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MATRIX TRANSCEIVER MODULES
ZMXM-400 Series
Integrated Transceiver Module for ZigBee / IEEE 802.15.4 Evaluation Kits available
DESCRIPTION
effective solution for data links and wireless networks. The module design is based on the IEEE 802.15.4 standard and supports peer-to-peer, star, and mesh networking. The Matrix module is offered with two transmitter output power options, either 10mW or 100mW, providing for The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost-
enhanced range performance over standard IEEE 802.15.4/ZigBee
implementations with the integrated power amplifier. Additionally, each
module offers a Dynamic Power Configuration capability giving the ability to imperative.
bypass the power amplifier for a 1mW power output when low power operation is The Matrix module consists of the Texas Instruments CC2430, 10mW or 100mW Power Amplifier, and integrated PCB
trace antenna. The module has the option to be populated with a MMCX connector for use with an external cabled ules provide the lowest cost, best in class performance, in a compact form factor.
antenna. The module is FCC, IC, and CE certified for fast and simple integration into end applications. The Matrix mod-
FEATURES
* Supports LS Research or Z-StackTM protocols * Miniature Footprint: 10mW ( 23.4 x 28.7 mm) 100mW (23.4 x 31.2 mm) * Integrated certified PCB trace antenna * Optional MMCX connector for external antenna * 16 RF channels (Channel 16 operates at reduced power levels) * Long Range: 10mW - up to 2000 feet 100mW - up to 4000 feet * Output power software controlled: 1mW - 10mW or 1mW - 100mW * 17 General Purpose I/O ports * Windows(R) Based Test Tools * Serial UART interface * Lowest Power Consumption * Compliance Certification: 10mW - FCC (USA), IC (Canada), and CE (Europe) certification 100mW - FCC (USA) and IC (Canada) certification * RoHS compliant
The information in this document is subject to change without notice, please confirm data is current Document No: 0004-00-07-00-000 (Issue C) Date Published: December 4, 2009
ZMXM-400 Series
MATRIX MODULES ORDERING INFORMATION
Part Number Order Number Supplying Form
ZMXM-400 Series
ZMXM-400-1 ZMXM-400-1C ZMXM-400-KIT-2
Matrix Module (10mW) with PCB Trace Antenna Matrix Module (10mW) with optional MMCX Connector installed @ J2 Matrix Module (10mW) Evaluation Kit Matrix Module (100mW) with PCB Trace Antenna Matrix Module (100mW) with optional MMCX Connector installed @ J2 Matrix Module (100mW) Evaluation Kit
ZMXM-401 Series
ZMXM-401-1 ZMXM-401-1C ZMXM-401-KIT-1
ABSOLUTE MAXIMUM RATINGS
Rating Power Supply Voltage Voltage on Any Digital Pin RF Input Power Storage Temperature Range Value 3.6 VDD + 0.3, Max 3.6 +10 -45 to 125 Unit Vdc Vdc dBm C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. Caution: Matrix modules are sensitive to electrostatic discharge, observe precautions when handling.
OPERATING CONDITIONS
Characteristic Power Supply Voltage (Vdd) 10mW 100mW Input Frequency Ambient Temperature Range Logic Input Low Voltage Logic Input High Voltage 2.1 2.4 2405 -40 0 70% Vdd 25 3.3 3.3 3.6 3.6 2480 85 30% Vdd Vdd Vdc Vdc MHz C V V Min Typ Max Unit
ZMXM-400 Series
ELECTRICAL SPECIFICATIONS (@ 25 C, Vdd = 3.3V, unless otherwise noted)
Parameter
General Charcteristics
RF Frequency Range RF Data Rate Host Data Rate
Min 2400
Typ
Max 2483.5
Unit MHz kbps kbps kbps kB kB
250
10 mW 100 mW Flash Memory RAM 128 8
115.2 115.2
Power Consumption
Transmit Mode 10mW 100mW 10mW 100mW 10mW 100mW 50 130 33 33 5 5 mA mA mA mA A A
Receive Mode
Standby Mode
Transmitter
Nominal Output Power
10mW 100mW Nominal Output Power (DPS) Programmable Output Power range Error Vector Magnitude
10 20 -1 24 12
35
dBm dBm dBm dB %
Receiver
Module Sensitivity (1% PER) Receiver Sensitivity (1% PER) Saturation (Maximum Input Level) (1% PER)
0
-89 -92 10
dBm dBm dBm
Control AC Characteristics
RESET_N low pulse width Interrupt request pulse width
2.5 31.25
ns ns
Control DC Characteristics
Logic Input Low Logic Input High Logic Output Low Logic Output High I/O pin pull-up and pull-down resistor
0 VDD-0.25 0 VDD-0.25 17
0.7 VDD 0 VDD 20
0.9 VDD 0.25 VDD 23
V V V V k
Note: Please refer to the Texas Instruments CC2430 datasheet for further information and details regarding the configuration of the I/O ports.
