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HiPerFETTM Power MOSFETs Q-Class N-Channel Enhancement Mode Avalanche Rated, Low Qg, High dv/dt VDSS IXFN 44N50Q IXFN 48N50Q ID25 RDS(on) 500 V 44 A 120 m 500 V 48 A 100 m trr 250 ns Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR EAS dv/dt PD TJ TJM Tstg VISOL Md Weight Symbol Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGS = 1 M Continuous Transient TC = 25C 44N50 48N50 Maximum Ratings 500 500 20 30 44 48 176 192 48 60 2.5 15 500 -55 to +150 150 -55 to +150 V V V V A A A A A mJ mJ V/ns W C C C V~ V~ Nm/lb.in. Nm/lb.in. g miniBLOC, SOT-227 B (IXFN) E153432 S G S TC = 25C, pulse width limited by TJM 44N50 48N50 TC = 25C TC = 25C IS IDM, di/dt 100 A/s, VDD VDSS, TJ 150C, RG = 2 TC = 25C G = Gate S = Source D = Drain D Either Source terminal at miniBLOC can be used as Main or Kelvin Source 50/60 Hz, RMS IISOL 1 mA t = 1 min t=1s 2500 3000 1.5/13 1.5/13 30 Mounting torque Terminal connection torque Features * IXYS advanced low Qg process * Low gate charge and capacitances - easier to drive -faster switching * Unclamped Inductive Switching (UIS) rated * Low RDS (on) * Fast intrinsic diode * International standard package * miniBLOC with Aluminium nitride isolation for low thermal resistance * Low terminal inductance (<10 nH) and stray capacitance to heatsink (<35pf) * Molding epoxies meet UL 94 V-0 flammability classification Applications * DC-DC converters * Battery chargers * Switched-mode and resonant-mode power supplies * DC choppers * Temperature and lighting controls Advantages * Easy to mount * Space savings * High power density Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 500 2.0 4.0 100 TJ = 25C TJ = 125C 100 2 120 100 V V nA A mA VDSS VGS(th) IGSS IDSS RDS(on) VGS = 0 V, ID = 1 mA VDS = VGS, ID = 4 mA VGS = 20 VDC, VDS = 0 VDS = VDSS VGS = 0 V VGS = 10 V, ID = 0.5 ID25 44N50 48N50 Pulse test, t 300 s, duty cycle d 2 % (c) 2003 IXYS All rights reserved DS98715B(08/03) IXFN 44N50Q IXFN 48N50Q Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 30 42 7000 VGS = 0 V, VDS = 25 V, f = 1 MHz 960 230 33 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 RG = 4.7 (External), 22 75 10 190 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 40 86 0.26 0.05 S pF pF pF ns ns ns ns nC nC nC K/W K/W M4 screws (4x) supplied Dim. A B C D E F G H J K L M Millimeter Min. Max. 31.50 7.80 4.09 4.09 4.09 14.91 30.12 38.00 11.68 8.92 0.76 12.60 25.15 1.98 4.95 26.54 3.94 4.72 24.59 -0.05 31.88 8.20 4.29 4.29 4.29 15.11 30.30 38.23 12.22 9.60 0.84 12.85 25.42 2.13 5.97 26.90 4.42 4.85 25.07 0.1 Inches Min. 1.240 0.307 0.161 0.161 0.161 0.587 1.186 1.496 0.460 0.351 0.030 0.496 0.990 0.078 0.195 1.045 0.155 0.186 0.968 -0.002 Max. 1.255 0.323 0.169 0.169 0.169 0.595 1.193 1.505 0.481 0.378 0.033 0.506 1.001 0.084 0.235 1.059 0.174 0.191 0.987 0.004 miniBLOC, SOT-227 B gfs Ciss Coss Crss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCK VDS = 20 V; ID = 0.5 * ID25, pulse test Source-Drain Diode Symbol IS ISM VSD trr QRM IRM Test Conditions VGS = 0 V Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 48 192 1.5 250 A A V ns C A N O P Q R S T U Repetitive; pulse width limited by TJM IF = IS, VGS = 0 V, Pulse test, t 300 s, duty cycle d 2 % IF = 25A, -di/dt = 100 A/s, VR = 100 V 1.0 10 IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343 IXFN 44N50Q IXFN 48N50Q Fig. 1. Output Characteristics @ 25 Deg. C 48 42 36 VGS = 10V 7V 6V 120 Fig. 2. Extended Output Characteristics @ 25 deg. C VGS = 10V 8V 7V 90 I D - Amperes 24 18 12 6 0 0 1 2 3 4 5 6 7 8 I D - Amperes 30 60 6V 30 5V 0 5V V D S - Volts Fig. 3. Output Characteristics @ 125 Deg. C 48 42 36 VGS = 10V 7V 6V 2.8 2.6 2.4 0 2 4 6 8 V D S - Volts 10 12 14 16 18 20 Fig. 4. RDS(on) Norm alized to ID25 Value vs. Junction Tem perature VGS = 10V R D S (on) - Normalized 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 I D = 48A I D = 24A I D - Amperes 30 24 18 12 6 0 0 2 4 6 8 10 12 14 16 5V -50 -25 0 25 50 75 100 125 150 V D S - Volts Fig. 5. RDS(on) Norm alized to ID25 Value vs. ID 3.4 3.1 VGS = 10V TJ = 125C 54 48 42 TJ - Degrees Centigrade Fig. 6. Drain Current vs. Case Tem perature R D S (on) - Normalized 2.8 2.5 2.2 1.9 1.6 1.3 1 0.7 0 12 24 36 48 60 72 I D - Amperes TJ = 25C 84 96 108 120 36 30 24 18 12 6 0 -50 -25 0 25 50 75 100 125 150 I D - Amperes (c) 2003 IXYS All rights reserved TC - Degrees Centigrade IXFN 44N50Q IXFN 48N50Q Fig. 7. Input Adm ittance 60 54 48 80 70 60 Fig. 8. Transconductance g f s - Siemens I D - Amperes 42 36 30 24 18 12 6 0 3.5 4 4.5 5 5.5 6 6.5 TJ = 125C 25C -40C 50 40 30 20 10 0 0 TJ = -40C 25C 125C 6 12 18 24 30 36 42 48 54 60 V G S - Volts Fig. 9. Source Current vs. Source-ToDrain Voltage 100 90 80 10 9 8 7 VDS = 250V I D = 24A I G = 10mA I D - Amperes Fig. 10. Gate Charge I S - Amperes 70 VG S - Volts TJ = 25C 0.8 0.9 1 1.1 1.2 60 50 40 30 20 10 0 0.3 0.4 0.5 0.6 0.7 TJ = 125C 6 5 4 3 2 1 0 0 20 40 60 80 100 120 140 160 180 200 V S D - Volts Fig. 11. Capacitance 10000 f = 1MHz C iss 1 Q G - nanoCoulombs Fig. 12. Maxim um Transient Therm al Resistance Capacitance - pF 1000 C oss R (th) J C - (C/W) 35 40 0.1 C rss 100 0 5 10 15 20 25 30 0.01 V D S - Volts IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 1 Pulse Width - milliseconds 10 100 1000 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343 |
Price & Availability of IXFN44N50Q03
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