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PREPARED
BY: J-h/Am
DATE: EI..ECTRONIC COMPONENTS GROUP SHARP CORPORATION
SPECNo. ;:: REPRESENTATIVE
DG996028 J&16/99
-TL Ueda APPROVED BY: Jin ?vQ4lsa
/h/99
DATE:
10 pages DMSION:
SPI?CIFICATION
DEVICE SPECIFICATION FOR
Opto-Electronic Devices Division
Light Emitting Diode
MODEL No.
GL5ZV302BOS
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * Home appliance * OA equipment * Audio visual equipment * Telecommunication equipment (Terminal) * Measuring equipment [ * Tooling machines * Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Rescue and security equipment * Traffic signals * Gas leakage sensor breakers I [ * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * Nuclear power control equipment * Medical equipment C (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: CUSTOMERS `DATE: APPROVAL M.Katoh. Department General Manager of Engineering Dcpt.,III Gpto-Electronic Devices Division Electronic Components Group SHARP CORPORATION /
1
1
BY:
DG996028
MODEL No.
Junil6i99
PAGE l/10
GL5ZV302BOS
GL5ZV302BOS
&e&cation
1. Application This specification applies to the light emitting diode device Model No. GLZV302BOS. [AlGaInP (dicing or scribe/brake type) Amber LED device]
2. Outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 2.
3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*...*.*..* 3-l. Absolute maximumratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram
Refer to the attached sheet Page 3-4.
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 5. 4- 1. Test items and test conditions 4-2. Measurement items and Failure judgement criteria
Refer to the attached sheet Page 6. 5. Incoming inspection ,............................................. 5- 1. Applied standard 5-2. Sampling method and level 5-3. Test items, judgement criteria and classifica of defect 5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
6. Supplement . . . . . . . . . . . . . . . ..*................*................... 6- 1. Packing 6-2. Luminous intensity rank 6-3. Dominant wavelength rank 6-4. Environment
Refer to tbe attached sheet Page 7-8.
7. Rmautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..-.....RefertotheattachedsheetPageg~lo. 7-l. 7-2. 7-3. I 74. Lead forming method Notice of installation Sol&ring Conditions For cleaning
DG996028
MODEL No.
Jud16/99
PAGE
I
2. Outline dimensions and pin
GL5ZV302BOS
I
2/10
co~ecti~~~
2.
54NOM
1 II
*
0 +I ,, ln 6 . 1
.'
FincoMections 0. 0. Ancde cathode
Note) Unspecifiedtol. to be t02mn1
Note) Cold,roUedsteelleadsare plated with but the tie-bar cut portionshaveno plating do not solderthis part of the product.
unit mm
Material Lead : (Fe) Cold rolled steel Package: Epoxy resin
Finish Lead : Sn platedor wave soldering
Drawing No. 51106009
DG996028 MODEL No. GL5ZV302BOS
.Jun/16/99 PAGE 3110
3. Ratings and characteristics
(Note 1) Duty ratio=l/lO,Pulse width=O. lms (Note 2) At the position of 1.6mm from the bottom resin package
(Note 3) Refer
to
the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
120 2 e + f 2 -z E 5 : a 100 80 60 4o 20 0 -25 0 Ambient 25 50 75 85100 TarC) 125 !5
60 50 40 30 20 10 0 -25 0 Ambient 25 50 Temperature 750J 100 Ta(OC) 125
Temperature
DG996028 MODEL No.
1 Junl16l99 1 PAGE 4110
I
Peak Forward Current vs. Duty Ratio (Ta=25W
GLfZV302BOS
10 l/100 l/10 Duty Raito 1 DR 10
3-4.
Characteristics
Forwaid
Diag-ram(typ)
Current
(Note 1)
vs.Forward Voltage (Ta=25'%) Relative Luminous Intensity vs. Ambient Temperature ( I F=2Om4)
100
z
O-
100
.f E 2 .-: !i ii 1 1.21.41.6 Forward
Relative Luminous
0. 1 1.8 Vo I tage
Intensity vs.
10
llllllllllllllll
-60 -40 -20
Ambient
2
2.22.42.6 VF (v)
Frorard Voltace
0
20 40 60 80 100 120
Temprature Ta("C)
(Ta+Y'C) 1000
0. 1 Forward (Note
1 Current
10 IF h4) data
100
1) Above characteristic
data are typical
and not a guaranneed
data.
I
DG996028
MODEZ No.
Jun/16/!39
PAGE
I
GLSZV302BOS
(
5110
4. Reliability The reliability of products shall be satisfied with items listed below.
4-2. Measurement items and Failure judgement criteria *1 Measurement Forward voltage Reverse current Luminous intensity Symbol
vF
Failure judgement criteria *2 v, > u.s&. x 1.2
IR
IR > U.S.L. x 2.0 Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
IV
s Solderability : Solder shall be adhere at the area of 95% or more of dipped portion. s Terminal strength : Package is not destroyed, and terminal is not slack *l: Measuring condition is in accordance with specification. *2: U.S.L. is shown by Upper Specification Limit. *3: IF MAX.is shown by forward current of absolute maximum ratings.