ZMXM-400 Series PIN SIGNALS I/O PORT CONFIGURATION
PIN 1 PIN 24
Matrix modules have 24 edge I/O interfaces for connection to the host board. Figure 1 shows the layout of the 24 edge castellations.
PIN 8 PIN 9 PIN 16
PIN 17
Figure 1
I/O PIN ASSIGNMENTS
Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Name GROUND P0_2 P0_3 P0_4 P0_5 P0_6 P0_7 GROUND MODE0 MODE1 MODE2 P1_7 P1_6 TXD RXD P1_3 GROUND P1_1 P1_0 RESET P0_0 P0_1 VDD GROUND Type GND DI/DO/AI DI/DO/AI DI/DO/AI DI/DO/AI DI/DO/AI DI/DO/AI GND DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO DI/DO GND DI/DO DI/DO DI DI/DO/AI DI/DO/AI PI GND Ground General Purpose Digital I/0 Port 0_2 or ADC input 2 General Purpose Digital I/0 Port 0_3 or ADC input 3 General Purpose Digital I/0 Port 0_4 or ADC input 4 General Purpose Digital I/0 Port 0_5 or ADC input 5 General Purpose Digital I/0 Port 0_6 or ADC input 6 General Purpose Digital I/0 Port 0_7 or ADC input 7 Ground General Purpose Digital I/O Port 2_2 or Debug CLK General Purpose Digital I/O Port 2_1 or Debug DATA (DD) General Purpose Digital I/O Port 2_0 General Purpose Digital I/O Port 1_7 General Purpose Digital I/O Port 1_6 General Purpose Digital I/O Port 1_5 or Application Transmit Data Output General Purpose Digital I/O Port 1_4 or Application Receive Data Input General Purpose Digital I/O Port 1_3 Ground General Purpose Digital I/O Port 1_1, 20mA drive capability General Purpose Digital I/O Port 1_0, 20mA drive capability Reset, active low General Purpose Digital I/0 Port 0_0 or ADC input 0 Optional on-board Green LED General Purpose Digital I/0 Port 0_1 or ADC input 1Optional on-board Red LED Power Supply Input Ground Description
Unused I/O pins should be left unconnected and the pin state set via the Host Protocol.
DI = Digital Input DO = Digital Output AI = Analog Input AO = Analog Output PI = Power Input GND = Ground
ZMXM-400 Series ANTENNA
The Matrix module includes an integrated PCB trace antenna. An optional configuration with a MMCX connector is also available. The module regulatory certification has been completed with the PCB trace antenna and also with a Nearson (part# S131CL-5-RMM-2450S) dipole antenna on a 5 inch cable using the MMCX connection. The integrated PCB antenna topology is an F-antenna. This antenna is used because it is reasonably compact, has a fairly omni-directional radiation pattern, good efficiency, and is very simple. An adequate ground plane directly beneath the module but not under the antenna is necessary to provide good efficiency. The antenna radiation patterns are dependent upon the carrier board the Matrix module is placed upon. Measured radiation patterns of the module alone are available by contacting LS Research. The environment the module is placed in will dictate the range performance. The non-ideal characteristics of the transmission channel result in the transmitted signal producing reflection, diffraction, and/or scattering. All of these factors randomly combine to create extremely complex scenarios. It is also best to keep some clearance between the antenna and nearby objects. This includes how the module is mounted in the product enclosure. Unless the items on the following list of recommendations are met, the radiation pattern can be heavily distorted. * Never place ground plane or copper trace routing underneath the antenna. * Never place the antenna very close to metallic objects. * In the final product, ensure that any wiring or other components do not get too close to the antenna. * The antenna will need a reasonable ground plane area on the mother board area to be efficient. * Do not use a metallic enclosure or metallized plastic for the antenna. * Try to keep any plastic enclosure greater than 1 cm from the antenna in any orientation.
