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| DN(X) diode terminator network EU features * * * * Fast reverse recovery time * Fast turn on time Low capacitance * SMD packages 16 kV IEC61000-4-2 capable Products with lead-free terminations meet EU RoHS and China RoHS requirements circuit protection applications * Signal termination * Signal conditioning dimensions and construction S03 L P Bonding Wire Die Pad W Molded Resin Si Wafer Lead d Molded Resin W Die Si Pad Wafer * ESD suppression * Transient suppression S04 L p Bonding Wire Lead d Package Total Code Power S03 S04 S06 N08 225mw 225mw 225mw 400mw 1000mw 1000mw Pins 3 4 6 8 20 24 Dimensions inches (mm) L 0.2 W 0.2 p 0.1 Pkg Ht d 0.05 0.2 .115 (2.92) .115 (2.92) .115 (2.92) .190 (4.83) .341 (8.66) .341 (8.66) .091 (2.30) .091 (2.30) .110 (2.80) .236 (5.99) .236 (5.99) .236 (5.99) .075 (1.91) .075 (1.91) .037 (0.95) .050 (1.27) .025 (0.635) .025 (0.635) .037 (0.95) .037 (0.95) .037 (0.95) .063 (1.60) .063 (1.60) .063 (1.60) .017 (0.43) .017 (0.43) .017 (0.43) .016 (0.41) .010 (0.25) .010 (0.25) S06 L p N08, Q20, Q24 Bonding Wire Lead L Bonding Wire d p Lead Q20 Q24 W Si Wafer Molded Resin W d Die Pad Die Pad Si Wafer Molded Resin circuit schematic 1 1 DNA: 20 pins DN2: 20 pins 1 DN3: 6 pins 1 DN4: 4 pins 1 DN5: 24 pins 1 DN6: 8 pins 1 DN7: 24 pins For further information on packaging, please refer to Appendix A. Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 11/21/08 200 KOA Speer Electronics, Inc. * 199 Bolivar Drive * Bradford, PA 16701 * USA * 814-362-5536 * Fax: 814-362-8883 * www.koaspeer.com DN(X) diode terminator network ordering information New Part # DNA Type DNA DN2 DN3 DN4 DN5 DN6 DN7 Q20 Package Symbol Package type symbol + number of pins S03: 3 pin SOT23 S04: 4 pin SOT23 S06: 6 pin SOT23 N08: 8 pin Narrow SOIC Q20: 20 pin QSOP Q24: 24 pin QSOP T Termination Material T: Sn (Other termination styles available, contact factory for options) TEB Packaging TE: 7" embossed plastic TEB: 13" embossed plastic tape application schematic ESD Suppression Transient + Rail Driver - Rail or GND - Rail or GND Transient Suppressed Receiver Driver Signal Conditioning Signal Ringing + Rail Receiver Ringing Eliminate applications and ratings Part Designation DN(X) Forward Voltage 1F=50ma 0.4 to 1.2V Reverse Breakdown Voltage 1R=1ma 7.2V Leakage Current @7V 1uA Capacitance @1Mhz 2pF ESD Voltage Capability IEC 61000-4-2 16kV Operating Temperature Range -55C to +125C Continuous Forward Current* 50mA * One diode conducting Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 11/21/08 KOA Speer Electronics, Inc. * 199 Bolivar Drive * Bradford, PA 16701 * USA * 814-362-5536 * Fax: 814-362-8883 * www.koaspeer.com 201 circuit protection |
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