LX996028 MODEL No. GLSZV302BOS
I Jun/16/99
1 PAGE
6110
5. Incoming inspection 5-l. Applied standard : IS0 2859-l 5-2. Sampling method and level : A single sampling plan,notmal inspection level II : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items, judgement criteria and classifica of defect No. 1 2 3 4 5 6 7 8 Test items Disconnection Position of Cutting off rim Reverse tenninai Outline dimensions Characteristics Cut off the rim Foreign substance Scratch judgement criteria Not emit light Different from dimension Different from dimension Not satisfy outline specification Over the limit value of specification at Vr, Ia, and Iv Exceed -0.2mm White point : Exceed Q 0.3mm (on top view) Black point : Exceed 4 0.3mm (on top view) String form : Exceed 3.Omm (on top view) Exceed Q 0.3mm or O.lmm x l.Omm (on top view) Exceed 4~0.3mm (on top view) 10 11 12 Uneven density of material for scattering Unbalanced center Burr Insertion position of I Extremely uneven density Exceed #.25mm from package center Minor defect Major defect
I
C
,lassifica of defer
Exceed +0.2mm againstprovided dimension Insertion oosition of terminal
I 13 I
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect No. 14 15 Test items Chapped the surface Hollow tbe surface judgement criteria The surface chapped is striking for see the lamp top Tbe surface hollow is striking for see the lamp top classifica of defec Minor defect
DG996028 MODEL No.
Jlld16/!w
PAGE 7110
GL5ZV302BOS
6. Supplement 6-1. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack Product weight : 0.28g (One Product,Typ.) (Indication label sample) SHIPldENT TAEU? PARTNo. GLXV302BOS - Modelnumber QUANTITY 250 - Quantity of products LOTNo. KA99819 - Lot number * 0 0 Q@Q o-n t - Luminous intensity rank dominant wavelength rank SHARP= RADEIN JAPAN + Production country
*y
g
q --- cJcln0
@ @ @ @ @)
Production plant code(to be indicated alphabetically) Support code Year of production(the last two figures of the year) (to be indicated alphabetically with January corresponding to A) Month of production Date of production(Ol-31)
6-l-2. Cuter package Put a packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer package out line dimension Width: 14Omn1, Depth: 225mm, Hight: . 6-2.Luminous intensity rank (Note 1) Luminous intensity Rank K 383 746 L 552 1075 M 795 1548 N 1144 f 2229 `)
%un (Ta=25"c) Condition 1*2OnlA
unit mcd
(Note 1) Tolerance:fl5% In regardto luminousintensity, the following rankingshallbe carriedout. However the quantity of eachrank shallnot be prescribed. In caseof the distribution of the luminousintensity shift to high, at that point new upperrank is prescribedand lower rank is delete. 6-3Dominant wavelengthrank (Note 2) Rank Dominant wavelength H 581.0 584.5 I 583.5 587.0 J 586.0 589.5 K 588.5 592.0 L 591.0 594.5 A Ta=25"C) cm- -- ., unit Condition
run
IF2OnlA
f
(Note 2) The condition of measurement : The measurement of the-tight emission from the front side of lamp.
This rank value is the setting value of whenthat classifies the rank and be not a guaranteevalue. it Also I shallnot askthe delivery ratio of eachrank.
DG596028
MODEL No.
Jun/16/99
PAGE
GL5ZV302BOS
8110
6-4. Environment 641. Ozonosphere destructivechemicals. (1) The &vice does& contain following substance. (2) The &vice doesn't have a production line whoseprocess requiresfollowing substance. Restrictedpart: CFCs,Mones,CCl+Tricbloroethane(Methychloroform) 642. Bromic non-burningmaterials The device doesn'tcontainbromic non-burningmaterk&(PBBOs,PBBs)
xi996028
MODEL No.
Juni16i99
PAGE
GL5ZV302BOS
9/10
7. Precaution5 use for ? - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-Z-l installation on a PW B !hen mounting an LED lamp on a PWB, not apply do physical stress to the lead pins. The lead pin pitch should match the PTEIpin-hole pitch:absolutely avoid widening or narrowing the lead pins. $nen positioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 lVhenan LED 1 is mounted directly on a PWB If the bottom face of an LED lamp is mounted directly on single-sided P'JE!,the base of the lead pins may be subjected to physical stress due to PYBwarp,cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damageto resin etc., is found. Then an LED lamp is mounted on a double-sided PWBthe heat during soldering affects the resin;therefore,keep the LED lamp more that 1.6mmafloat above the P'R. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat,mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.h hole of the case should be designed not to subject the inside of resin to any undue stress.
l l
r
1
lb
0 n I.618
GL5ZV302BOS
I
lo/lo
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions Conditions Type of Soldering 295C&SC, within 3 seconds 1. Manual soldering 260Ct 5C. vithin 5 seconds 2. Wave soldering Preheating 70C to 8O"C, vithin 30 seconds 3. Auto soldering S oldering 245C+5"c, vithin 5 seconds (Note) Avoid dipping resin into soldering bath Avoid applying stress to lead pins while they are heated. For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection way occur.
7 - 4. For cleaning
(1)
(21
Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output, cleaning time, P!!E? size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.

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