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| EVERLIGHT ELECTRONICS CO., LTD. MODEL NO: 23-21UBC/C430/TR8 Reverse Package Chip LED Device Number DSE-231-007 REV. 1.0 ECN Page: 1/8 Features Package in 8mm tape on 7" diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. Mono-color type. Description The 23-21 SMD Taping is much smaller than leaded components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. Besides, lightweight makes them ideal for miniature application, etc. Package Dimensions Applications Automotive: backlighting in dashboard and switch. Notes Tolerances Unless Dimension Angle0.5 Telecommunication: indicator and backlighting in telephone and fax. 0.1mm Flat backlight for LCD, switch and symbol. General use. PART NO 23-21UBC/C430/TR8 CHIP Material Emitted Color GaN/SiC Blue Substrate Lens Color Water Clear Office: NO 25,Lane.76, Chung Yang Rd., Sec.3, Tucheng, Taipei 236, Taiwan, R.O.C. TEL: 886-2-2267-2000,2266-9936(22 Lines) FAX: 886-2-2267-6189 http: //www.everlight.com EVERLIGHT ELECTRONICS CO., LTD. MODEL NO: 23-21UBC/C430/TR8 Reverse Package Chip LED Device Number DSE-231-007 REV. 1.0 ECN Page: 2/8 Package Dimensions Loaded quantity per reel 2000 pcs/reel EVERLIGHT ELECTRONICS CO., LTD. MODEL NO: 23-21UBC/C430/TR8 Reverse Package Chip LED Device Number DSE-231-007 REV. 1.0 ECN Page: 3/8 Absolute Maximum Ratings at Ta = 25 : Parameter Reverse Voltage Forward Current Operating Temperature Storage Temperature Soldering Temperature Symbol Vr If Topr Tstg Tsol ESD Pd Rating Unit V mA V mW 5 30 -20 ~ +80 -30 ~ +90 260 (for 5 second) 1000 140 70 Electrostatic Discharge Power Dissipation Peak Forward Current(Duty 1/10 @ 1KHZ) If(Peak) mA Electronic Optical Characteristics : Parameter Luminous intensity Symbol Iv Min. Typ. Max. Unit mcd mcd deg nm nm Condition If=2mA If=20mA If=20mA If=20mA If=20mA ----15 ------------------------- 1 18 130 428 466 65 3.8 ----- ------------------------4.5 50 Viewing Angle Peak Wavelength Dominant Wavelength 21/2 p d Vf Ir Spectrum Radiation Bandwidth Forward Voltage Reverse Current nm V A If=20mA If=20mA Vr=5V EVERLIGHT ELECTRONICS CO., LTD. MODEL NO: 23-21UBC/C430/TR8 Reverse Package Chip LED Device Number DSE-231-007 REV. 1.0 ECN Page: 4/8 Reliability Test Item And Condition : Test Hours/Cycle NO Item Solder Heat Temperature Cycle Test Conditions TEMP : 260 5 H : +85 30min Sample Size 76 Pcs 76 Pcs Ac/Re 0/1 0/1 1 2 5 SEC 50 CYCLE 5 min L : -55 30min H : +100 5min 3 Thermal Shock 10 sec L : -10 5min 50 CYCLE 76 Pcs 0/1 4 5 6 7 High Temperature Storage Low Temperature Storage DC Operating Life High Temperature / High Humidity TEMP : 100 TEMP : -55 If = 20 mA 85/85% RH 1000 HRS 1000 HRS 1000 HRS 1000 HRS 76 Pcs 76 Pcs 76 Pcs 76 Pcs 0/1 0/1 0/1 0/1 EVERLIGHT ELECTRONICS CO., LTD. MODEL NO: 23-21UBC/C430/TR8 Reverse Package Chip LED Device Number DSE-231-007 REV. 1.0 ECN Page: 5/8 Typical Electro-Optical Characteristic Curves : EVERLIGHT ELECTRONICS CO., LTD. MODEL NO: 23-21UBC/C430/TR8 Reverse Package Chip LED Device Number DSE-231-007 REV. 1.0 ECN Page: 6/8 Test Circuit : R LED Precautions For Use : 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage time 2.1 The operation of temperature and R.H. are : 5~35, R.H.60%. 2.2 Once the package is opened, the products should be used within a week. Otherwise, they should be keeping in a dampproof box with desiccants. Considering the tape life , we suggest our customers to use our products within a year(from production date). 2.3 If opened more than one week in an atmosphere 5~35, R.H.60%, they should be treated at 605for 15hrs. 2.4 When you discover that the desiccant in the package has a pink color (normal = blue) , you should treat them in the same conditions as 2.3. EVERLIGHT ELECTRONICS CO., LTD. MODEL NO: 23-21UBC/C430/TR8 Reverse Package Chip LED Device Number DSE-231-007 REV. 1.0 ECN Page: 7/8 Soldering heat reliability ( DIP ) : Please refer to the following figure : Soldering Iron : Basic spec is 5 sec when 260.If temperature is higher, time should be shorter (+10 -1sec). Power dissipation of iron should be smaller than 15 W , and temperature should be controllable. Surface temperature of the device should be under 230 . Rework : 1. Customer must finish rework within 5 sec under 260. 2. The head of iron can not touch copper foil. 3. Twin-head type is preferred. x EVERLIGHT ELECTRONICS CO., LTD. MODEL NO: 23-21UBC/C430/TR8 Reverse Package Chip LED Device Number DSE-231-007 REV. 1.0 ECN Page: 8/8 Reflow Temp / Time to rise cooling preheat |
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