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PD - 96965A
PDP MOSFET
Features l Advanced process technology l Key parameters optimized for PDP Sustain & Energy Recovery applications l Low EPULSE rating to reduce the power dissipation in Sustain & ER applications l Low QG for fast response l High repetitive peak current capability for reliable operation l Short fall & rise times for fast switching l175C operating junction temperature for improved ruggedness l Repetitive avalanche capability for robustness and reliability
IRFP4232PBF
Key Parameters
250 300 30 310 117 175
D
VDS min VDS (Avalanche) typ. RDS(ON) typ. @ 10V EPULSE typ. IRP max @ TC= 100C TJ max
V V m: J A C
G S
TO-247AC
Description This HEXFET(R) Power MOSFET is specifically designed for Sustain; Energy Recovery & Pass switch applications in Plasma Display Panels. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon area and low EPULSE rating. Additional features of this MOSFET are 175C operating junction temperature and high repetitive peak current capability. These features combine to make this MOSFET a highly efficient, robust and reliable device for PDP driving applications.
Absolute Maximum Ratings
Parameter
VGS VGS (TRANSIENT) ID @ TC = 25C ID @ TC = 100C IDM IRP @ TC = 100C PD @TC = 25C PD @TC = 100C TJ TSTG Gate-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range Soldering Temperature for 10 seconds Mounting Torque, 6-32 or M3 Screw 300 10lbxin (1.1Nxm) N
Max.
20 30 60 42 240 117 430 210 2.9 -40 to + 175
Units
V A
c
Repetitive Peak Current
g
W W/C C
Thermal Resistance
RJC Junction-to-Case
f
Parameter
Typ.
---
Max.
0.35
Units
C/W
Notes through are on page 8
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IRFP4232PBF
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
Parameter
BVDSS VDSS/TJ RDS(on) VGS(th) VGS(th)/TJ IDSS IGSS gfs Qg Qgd td(on) tr td(off) tf tst EPULSE Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Gate Threshold Voltage Coefficient Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Forward Transconductance Total Gate Charge Gate-to-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Shoot Through Blocking Time Energy per Pulse
Min.
250 --- --- 3.0 --- --- --- --- --- 95 --- --- --- --- --- --- 100 --- ---
Typ. Max. Units
--- 180 30 --- -15 --- --- --- --- --- 160 60 37 100 64 63 --- 310 950 7290 610 240 420 5.0 13 --- ---
Conditions
VGS = 0V, ID = 250A
V mV/C Reference to 25C, ID = 1mA 35.7 m VGS = 10V, ID = 42A VDS = VGS, ID = 250A 5.0 V
e
--- 5.0 150 100 -100 --- 240 --- --- --- --- --- --- --- --- --- --- --- --- ---
mV/C A VDS = 200V, VGS = 0V VDS = 200V, VGS = 0V, TJ = 125C nA S nC VGS = 20V VGS = -20V VDS = 25V, ID = 42A VDD = 125V, ID = 42A, VGS = 10Ve VDD = 125V, VGS = 10VAe ns ID = 42A RG = 5.0 ns J See Fig. 22 VDD = 200V, VGS = 15V, RG= 4.7 L = 220nH, C= 0.4F, VGS = 15V VDS = 200V, RG= 4.7, TJ = 25C L = 220nH, C= 0.4F, VGS = 15V VDS = 200V, RG= 4.7, TJ = 100C VGS = 0V VDS = 25V = 1.0MHz, See Fig.5 VGS = 0V, VDS = 0V to 200V Between lead, nH 6mm (0.25in.) from package and center of die contact
G S D
Ciss Coss Crss Coss eff. LD LS
Input Capacitance Output Capacitance Reverse Transfer Capacitance Effective Output Capacitance Internal Drain Inductance Internal Source Inductance
--- --- --- --- --- ---
pF
---
Avalanche Characteristics
Parameter Typ. Max. Units mJ mJ V A
EAS EAR VDS(Avalanche) IAS
Single Pulse Avalanche Energyd Repetitive Avalanche Energy Repetitive Avalanche VoltageA Avalanche CurrentAd
--- --- 300 ---
220 43 --- 42
Diode Characteristics
Parameter
IS @ TC = 25C Continuous Source Current ISM VSD trr Qrr (Body Diode) Pulsed Source Current (Body Diode)A Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge
Min.
