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PACKAGE INFORMATION
Page Index DIP LQFP QFP SDIP SO SSOP TSSOP VSO Soldering 1694 1696 1706 1710 1712 1713 1721 1725 1726 1728
Philips Semiconductors
Package information
INDEX NAME DIP (dual in-line package) DIP8 DIP14 DIP16 DIP16 DIP16 DIP18 DIP20 DIP24 DIP28 DIP40 plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) plastic dual in-line package; 16 leads (300 mil); long body plastic dual in-line package; 16 leads (300 mil) plastic dual in-line package; 16 leads (300 mil) plastic dual in-line package; 18 leads (300 mil) plastic dual in-line package; 20 leads (300 mil) plastic dual in-line package; 24 leads (600 mil) plastic dual in-line package; 28 leads (600 mil) plastic dual in-line package; 40 leads (600 mil) plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm DESCRIPTION
Package outlines
VERSION
PAGE
SOT97-1 SOT27-1 SOT38-1 SOT38-4 SOT38-9 SOT102-1 SOT146-1 SOT101-1 SOT117-1 SOT129-1
1696 1697 1698 1699 1700 1701 1702 1703 1704 1705
LQFP (low profile quad flat package) LQFP32 LQFP64 LQFP100 LQFP128 SOT358-1 SOT314-2 1706 1707 1708 1709
plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SOT425-1 plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm plastic shrink dual in-line package; 42 leads (600 mil) SOT205-1 SOT307-2
QFP (quad flat package) QFP44 QFP44 1710 1711
SDIP (shrink dual in-line package) SDIP42 SOT270-1 1712
SO (small outline package) SO8 SO8 SO14 SO16 SO16 SO20 SO24 SO28 plastic small outline package; 8 leads; body width 3.9 mm plastic small outline package; 8 leads; body width 7.5 mm plastic small outline package; 14 leads; body width 3.9 mm plastic small outline package; 16 leads; body width 3.9 mm plastic small outline package; 16 leads; body width 7.5 mm plastic small outline package; 20 leads; body width 7.5 mm plastic small outline package; 24 leads; body width 7.5 mm plastic small outline package; 28 leads; body width 7.5 mm SOT96-1 SOT176-1 SOT108-1 SOT109-1 SOT162-1 SOT163-1 SOT137-1 SOT136-1 1713 1714 1715 1716 1717 1718 1719 1720
SSOP (shrink small outline package) SSOP16 SSOP20 SSOP24 SSOP28 plastic shrink small outline package; 16 leads; body width 4.4 mm plastic shrink small outline package; 20 leads; body width 4.4 mm plastic shrink small outline package; 24 leads; body width 5.3 mm plastic shrink small outline package; 28 leads; body width 5.3 mm SOT369-1 SOT266-1 SOT340-1 SOT341-1 1721 1722 1723 1724
1999 Oct 27
1694
Philips Semiconductors
Package information
Package outlines
NAME
DESCRIPTION
VERSION
PAGE
TSSOP (thin shrink small outline package) TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 1725
VSO (very small outline package) VSO40 VSO56 plastic very small outline package; 40 leads plastic very small outline package; 56 leads SOT158-1 SOT190-1 1726 1727
1999 Oct 27
1695
Philips Semiconductors
Package information
DIP DIP8: plastic dual in-line package; 8 leads (300 mil)
Package outlines
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001AN EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1999 Oct 27
1696
Philips Semiconductors
Package information
Package outlines
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 14 8 MH wM (e 1)
pin 1 index E
1
7
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
1999 Oct 27
1697
Philips Semiconductors
Package information
Package outlines
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
1999 Oct 27
1698
Philips Semiconductors
Package information
Package outlines
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 b2 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.030
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1999 Oct 27
1699
Philips Semiconductors
Package information
Package outlines
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-9
seating plane
D
ME
A2
A
L
A1
Z
e
b1
wM
c (e1)
b 16 9
b2
MH
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (mm dimensions are derived from the original inch dimensions) UNIT mm inches A max. 4.32 0.17 A1 min. 0.38 0.015 A2 max. 3.56 0.14 b 1.65 1.40 0.065 0.055 b1 0.51 0.41 0.020 0.016 b2 1.14 0.76 0.045 0.030 c 0.36 0.20 0.014 0.008 D (1) 19.30 18.80 0.76 0.74 E (1) 6.45 6.24 0.254 0.246 e 2.54 0.10 e1 7.62 0.30 L 3.81 2.92 0.150 0.115 ME 8.23 7.62 0.324 0.300 MH 9.40 8.38 0.37 0.33 w 0.254 0.01 Z (1) max. 0.76 0.030
Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTLINE VERSION SOT38-9 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-07-24
1999 Oct 27
1700
Philips Semiconductors
Package information
Package outlines
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 18 10 b2 MH wM (e 1)
pin 1 index E
1
9
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-10-14 95-01-23
1999 Oct 27
1701
Philips Semiconductors
Package information
Package outlines
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
1999 Oct 27
1702
Philips Semiconductors
Package information
Package outlines
DIP24: plastic dual in-line package; 24 leads (600 mil)
SOT101-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 24 13 MH wM (e 1)
pin 1 index E
1
12
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 32.0 31.4 1.26 1.24 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT101-1 REFERENCES IEC 051G02 JEDEC MO-015AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-23