POWER AMPLIFIER
Both variants of the Matrix modules contain a Power Amplifier. The Matrix 10 mW (ZMXM-400) has a maximum Power Out of 10 mW, while the Matrix 100 mW has a maximum Power Out of 100 mW. The Power Amplifier is controlled via the P1_2 General Purpose I/O (GPIO) of the Texas Instruments CC2430. As such, the P1_2 GPIO needs to be configured as an output in the application source code to enable control the Power Amplifier. When P1_2 drives LOW (i.e. logic level `0') the Power Amplifier is disabled and maximum Power Out is 1 mW regardless of module in use. When P1_2 drives HIGH (i.e. logic level `1') the Power Amplifier is enabled and maximum Power Out is either 10 mW or 100 mW depending upon which variant of the Matrix module is in use. Intermediate power level settings (i.e. between 1 mW and 10 or 100 mW) may be achieved by enabling the power amplifier and then varying the Power Out of the CC2430.
ZMXM-400 Series DIMENSIONS: ZMXM-400-1 Matrix Module 10mW
Dimensions in inches. Tolerances = +/-0.005" unless otherwise noted.
PCB Trace Antenna 0.194 0.920
PIN 1: GROUND P0_2 RF Shield 0.655 P0_3 P0_4 P0_5 P0_6 X3 P0_7 PIN 8: GROUND PIN 9: MODE 0 MODE 1 MODE 2 P1_7 P1_6 TXD RXD PIN 16: P1_3
PIN 24: GROUND +3.3V P0_1 P0_0 RESET P1_0 P1_1 PIN 17: GROUND 1.130
1.130
0.060
DIMENSIONS: ZMXM-400-1C Matrix Module 10mW with Optional MMCX Connector
Dimensions in inches. Tolerances = +/-0.005" unless otherwise noted.
Overall Height w/MMCX Connector 0.203
Optional MMCX Connector for external antenna 0.920 0.415
J2
J2
PIN 1: GROUND P0_2 0.655 P0_3 P0_4 P0_5 P0_6 P0_7 X3 PIN 8: GROUND PIN 9: MODE 0 MODE 1 MODE 2 P1_7 P1_6 PIN 16: P1_3 TXD RXD
PIN 24: GROUND + 3.3V P0_1 P0_0 RESET P1_0 P1_1 PIN 17: GROUND
RF Shield
0.060
ZMXM-400 Series DIMENSIONS: ZMXM-401-1 Matrix Module 100mW
Dimensions in inches. Tolerances = +/-0.005" unless otherwise noted.
PCB Trace Antenna 0.194 0.920
PIN 1: GROUND P0_2 RF Shield 0.768 P0_3 P0_4 P0_5 P0_6 X3 P0_7 PIN 8: GROUND PIN 9: MODE 0 MODE 1 MODE 2 P1_7 P1_6 TXD RXD PIN 16: P1_3
PIN 24: GROUND +3.3V P0_1 P0_0 RESET P1_0 P1_1 PIN 17: GROUND 1.230
1.230
0.060
DIMENSIONS: ZMXM-401-1C Matrix Module 100mW with Optional MMCX Connector
Dimensions in inches. Tolerances = +/-0.005" unless otherwise noted.
