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| ACTS240T Data Sheet July 1999 File Number 4610.1 High Reliability, Radiation Hardened Octal Buffer/Line Driver, Three-State, Inverting Intersil`s Satellite Applications FlowTM (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers, while maintaining a high level of reliability. The Intersil ACTS240T is a Radiation Hardened High Reliability, High-Speed CMOS/SOS Octal Buffer/Line Driver with three-state outputs having two active low enable inputs. Each enable input controls a set of four inverting buffer/line drivers. A HIGH on the enable input places the outputs in a high impedance state. Features * QML Class T, Per MIL-PRF-38535 * Radiation Performance - Gamma Dose () 1 x 105 RAD(Si) - Latch-Up Free Under Any Conditions - Single Event Upset (SEU) Immunity: <1 x 10-10 Errors/Bit/Day (Typ) - SEU LET Threshold . . . . . . . . . . . . .>100 MEV-cm2/mg * 1.25 Micron Radiation Hardened SOS CMOS * Significant Power Reduction Compared to ALSTTL Logic * DC Operating Voltage Range . . . . . . . . . . . . 4.5V to 5.5V * Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min * Fast Propagation Delay . . . . . . . 17.5ns (Max), 12ns (Typ) Specifications Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the ACTS240T are contained in SMD 5962-96717. A "hot-link" is provided from our website for downloading. www.intersil.com/spacedefense/newsafclasst.asp Intersil`s Quality Management Plan (QM Plan), listing all Class T screening operations, is also available on our website. www.intersil.com/quality/manuals.asp Pinouts ACTS240T (SBDIP), CDIP2-T20 TOP VIEW AEN AI1 BO4 AI2 BO3 AI3 BO2 1 2 3 4 5 6 7 8 9 20 VCC 19 BEN 18 AO1 17 BI4 16 AO2 15 BI3 14 AO3 13 BI2 12 AO4 11 BI1 Ordering Information ORDERING NUMBER 5962R9671701TRC 5962R9671701TXC PART NUMBER ACTS240DTR ACTS240KTR TEMP. RANGE (oC) -55 to 125 -55 to 125 AEN AI1 BO4 AI2 BO3 AI3 BO2 AI4 BO1 GND AI4 BO1 GND 10 ACTS240T (FLATPACK), CDFP4-F20 TOP VIEW 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC BEN AO1 BI4 AO2 BI3 AO3 BI2 AO4 BI1 NOTE: Minimum order quantity for -T is 150 units through distribution, or 450 units direct. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999 ACTS240T Functional Diagram NOTE: (1 of 2) AE 1(19) AI1 2(11) P AO1 N 18(9) P AI2 4(13) AO2 N 16(7) P AI3 6(15) AO3 N 14(5) P AI4 8(17) AO4 N 12(3) TRUTH TABLE INPUTS AE, BE L L H AIn, BIn L H X OUTPUT AOn, BOn H L Z NOTE: H = High Voltage Level, L = Low Voltage Level, X = Immaterial, Z = High Impedance 2 ACTS240T Die Characteristics DIE DIMENSIONS: (2540m x 2540m x 533m 51m) 100 x 100 x 21mils 2mil METALLIZATION: Type: Al Si Cu Thickness: 10.0kA 2kA SUBSTRATE POTENTIAL: Unbiased (Silicon on Sapphire) Bond Pad #20 (VCC) First Bond Pad #10 (Gnd) Uses Two Bond Wires Bond Pad #20 (VCC) Uses Two Bond Wires BACKSIDE FINISH: Sapphire PASSIVATION: Type: Silox (SiO2) Thickness: 8.0kA 1.0kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 164 PROCESS: CMOS SOS Metallization Mask Layout ACTS240T AI1 (2) AEN (1) VCC (20) VCC (20) BEN (19) (18) AO1 BO4 (3) (17) BI4 AI2 (4) (16) AO2 BO3 (5) (15) BI3 AI3 (6) (14) AO3 BO2 (7) (13) BI2 AI4 (8) BO1 (9) AO4 (12) (10) (10) GND GND (11) BI1 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 3 |
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