1999 Oct 27
1703
Philips Semiconductors
Package information
Package outlines
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH wM (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
ISSUE DATE 92-11-17 95-01-14
1999 Oct 27
1704
Philips Semiconductors
Package information
Package outlines
DIP40: plastic dual in-line package; 40 leads (600 mil)
SOT129-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 40 21 MH wM (e 1)
pin 1 index E
1
20
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.70 1.14 0.067 0.045 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 15.24 0.60
L 3.60 3.05 0.14 0.12
ME 15.80 15.24 0.62 0.60
MH 17.42 15.90 0.69 0.63
w 0.254 0.01
Z (1) max. 2.25 0.089
52.50 51.50 2.067 2.028
14.1 13.7 0.56 0.54
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT129-1 REFERENCES IEC 051G08 JEDEC MO-015AJ EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1999 Oct 27
1705
Philips Semiconductors
Package information
LQFP LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
Package outlines
SOT358-1
c
y X
24 25
17 16 ZE
A
e E HE wM bp pin 1 index 32 1 e bp D HD wM B vM B 8 ZD vM A 9 detail X L Lp A A2 A 1 (A 3)
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.4 0.3 c 0.18 0.12 D (1) 7.1 6.9 E (1) 7.1 6.9 e 0.8 HD 9.15 8.85 HE 9.15 8.85 L 1.0 Lp 0.75 0.45 v 0.2 w 0.25 y 0.1 Z D (1) Z E (1) 0.9 0.5 0.9 0.5 7 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT358 -1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-12-19 97-08-04
1999 Oct 27
1706
Philips Semiconductors
Package information
Package outlines
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
c
y X A 48 49 33 32 ZE
e E HE wM bp 64 1 pin 1 index 16 ZD bp D HD wM B vM B vM A 17 detail X L Lp A A2 A1 (A 3)
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.5 HD HE L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 7o 0o
12.15 12.15 11.85 11.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT314-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-12-19 97-08-01
1999 Oct 27
1707
Philips Semiconductors
Package information
Package outlines
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
c
y X 75 76 51 50 ZE A
e E HE wM bp L pin 1 index 100 1 ZD bp D HD wM B vM B 25 vM A 26 detail X Lp A A2 (A 3)
A1
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.20 0.05 A2 1.5 1.3 A3 0.25 bp 0.28 0.16 c 0.18 0.12 D (1) 14.1 13.9 E (1) 14.1 13.9 e 0.5 HD HE L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 1.15 0.85 1.15 0.85 7 0o
o
16.25 16.25 15.75 15.75
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT407-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-12-19 97-08-04
1999 Oct 27
1708
Philips Semiconductors
Package information
Package outlines
LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm
SOT425-1
c
y X
A 102 103 65 64 ZE
e E HE A A2 A 1
(A 3) Lp L detail X
wM pin 1 index 128 1 wM D HD ZD B vM B 39 38 bp vM A bp
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 20.1 19.9 E (1) 14.1 13.9 e 0.5 HD HE L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D(1) Z E(1) 0.81 0.59 0.81 0.59 7 0o
o
22.15 16.15 21.85 15.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT425-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 96-04-02 97-08-04
1999 Oct 27
1709
Philips Semiconductors
Package information
QFP
Package outlines
QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm
SOT205-1
c
y X
33 34
23 22 ZE
A
e E HE wM bp pin 1 index 44 1 11 ZD bp D HD wM B vM B 12 detail X L Lp A A2 A1 (A 3)
e
vM A
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.60 A1 0.25 0.05 A2 2.3 2.1 A3 0.25 bp 0.50 0.35 c 0.25 0.14 D (1) 14.1 13.9 E (1) 14.1 13.9 e 1 HD 19.2 18.2 HE 19.2 18.2 L 2.35 Lp 2.0 1.2 v 0.3 w 0.15 y 0.1 Z D (1) Z E (1) 2.4 1.8 2.4 1.8 7 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT205-1 REFERENCES IEC 133E01A JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-08-01
1999 Oct 27
1710
Philips Semiconductors
Package information
Package outlines
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
c
y X
A 33 34 23 22 ZE
e E HE wM bp pin 1 index 44 1 bp D HD wM 11 ZD B vM B vMA 12 detail X A A2 (A 3) Lp L
A1
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.10 A1 0.25 0.05 A2 1.85 1.65 A3 0.25 bp 0.40 0.20 c 0.25 0.14 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD 12.9 12.3 HE 12.9 12.3 L 1.3 Lp 0.95 0.55 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 10 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT307-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-08-01
1999 Oct 27
1711
Philips Semiconductors
Package information
SDIP SDIP42: plastic shrink dual in-line package; 42 leads (600 mil)
Package outlines
SOT270-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 wM (e 1) MH b 42 22
pin 1 index E
1
21
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 5.08 A1 min. 0.51 A2 max. 4.0 b 1.3 0.8 b1 0.53 0.40 c 0.32 0.23 D (1) 38.9 38.4 E (1) 14.0 13.7 e 1.778 e1 15.24 L 3.2 2.9 ME 15.80 15.24 MH 17.15 15.90 w 0.18 Z (1) max. 1.73
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT270-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-02-13 95-02-04
1999 Oct 27
