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IS-1715ARH
TM
Data Sheet
August 2000
File Number
4875
Radiation Hardened Complementary Switch FET Driver
The Radiation Hardened IS1715ARH is a high speed, high current complementary power FET driver designed for use in synchronous rectification circuits. Soft switching transitions for the two output waveforms may be managed by setting the independently programmable delays. The delay pins can alternatively be configured for zero-voltage sensing to allow for precise switching control.
TM
Features
* Electrically Screened to SMD # 5962-00521 * QML Qualified per MIL-PRF-38535 Requirements * Radiation Environment - Gamma Dose 3x105 RAD(Si) - Latch-up Immune * PWR Output Current (Source and sink) . . . . . . . 3A (peak) * AUX Output Current (Source and sink) . . . . . . . 3A (peak) * Low Operating Supply Current . . . . . . . . . . . . . 6mA (max) * Wide Programmable Delay Range . . . . . . 100ns to 600ns * Configurable for Zero-Voltage Switching * Switching Frequency to 1MHz * Both Outputs Active-Low in Sleep Mode * 9V(max) Under Voltage Lock-out
The IS-1715ARH has a single input, which is PWM and TTL compatible, and can run at frequencies up to 1MHz. The AUX output switches immediately at the rising edge of the INPUT, but waits for the T2 delay before responding to the falling edge. A logic low on the enable pin (ENBL) places both outputs into an active-low mode, and an under voltage lock-out (UVLO) function is set at 9V(max). Constructed with the Intersil dielectrically isolated Rad Hard Silicon Gate (RSG) process, these devices are immune to single event latch-up (SEL) and have been specifically designed to provide highly reliable performance in harsh www..com radiation environments. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-00521. A "hot-link" is provided on our homepage for downloading. http://www.intersil.com/spacedefense/space.htm
Applications
* Synchronous Rectification in Power Supplies
Ordering Information
ORDERING NUMBER 5962F0052101VXC 5962F0052101QXC IS9-1715ARH/Proto INTERNAL MKT. NUMBER IS9-1715ARH-Q IS9-1715ARH-8 IS9-1715ARH/Proto TEMP. RANGE (oC) -55 to 125 -55 to 125 -55 to 125
Pinout
IS9-1715ARH FLATPACK (CDFP4-F16) TOP VIEW
NC VCC PWR VSS VSS AUX NC NC 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 ENBL T1 INPUT VSS VSS T2 VCC NC
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright (c) Intersil Corporation 2000
IS-1715ARH Die Characteristics
DIE DIMENSIONS: 3559m x 4420m (129 mils x 174 mils) Thickness: 483m 25.4m (19 mils 1 mil) INTERFACE MATERIALS Glassivation Type: Phosphorus Silicon Glass (PSG) Thickness: 8.0kA 1.0kA Top Metallization Type: AlSiCu Thickness: 16.0kA 2kA Substrate: Radiation Hardened Silicon Gate, Dielectric Isolation Backside Finish: Silicon ASSEMBLY RELATED INFORMATION Substrate Potential: Unbiased (DI) ADDITIONAL INFORMATION Worst Case Current Density: <2.0 x 105 A/cm2 Transistor Count: 222
Metallization Mask Layout
IS-1715ARH
VCC (10) VSS (13) INPUT (14) T1 (15) ENBL (16) (11) T2
(10) VCC (12) VSS
VCC (2)
(10) VCC
PWR (3)
(6) AUX
VSS (4)
(5) VSS
VCC (2)
(2) VCC
NOTES: 1. All double sized pads should be double bonded. 2. All pin 2 and pin 10 VCC pads are bonded to VCC for power and noise considerations. (These are lead-frame connected in packaged devices.)
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com 2

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