--- --- --- --- ---
Typ. Max. Units
--- --- --- 240 1230 60 A 240 1.0 360 1850 V ns nC
Conditions
MOSFET symbol showing the integral reverse p-n junction diode. TJ = 25C, IS = 42A, VGS = 0V TJ = 25C, IF = 42A, VDD = 50V di/dt = 100A/s
e
e
2
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IRFP4232PBF
1000
TOP
1000
ID, Drain-to-Source Current (A)
BOTTOM
ID, Drain-to-Source Current (A)
VGS 15V 10V 8.0V 7.0V
TOP BOTTOM
VGS 15V 10V 8.0V 7.0V
100
7.0V
100
7.0V
10
10
60s PULSE WIDTH Tj = 25C
1 0.1 1 10 100
60s PULSE WIDTH Tj = 175C
1 0.1 1 10 100
VDS, Drain-to-Source Voltage (V)
VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
1000
Fig 2. Typical Output Characteristics
4.0
RDS(on) , Drain-to-Source On Resistance (Normalized)
ID, Drain-to-Source Current()
ID = 42A VGS = 10V
3.0
100
TJ = 175C
2.0
10
TJ = 25C
1.0
VDS = 30V
1 4.0 5.0 6.0
60s PULSE WIDTH
7.0 8.0
0.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 180
VGS, Gate-to-Source Voltage (V)
TJ , Junction Temperature (C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance vs. Temperature
1000
1200
1000
Energy per pulse (J)
Energy per pulse (J)
L = 220nH C = 0.4F 100C 25C
800
L = 220nH C = Variable 100C 25C
800
600
600
400
400
200
200 150 160 170 180 190 200
0 160 170 180 190 200 210 220 230
VDS, Drain-to -Source Voltage (V)
ID, Peak Drain Current (A)
Fig 5. Typical EPULSE vs. Drain-to-Source Voltage
Fig 6. Typical EPULSE vs. Peak Drain Current
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IRFP4232PBF
1600
L = 220nH
1400
1000.0
Energy per pulse (J)
1200 1000 800 600 400 200 0 25
C= 0.4F C= 0.3F C= 0.2F
ISD, Reverse Drain Current (A)
100.0
TJ = 175C
10.0
1.0
TJ = 25C VGS = 0V
50
75
100
125
150
0.1 0.2 0.4 0.6 0.8 1.0 1.2
Temperature (C)
VSD , Source-to-Drain Voltage (V)
Fig 7. Typical EPULSE vs.Temperature
12000 VGS = 0V, f = 1 MHZ Ciss = Cgs + Cgd, Cds SHORTED Crss = Cgd Coss = Cds + Cgd 8000
Fig 8. Typical Source-Drain Diode Forward Voltage
20
VGS, Gate-to-Source Voltage (V)
ID= 42A VDS = 200V VDS= 125V VDS= 50V
10000
16
C, Capacitance (pF)
Ciss
12
6000
8
4000
4
2000
Coss Crss
1 10 100 1000
0
0 0 40 80 120 160 200 240 280 QG Total Gate Charge (nC)
VDS , Drain-to-Source Voltage (V)
Fig 9. Typical Capacitance vs.Drain-to-Source Voltage
Fig 10. Typical Gate Charge vs.Gate-to-Source Voltage
1000
60 54 48
ID, Drain-to-Source Current (A)
OPERATION IN THIS AREA LIMITED BY R DS(on) 1sec
ID , Drain Current (A)
42 36 30 24 18 12 6 0 25 50 75 100 125 150 175
100
10 100sec 1 Tc = 25C Tj = 175C Single Pulse 0.1 1 10 100
10sec
1000
TC , CaseTemperature (C)
VDS , Drain-to-Source Voltage (V)
Fig 11. Maximum Drain Current vs. Case Temperature
Fig 12. Maximum Safe Operating Area
4
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IRFP4232PBF
( RDS (on), Drain-to -Source On Resistance m)
EAS, Single Pulse Avalanche Energy (mJ)
600
1000
ID = 42A
500
800
ID 12A 18A BOTTOM 42A
TOP
400
TJ = 25C TJ = 125C
600
300
400
200
100
200
0 4.0 6.0 8.0 10.0
0 25 50 75 100 125 150 175