Optional MMCX Connector for external antenna 0.920 0.415
Overall Height w/MMCX Connector 0.203
J2
J2
PIN 1: GROUND P0_2 RF Shield 0.768 P0_3 P0_4 P0_5 P0_6 X3 P0_7 PIN 8: GROUND PIN 9: MODE 0 MODE 1 MODE 2 P1_7 P1_6 TXD RXD PIN 16: P1_3
PIN 24: GROUND +3.3V P0_1 P0_0 RESET P1_0 P1_1 PIN 17: GROUND
0.060
ZMXM-400 Series PCB PAD LAYOUT
Dimensions in inches. Tolerances = +/-0.005" unless otherwise noted.
0.455
0.455
PIN 1
PIN 24 0.080 Typ 24 Pads
0.700
0.005
0.080
0.085 0.085 Typ 24 Pads
0.085
0.105
0.100 Pitch Typ
0.105
PCB KEEP- OUT AREAS Matrix Module 10mW
0.990
Dimensions in inches. Tolerances = +/-0.005" unless otherwise noted.
Matrix Module 100mW
Minimum PCB Trace, Plane and Component Keep-Out Area, All Layers 0.990 Minimum PCB Trace, Plane & Component Keep-Out Area, All Layers
0.345
PIN 1 0.175 0.080 0.205 0.270
PIN 24 Recommended Host PCB Edge 0.185
PIN 1 0.175 0.260 0.270
PIN 24
0.345
Recommended Host PCB Edge
0.230
0.230
Exposed PCB Trace Top Layer Keep-Out Area
Exposed PCB Trace Top Layer Keep-Out Area
Note:
Matrix modules should be mounted so the antenna is overhanging the board edge. This will provide the best antenna performance for the PCB trace antenna. It is also recommended to have a ground plane on the host board underneath the rest of the module, up to the recommended PCB edge. This will improve the antenna performance by increasing the overall ground plane. Traces can be run underneath the Matrix module on the host PCB as long a there is an uninterrupted ground plane on one layer as well. CEL can arrange guidance and help with the host PCB layout.
ZMXM-400 Series AGENCY SAFETY CERTIFICATIONS
FCC Part 15.247 Module Certified (Portable)
The Matrix modules comply with Part 15 of the Federal Communications Commission rules and regulations. To meet the FCC Certification requirements, the user must meet these regulations. * The text on the FCC ID label provided with the module is placed on the outside of the final product. * The modules may only use the antennas that have been tested and approved with this module. -- The on-board PCB trace antenna -- Nearson S131CL-5-RMM-2450S antenna. Per section 2.1091, the Matrix module has been certified by the FCC for use with other products without additional certification. Any modifications to this product may violate the rules of the Federal Communications Commission and make operation of the product unlawful. Per sections 15.107 and 15.109, the user's end product must be tested to comply with unintentional radiators for compliance. Per Section 47 C.F.R. Sec.15.105(b), the Matrix module is certified as a portable device for the FCC radiation exposure limits set forth for an uncontrolled environment. The antenna used with this module must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. If the module is to be used in a handheld application, the user is responsible for passing the additional FCC part 2.1091 rules (SAR) and FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields, OET Bulletin and Supplement C.
IC Certification -- Canada
Matrix modules are IC certified. The labeling requirements for Industry Canada are similar to those of the FCC. A visible label on the outside of the final product must display the IC labeling. The user is responsible for the end product to comply with IC ICES-003 (Unintentional radiators).
CE Certification -- Europe
Matrix modules are EN 300-328-1 certified in Europe. The user must ensure compliance of the final product with the European harmonized EMC and safety standards. Annex II of the R&TTE Directive provides the requirements for the issuance of a Declaration of Conformity. The CE marking must be affixed legibly and indelibly to a visible location on the user's product.
FCC Approved Antennas
* Integrated PCB trace antenna * Nearson S131CL-5-RMM-2450S - A 2.4GHz Dipole antenna with a 5 inch cable and a right angle MMCX connector.
ZMXM-400 Series SHIPMENT, HANDLING, AND STORAGE
Shipment Handling
Matrix Modules are delivered in single piece, or 50 piece cartons in individual anti-static bags.
Matrix Modules are designed and packaged to be processed in an automated assembly line.
!Warning Matrix Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may
destroy or damage the module permanently.
