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www..com DB-499D-470 RF power amplifier using 1 x START499D NPN RF silicon transistor Preliminary Data Features Excellent thermal stability Frequency: 430 - 470 MHz Supply voltage: 3.6 V Output power: 29 dBm Power gain: 19 dB Efficiency: 52 % BeO free amplifier Mechanical specification: L = 60 mm, W = 30 mm Description The DB-499D-470 is a NPN silicon RF power amplifier designed for UHF 2-way radio applications Table 1. Device summary Order codes DB-499D-470 February 2009 Rev 1 1/11 www.st.com 11 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www..com Contents DB-499D-470 Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.1 VCC = 3.6, ICQ = 400 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5.1 5.2 Thermal pad and via design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2/11 www..com DB-499D-470 Electrical data 1 1.1 Electrical data Maximum ratings Table 2. Symbol VCEO VEBO IC PDISS TJ TSTG Absolute maximum ratings (TCASE = +25 C) Parameter Collector - emitter voltage Emitter - base voltage Collector - current Power dissipation Max. operating junction temperature Storage temperature Value 4.5 1.5 1.0 1.7 150 -65 to +150 Unit V V A W C C 2 Electrical characteristics TA = +25 C, VCC = 3.6 V, Icq = 400 mA, unless otherwise specified Table 3. Symbol f Pout Gp ND H2 H3 RF data Parameters Frequency range Output power Power gain Efficiency 2nd harmonic 3rd harmonic PIN = 10 dBm POUT = 29 dBm POUT = 29 dBm PIN = 10 dBm PIN = 10 dBm Test conditions Min 430 29 19 51 - 54 -30 -50 Typ Max 470 Unit MHz dBm dB % dBc dBc 3/11 www..com Typical performance DB-499D-470 3 3.1 Figure 1. Typical performance VCC = 3.6, ICQ = 400 mA Gain vs output power Figure 2. Efficiency vs Pout Figure 3. Harmonics 4/11 www..com DB-499D-470 Test circuit 4 Test circuit Table 4. Test circuit schematic Table 5. Components part list for DB-499D-470 Description Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Inductor Inductor Inductor Inductor Ferrite Bead Resister Potentiometer Resister 470 10 k 4.7 L = 14 mm L = 2 mm Transmission line L = 3.6 mm L = 12.5 mm BJT 0603 W=0.9 mm W=0.9 mm W=0.9 mm W=0.9 mm STMicroelectronics FR4 Er=4.5 THk = 0.020" 1 OZ Cu both sides START499D Value 10 F 10 nF 100 nF 1000 pF 100 pF 12 pF 15 pF 47 nH 22 nH 8.2 nH 2.55 nH Case size 0603 0603 0603 0603 0603 0603 0603 0603 1812 0603 0906 0603 0603 Bourns electronics 3214W-1-103E Manufacturer MURATA MURATA MURATA MURATA MURATA MURATA MURATA Coilcraft Coilcraft Coilcraft Coilcraft PANASONIC Part code GRM188R60J106ME47 GRM188R71H103KA01 GRM188R71H104KA01 GRM188R71H102KA01 GRM1885C1H101JA01 GRM1885C1H120JA01 GRM1885C1H150JA01 0603HP-47NXJL 1812SMS-22NJLB 0603HP-8N2XJL 0906-3JLB EXCELDRC35C Component ID C1 C2 C3 C5, C7 C4,C6,C8,C11 C9 C10 L1 L2 L3 L4 B1, B2 R1 R2 R3 TL1 TL2 TL3 TL4 BJT1 Board 5/11 www..com Package mechanical data DB-499D-470 5 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 6. Dim. Min A B B1 C C1 D D1 E e e1 H L 1.4 0.44 0.36 0.35 0.35 4.4 1.62 2.29 1.42 2.92 3.94 0.89 SOT-89 mechanical data mm. Typ Max 1.6 0.56 0.48 0.44 0.44 4.6 1.83 2.6 1.57 3.07 4.25 1.2 Min 55.1 17.3 14.2 13.8 13.8 173.2 63.8 90.2 55.9 115.0 155.1 35.0 Inch Typ Max 63.0 22.0 18.9 17.3 17.3 181.1 72.0 102.4 61.8 120.9 167.3 47.2 Figure 4. Package dimensions 6/11 www..com DB-499D-470 Package mechanical data 5.1 Thermal pad and via design Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 5. Pad layout details SOT-89 7/11 www..com Package mechanical data DB-499D-470 5.2 Soldering profile Figure 6 shows the recommended solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 6. Recommended solder profile Figure 7 shows the recommended solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. Figure 7. Recommended solder profile for leaded devices 8/11 www..com DB-499D-470 Figure 8. Reel information Package mechanical data 9/11 www..com Revision history DB-499D-470 6 Revision history Table 7. Date 23-Feb-2009 Document revision history Revision 1 First release Changes 10/11 www..com DB-499D-470 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11 |
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