VGS, Gate-to-Source Voltage (V)
Starting TJ , Junction Temperature (C)
Fig 13. On-Resistance Vs. Gate Voltage
5.5
Fig 14. Maximum Avalanche Energy Vs. Temperature
200
VGS(th) Gate threshold Voltage (V)
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 -75 -50 -25 0 25 50 75 100 125 150 175
ID = 250A
Repetitive Peak Current (A)
160
ton= 1s Duty cycle = 0.25 Half Sine Wave Square Pulse
120
80
40
0 25 50 75 100 125 150 175
TJ , Temperature ( C )
Case Temperature (C)
Fig 15. Threshold Voltage vs. Temperature
1
Fig 16. Typical Repetitive peak Current vs. Case temperature
D = 0.50
Thermal Response ( ZthJC )
0.1
0.20 0.10 0.05 0.02 0.01
J R1 R1 J 1 2 R2 R2 R3 R3 3 R4 R4 C 1 2 3 4 4
Ri (C/W)
0.0091 0.0487 0.1264 0.1660
i (sec)
0.000003 0.000071 0.001743 0.024564
0.01
0.001
SINGLE PULSE ( THERMAL RESPONSE )
Ci= i/Ri Ci i/Ri
Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc
0.0001 0.001 0.01 0.1
0.0001 1E-006 1E-005
t1 , Rectangular Pulse Duration (sec)
Fig 17. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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IRFP4232PBF
D.U.T
Driver Gate Drive
+
P.W.
Period
D=
P.W. Period VGS=10V
+
Circuit Layout Considerations * Low Stray Inductance * Ground Plane * Low Leakage Inductance Current Transformer
*
D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt
-
-
+
RG
* * * * di/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test
VDD
VDD
+ -
Re-Applied Voltage
Body Diode
Forward Drop
Inductor Curent Inductor Current
Ripple 5% ISD
* VGS = 5V for Logic Level Devices Fig 18. Diode Reverse Recovery Test Circuit for N-Channel HEXFET(R) Power MOSFETs
V(BR)DSS
15V
tp
DRIVER
VDS
L
RG
VGS 20V
D.U.T
IAS tp
+ V - DD
A
0.01
I AS
Fig 19a. Unclamped Inductive Test Circuit
Fig 19b. Unclamped Inductive Waveforms
Id Vds Vgs
L
0
DUT 1K
VCC
Vgs(th)
Qgs1 Qgs2
Qgd
Qgodr
Fig 20a. Gate Charge Test Circuit
Fig 20b. Gate Charge Waveform
6
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IRFP4232PBF
Fig 21a. tst and EPULSE Test Circuit
Fig 21b. tst Test Waveforms
Fig 21c. EPULSE Test Waveforms
V DS VGS RG
RD
VDS 90%
D.U.T.
+
-V DD
V GS
Pulse Width 1 s Duty Factor 0.1 %
10% VGS
td(on) tr t d(off) tf
Fig 22a. Switching Time Test Circuit
Fig 22b. Switching Time Waveforms
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IRFP4232PBF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
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TO-247AC package is not recommended for Surface Mount Application.
Notes: Repetitive rating; pulse width limited by max. junction temperature. Starting TJ = 25C, L = 0.25mH, RG = 25, IAS = 42A. Pulse width 400s; duty cycle 2%. R is measured at TJ of approximately 90C. Half sine wave with duty cycle = 0.25, ton=1sec.
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/ Data and specifications subject to change without notice. This product has been designed for the Consumer market. Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.09/2007
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