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| IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G OptiMOSTM2 Power-Transistor Features * N-channel, normal level * Excellent gate charge x R DS(on) product (FOM) * Very low on-resistance R DS(on) * 175 C operating temperature * Pb-free lead plating; RoHS compliant * Qualified according to JEDEC1) for target application Product Summary V DS R DS(on),max (TO252) ID 100 25 35 V m A * Ideal for high-frequency switching and synchronous rectification * Halogen-free according to IEC61249-2-21 * Type IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G Package Marking PG-TO263-3 26CN10N PG-TO252-3 25CN10N PG-TO262-3 26CN10N PG-TO220-3 26CN10N Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 C T C=100 C Pulsed drain current 2) Value 35 25 140 65 6 20 Unit A I D,pulse E AS dv /dt V GS P tot T j, T stg T C=25 C I D=35 A, R GS=25 I D=35 A, V DS=80 V, di /dt =100 A/s, T j,max=175 C Avalanche energy, single pulse Reverse diode dv /dt Gate source voltage3) Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 1) 2) mJ kV/s V W C T C=25 C 71 -55 ... 175 55/175/56 J-STD20 and JESD22 see figure 3 3) Tjmax=150C and duty cycle D=0.01 for Vgs<-5V * Except D-PAK ( TO-252 ) Rev. 1.08 page 1 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction ambient (TO220, TO262, TO263) Thermal resistance, junction ambient (TO252, TO251) R thJC R thJA minimal footprint 6 cm2 cooling area 4) minimal footprint 6 cm2 cooling area 4) 2.1 62 40 75 50 K/W Values typ. max. Unit Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=39 A V DS=80 V, V GS=0 V, T j=25 C V DS=80 V, V GS=0 V, T j=125 C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=35 A, (TO252) V GS=10 V, I D=35 A, (TO251) V GS=10 V, I D=35 A, (TO263) V GS=10 V, I D=35 A, (TO220, TO262) Gate resistance Transconductance RG g fs |V DS|>2|I D|R DS(on)max, I D=35 A 100 2 3 0.1 4 1 A V - 10 1 19 100 100 25 nA m - 19 25 - 20 26 19 20 1.1 38 26 S 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 4) Rev. 1.08 page 2 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics 5) Gate to source charge Gate to drain charge Switching charge Gate charge total Gate plateau voltage Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge 5) Values typ. max. Unit C iss C oss C rss t d(on) tr t d(off) tf V DD=50 V, V GS=10 V, I D=35 A, R G=1.6 V GS=0 V, V DS=50 V, f =1 MHz - 1560 232 16 10 4 13 3 2070 309 24 15 6 19 4 pF ns Q gs Q gd Q sw Qg V plateau Q oss V DD=50 V, V GS=0 V V DD=50 V, I D=35 A, V GS=0 to 10 V - 9 6 10 23 5.6 24 12 8 14 31 32 nC V nC IS I S,pulse V SD t rr Q rr T C=25 C V GS=0 V, I F=35 A, T j=25 C V R=50 V, I F=I S, di F/dt =100 A/s - 1 85 165 35 140 1.2 A V ns - nC See figure 16 for gate charge parameter definition Rev. 1.08 page 3 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G 1 Power dissipation P tot=f(T C) 2 Drain current I D=f(T C); V GS10 V 80 40 70 35 60 30 50 25 P tot [W] 40 I D [A] 0 50 100 150 200 20 30 15 20 10 10 5 0 0 0 50 100 150 200 T C [C] T C [C] 3 Safe operating area I D=f(V DS); T C=25 C; D =0 parameter: t p 4 Max. transient thermal impedance Z thJC=f(t p) parameter: D =t p/T 10 1 s 10 2 10 s 100 s Z thJC [K/W] I D [A] 101 1 ms 1 0.5 0.2 10 ms DC 0.05 100 0.1 0.02 10-1 10-1 100 101 102 103 0.1 0.01 V DS [V] single pulse t p [s] Rev. 1.08 page 4 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G 5 Typ. output characteristics I D=f(V DS); T j=25 C parameter: V GS 100 10 V 8V 7V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 C parameter: V GS 60 5V 5.5 V 6V 80 6.5 V 50 40 R DS(on) [m] 60 6.5 V I D [A] 30 7V 8V 6V 40 20 5.5 V 10 V 20 5V 4.5 V 10 0 0 1 2 3 4 5 0 0 10 20 30 40 50 60 70 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 80 8 Typ. forward transconductance g fs=f(I D); T j=25 C 40 35 60 30 25 40 g fs [S] 175 C 25 C I D [A] 20 15 20 10 5 0 0 2 4 6 8 0 0 10 20 30 V GS [V] I D [A] Rev. 1.08 page 5 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G 9 Drain-source on-state resistance R DS(on)=f(T j); I D=35 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS parameter: I D 60 4 3.5 390 A 3 40 39 A R DS(on) [m] 2.5 98 % V GS(th) [V] 2 0 typ 20 1.5 1 0.5 0 -60 -20 20 60 100 140 180 0 -60 -20 20 60 100 140 180 T j [C] T j [C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 104 1000 Ciss 10 3 25 C Coss 100 175 C 175 C, 98% C [pF] 102 Crss I F [A] 25 C, 98% 10 101 100 0 20 40 60 80 1 0 0.5 1 1.5 2 V DS [V] V SD [V] Rev. 1.08 page 6 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G 13 Avalanche characteristics I AS=f(t AV); R GS=25 parameter: T j(start) 100 14 Typ. gate charge V GS=f(Q gate); I D=35 A pulsed parameter: V DD 12 50 V 10 20 V 80 V 8 10 150 C 100 C 25 C V GS [V] 1000 I AS [A] 6 4 2 1 1 10 100 0 0 5 10 15 20 25 t AV [s] Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA 16 Gate charge waveforms 115 V GS Qg 110 V BR(DSS) [V] 105 100 V g s(th) 95 Q g(th) Q gs -60 -20 20 60 100 140 180 Q sw Q gd Q g ate 90 T j [C] Rev. 1.08 page 7 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G PG-TO220-3: Outline Rev. 1.08 page 8 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G PG-TO-263 (D-Pak) Rev. 1.08 page 9 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G PG-TO262-3-1 (IPAK) Rev. 1.08 page 10 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G PG-TO252-3: Outline Rev. 1.08 page 11 2010-04-28 IPB26CN10N G IPD25CN10N G IPI26CN10N G IPP26CN10N G Published by Infineon Technologies AG 81726 Munich, Germany (c) 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.08 page 12 2010-04-28 |
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