) USA or +1 408 776 0600 International GOLDMOS(R) is a registered trademark of Infineon Technologies AG. Edition 2008-10-22 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com/rfpower). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Data Sheet 11 of 11 Rev. 03, 2008-10-22 |
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