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EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Data Sheet Features Feature of the device: Small package with high efficiency Typical color temperature: 3050 K. Typical view angle: 115 Typical light flux output: 22 lm @ 150mA. ESD protection. Soldering methods: SMT Grouping parameter: Brightness, Forward Voltage and Chromaticity. Optical efficiency: 42 lm/W. Moisture Sensitivity Level: 2A Color rendering Index: 80(typ.) Thermal resistance (Junction to Heat sink): 40 C /W The product itself will remain within RoHS compliant version. Applications Design and effect illumination Interior automotive lighting (e.g. dashboard backlighting) Room lighting (e.g. luminaries, spotlights) Reading light (aircraft, car, bus) Signal and symbol luminaries Marker lights (e.g. steps, exit ways, etc.) Architectural illumination Materials Items Encapsulating Resin Electrodes Die attach Chip Silicone resin Ag plating copper alloy Silver paste InGaN Description 1 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Dimensions Notes. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are 0.25mm. 2 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Maximum Ratings (T Soldering=25C) Parameter DC Operating Current Pulsed Forward Current(1) ESD Sensitivity Junction Temperature Operating Temperature Storage Temperature Power Dissipation Junction To Heat-Sink Thermal Resistance Symbol IF IPF ESD Tj Top. Tstge. Pd Rth Rating 180 200 2000 125 -40 ~ +85 -40 ~ +100 0.5 40 Unit mA mA V C C C W C /W Electro-Optical Characteristics (T Soldering=25C) Parameter Brightness(2) Forward Voltage(3) Color Temperature(4) Note. 1. tp 100s, Duty cycle = 0.25 2. Luminous Flux measurement tolerance: 10%. 3. Forward Voltage measurement tolerance: 0.1V. 4. X, Y coordination for white light bin areas refer to EHP-A08-AX08 series White and Warm White Binning (DSE-A08-001). Symbol v VF CCT Min ---------- Typ. 22 3.55 3050 Max ---------- Unit lm V K Condition IF=150mA 3 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Brightness Bin Table Group Bin Min Typ. Max Group Bin Min Typ. Max 1 2 E 3 4 5 1 2 F 3 4 5 1 2 J 3 4 5 1 2 31 32 33 K 41 42 43 51 52 53 1.5 3 4 5 6 8 10 13 17 20 23 27 33 39 45 52 60 70 75 80 85 90 95 100 110 120 ------------------------------------------------------------------------------- 3 4 5 6 8 10 13 17 20 23 27 33 39 45 52 60 70 75 80 85 90 95 100 110 120 130 R N 11 12 13 21 22 31 32 41 42 51 52 1 2 3 4 5 130 140 150 160 180 200 225 250 275 300 350 400 500 600 750 1000 ------------------------------------------------- 140 150 160 180 200 225 250 275 300 350 400 500 600 750 1000 1300 4 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Forward Voltage Bin Table Group Bin Min Typ. Max Group Bin Min Typ. Max 1 U1 2 3 1 U2 2 3 1 U3 2 3 1 U4 2 3 1.75 1.85 1.95 2.05 2.15 2.25 2.35 2.45 2.55 2.65 2.75 2.85 ------------------------------------- 1.85 1.95 2.05 2.15 2.25 2.35 2.45 2.55 2.65 2.75 2.85 2.95 V5 V4 V3 V2 V1 1 2 3 1 2 3 1 2 3 1 2 3 1 2 3 2.95 3.05 3.15 3.25 3.35 3.45 3.55 3.65 3.75 3.85 3.95 4.05 4.15 4.25 4.35 ---------------------------------------------- 3.05 3.15 3.25 3.35 3.45 3.55 3.65 3.75 3.85 3.95 4.05 4.15 4.25 4.35 4.45 Group Bin Min Typ. Max 1 2 3 O 4 5 6 7 1 R 2 3 4 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 11.0 ---------------------------------- 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 11.0 12.0 5 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W White Binning Structure Warm White 0.48 3250K 0.44 3050K N4 2850K 2670K M4 3500K 3800K 4100K 4500K Q4 R4 R5 Q6 R6 Q7 R7 S7 T7 P7 P5 Q5 P6 N7 N6 M7 S4 S5 S6 P4 N5 M5 M6 CIE-Y 0.40 T4 T5 T6 0.36 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 CIE-X Note. This datasheet is a product series datasheet with a list of all possible rankings for the entire Everlight high power portfolio. It does not specify exact bins available for any particular package. Please contact a member of your regional Everlight branch to receive specific binning, exact order codes and individual datasheets for a particular high power LED. 6 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Typical Electro-Optical Characteristics Curves Relative Spectral Distribution, IF=150mA, Tsoldering=25C 1.0 Forward Voltage vs Forward Current, Tsoldering=25C 3.8 3.6 Relative Luminous Intenstiy 0.8 Forward Voltage(V) 500 600 700 800 3.4 3.2 3.0 2.8 2.6 0.6 0.4 0.2 0.0 400 0 50 100 150 200 Wavelength(nm) Forward Current(mA) Relative Luminous Intensity vs Forward Current, Tsoldering=25C 1.4 180 150 Forward Current Derating Curve, Derating based on TjMAX=125C Relative Luminous Intensity 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Forward Current (mA) 120 90 60 30 0 0 50 100 150 200 0 20 40 60 80 100 Forward Current(mA) Soldering Temperature ( C) 7 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Typical Representative Spatial Radiation Pattern 1.0 0.9 Relative Luminous Intensity 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -80 -60 -40 -20 0 20 40 60 80 Degree (2) Note. 1. 21/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. View angle tolerance is 5. 8 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Label explanation CPN: Customer's Production Number P/N : Production Number QTY: Packing Quantity CAT: Rank of Luminous Flux HUE: Color Rank REF: Rank of Forward Voltage LOT No: Lot Number MADE IN TAIWAN: Production Place Reel Dimensions Note. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are 0.1mm. 9 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel Note. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are 0.1mm. Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label 10 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Reliability Data Stress Test Stress Condition Stress Duration Solderability Reflow Thermal Shock Tsol=260, 10sec Tsol=260, 5sec, 6min H100 20min. ' 20sec. 'L 10 20min. H100 15min. ' 5min. 'L 40 15min. Ta=85 , RH=85% Ta=85 , RH=85%, IF=120mA Ta=85 Ta=-40 Ta=25, IF=150mA Ta=55, IF=150mA Ta=85, IF=120mA Ta=-40, IF=150mA H100 15min. ' 5min. 'L 40 15min. IF=120mA,2min on/off 1 times 3 times 200 Cycles Temperature Cycle High Temperature/Humidity Reverse Bias High Temperature/Humidity Operation High Temperature Storage Low Temperature Storage High Temperature Operation Life #1 High Temperature Operation Life #2 High Temperature Operation Life #3 Low Temperature Operation Life 200 Cycles 1000hours 1000hours 1000hours 1000hours 1000hours 1000hours 1000hours 1000hours Power Temperature Cycle 200cycles *lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)50% *VF: FORWARD VOLTAGE DIFFERENCE20% 11 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Precautions For Use Over-current-proof Although the EHP-A21 series has a conductive ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shifts may cause significant current change resulting in burn out failure. 1. Storage i. ii. iii. iv. v. vi. Do not open the moisture proof bag before the devices are ready to use. Before the package is opened, LEDs should be stored at temperatures less than 30 and humidity less than 90%. LEDs should be used within a year. After the package is opened, LEDs should be stored at temperatures less than 30and humidity less than 60%. LEDs should be used within 168 hours (7 days) after the package is opened. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: pre-curing at 605 for 24 hours. 2. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-A21 series LEDs should be mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper thermal connection to dissipate approximately 0.5W of thermal energy at 150mA operation. ii. iii. Heat dissipation or thermal conduction design is strongly recommended on PCB or MCPCB for reflow soldering purposes. Please refer to soldering patterns on Page 2. Sufficient thermal management must be implemented. Otherwise, the junction temperature of die may exceed over the limit at high current driving conditions and the LEDs' lifetime may be decrease dramatically. iv. v. For further thermal management suggestions, please consult the Everlight Design Guide or local representatives for assistance. Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. vi. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. 12 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W 3. Proper Handling To avoid contamination of materials, damage of internal components, and shortening of LED lifetime, do not subject LEDs to conditions as those listed below. Bare Hand Tweezers When handling the product, do not apply direct pressure on the resin. Do not touch the resin to avoid scratching or other damage. Pick and Place Nozzle for Surface Mount Assembly. During Module Assembly Avoid directly contacting with nozzle. Do not stack the modules together, it could damage the resin or scratch the lens. 13 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W 4. Soldering Iron i. For Reflow Process a. EHP-A21 series are suitable for SMT process. b. Curing of glue in oven according to standard operation flow processes. c. Reflow soldering should not be done more than twice. d. In soldering process, stress on the LEDs during heating should be avoided. e. After soldering, do not warp the circuit board. ii. For Manual Soldering Process a. For prototype builds or small series production runs it is possible to place and solder the LED by hand. b. Dispense thermal conductive glue or grease on the substrates and follow its curing specifications. Gently press LED housing to closely connect LED and substrate. c. It is recommended to hand solder the leads with a solder tip temperature of 280C for less than 3 second, at a time with a soldering iron of less than 25W. Solder at intervals of two seconds or more. d. Take caution and be aware that damaged products are often a result of improper hand soldering technique. 14 of 15 EHP-A21/LM31H-PU5/TR High Power LED - 0.5W Revision History Page Subjects(major change in previous version) Date of change 20-Jul-2009 1. Revise DC Operating Current and add Increases the specification 3,4,7 3 2. Change binning information 3. Revise T Ambient to T Soldering Update brightness value 27-Jul-2009 Prepared date: Created by: 20-Jul-2009 Jessie Chueh Device No.: Rev.: DHE-0000326 3 For product information and a complete list of distributors, please go to our web site www.everlight.com Everlight Electronics Co., Ltd. and the logo are trademarks of Everlight Electronics Co., Ltd. in the Taiwan and other countries. Data subject to change. Copyright (c) 2005-2009 Everlight Electronics Co., Ltd.. All rights reserved. 15 of 15 |
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