!Warning According to JEDEC ISP, Matrix Modules are moisture sensitive devices. Appropriate handling instructions
and precautions are summarized in Section 2.1. Read carefully to prevent permanent damages due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/Shelf life in sealed bags is 12 months at <40C and <90% relative humidity.
PROCESSING
Reflow Soldering
A convection soldering oven is recommended over the infrared radiation type oven. Convection ovens allow more precise temperature control, and more even heating of parts regardless of material composition, thickness, or color.
Preheat Phase
Initial heating of component leads and solder paste balls, for removal of residual humidity.
Note: The preheat phase is not intended to replace prior baking procedures.
* Temperature rise rate: 0.8-1.7C/sec
Note: Excessive slumping can result if the temperature rise is too rapid.
* Time: 60-120 seconds
Note: If the preheat is insufficient, large solder balls tend to be generated. Conversely, if preheat is excessive, small and large balls will be generated in clusters.
* End Temperature: 150-200C
Heating/Relow Phase
The temperature rises above the liquidus temperature of the solder paste selected. * Limit time above liquidus temperature to 35-90 seconds. * Peak reflow temperature: 230-250C
Avoid a sudden rise in temperature as any slump of the solder paste could become worse.
ZMXM-400 Series PROCESSING (Continued)
Cooling Phase
A controlled cooling phase avoids unwanted metallurgical effects of the solder, and possible mechanical tensions in the * Temperature fall rate: max 3C/sec
products. Controlled cooling helps achieve the brightest possible solder fillets with a good shape and low contact angle.
Pb-Free Soldering Paste
Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process. The pastes listed in the examples below meet these criteria. Soldering Paste: Indium 5.1 (Indium Corporation of America) Alloy Specification: SAC305 - Sn Zinc 96.5%/Ag Silver 3.0%/Cu Copper 0.5% Alloy Specification: SAC387 - Sn Zinc 95.5%/Ag Silver 3.8%/Cu Copper 0.7% Melting Temperature: 217C Soldering Paste: LFSOLDER TLF-206-93F (Tamura Kaken [UK] Ltd.) Alloy Specification: Sn Zinc 95.5%/Ag Silver 3.9%/Cu Copper 0.6% Melting Temperature: 216-221C
The final choice of the soldering paste depends on individual factory approved manufacturing procedures. Stencil Thickness: 150 m for host boards
Note:
The quality of the solder joints on the castellations (`half vias') where they contact the host board should meet the appropriate IPC specification. See IPC-A-610-12.2.4.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. * Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Ultrasonic cleaning could damage the module permanently.
* *
The best approach is to consider using a "no clean" soldering paste and eliminate the post soldering cleaning step.
ZMXM-400 Series PROCESSING (Continued)
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following: * * * Proper alignment and centering of the module over the pads. Proper solder joints on all pads. Excessive solder or contacts to neighboring pads, or vias.
Only a single reflow soldering process is encouraged for host boards.
Repeating Reflow Soldering Wave Soldering
If a wave soldering process is required on the host boards due to the presents of leaded components, only a single wave soldering process is encouraged.
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350C, follow IPC recommendations/ reference document IPC-7711.
Hand Soldering
Rework
Matrix Modules can be unsoldered from the host board. Use of a hot air re-work tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. !Warning - Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customers own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference.
Conformal Coating
Conformal coating may be necessary in certain applications. Please note that the RF shield and the sticker prevent optimum inflow of liquids or aerosols.
ZMXM-400 Series REVISION HISTORY & DISCLAIMER
Revision History
Previous Versions
0004-00-07-00-000 (Issue B) (Preliminary) May 07, 2008
Changes to Current Version Initial advance datasheet. Updated Miniature Footprint dimensions for 100mW on front page and dimension drawings for 100mW, corrected the certification status under features, corrected J1 to J2 in the ordering information section, updated reflow soldering process specs (temperature rise time and limit time above liquius temerature), add Power Ampifier section on page 5, updated published date and Issue to C, removed preliminary datasheet from front page and added revision history and disclaimer to last page of datasheet.
Page N/A
0004-00-07-00-000 (Issue C) December 4, 2009
1,5,7, 10,13
Disclaimer
* The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. * CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's *equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features.

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