1712
Philips Semiconductors
Package information
SO SO8: plastic small outline package; 8 leads; body width 3.9 mm
Package outlines
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03S JEDEC MS-012AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-05-22
1999 Oct 27
1713
Philips Semiconductors
Package information
Package outlines
SO8: plastic small outline package; 8 leads; body width 7.5 mm
SOT176-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp L 1 e bp 4 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 7.65 7.45 0.30 0.29 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.45 Lp 1.1 0.45 0.043 0.018 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 2.0 1.8 0.079 0.071
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.057 0.394
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT176-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-25 97-05-22
1999 Oct 27
1714
Philips Semiconductors
Package information
Package outlines
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 pin 1 index Lp 1 e bp 7 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06S JEDEC MS-012AB EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
1999 Oct 27
1715
Philips Semiconductors
Package information
Package outlines
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 pin 1 index Lp 1 e bp 8 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
ISSUE DATE 95-01-23 97-05-22
1999 Oct 27
1716
Philips Semiconductors
Package information
Package outlines
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Oct 27
1717
Philips Semiconductors
Package information
Package outlines
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Oct 27
1718
Philips Semiconductors
Package information
Package outlines
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Oct 27
1719
Philips Semiconductors
Package information
Package outlines
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Oct 27
1720
Philips Semiconductors
Package information
SSOP SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm
Package outlines
SOT369-1
D
E
A X
c y HE vM A
Z
16
9
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0.00 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.25 0.13 D (1) 5.30 5.10 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT369-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 94-04-20 95-02-04
1999 Oct 27
1721
Philips Semiconductors
Package information
Package outlines
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
1999 Oct 27
1722
Philips Semiconductors
Package information
Package outlines
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150AG EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
1999 Oct 27
1723
Philips Semiconductors
Package information
Package outlines
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
SOT341-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 14 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 10.4 10.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.1 0.7 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT341-1 REFERENCES IEC JEDEC MO-150AH EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
1999 Oct 27
1724
Philips Semiconductors
Package information
TSSOP TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
Package outlines
SOT505-1
D
E
A
X
c y HE vMA
Z
8
5
A2 pin 1 index
A1
(A3)
A
Lp L
1
e bp
4
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.45 0.25 c 0.28 0.15 D(1) 3.10 2.90 E(2) 3.10 2.90 e 0.65 HE 5.10 4.70 L 0.94 Lp 0.70 0.40 v 0.1 w 0.1 y 0.1 Z(1) 0.70 0.35 6 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT505-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-04-09
1999 Oct 27
1725
Philips Semiconductors
Package information
VSO VSO40: plastic very small outline package; 40 leads
Package outlines
SOT158-1
D
E
A X
c y HE vMA
Z 40 21
Q A2 A1 pin 1 index Lp L 1 e bp 20 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.70 0.11 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 bp 0.42 0.30 c 0.22 0.14 D (1) 15.6 15.2 E (2) 7.6 7.5 0.30 0.29 e 0.762 0.03 HE 12.3 11.8 0.48 0.46 L 2.25 Lp 1.7 1.5 Q 1.15 1.05 v 0.2 w 0.1 y 0.1 Z (1) 0.6 0.3
0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60
0.067 0.089 0.059
0.045 0.024 0.008 0.004 0.004 0.041 0.012
7 0o
o
Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT158-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1999 Oct 27
1726
Philips Semiconductors
Package information
Package outlines
VSO56: plastic very small outline package; 56 leads
SOT190-1
D
E
A X
c y HE vM A
Z 56 29
Q A2 A1 pin 1 index Lp L 1 e bp 28 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 3.3 0.13 A1 0.3 0.1 0.012 0.004 A2 3.0 2.8 0.12 0.11 A3 0.25 0.01 bp 0.42 0.30 c 0.22 0.14 D (1) 21.65 21.35 E (2) 11.1 11.0 e 0.75 HE 15.8 15.2 L 2.25 Lp 1.6 1.4 Q 1.45 1.30 v 0.2 w 0.1 y 0.1 Z (1) 0.90 0.55
0.017 0.0087 0.85 0.012 0.0055 0.84
0.44 0.62 0.0295 0.43 0.60
0.063 0.089 0.055
0.057 0.035 0.008 0.004 0.004 0.051 0.022
7 0o
o
Note 1. Plastic or metal protrusions of 0.3 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT190-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 96-04-02 97-08-11
1999 Oct 27
1727

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