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| www..com 1/4 DATA SHEET 2007.01 Z TAIWAN TAIYO INK CO.,LTD No.7, Ta Tung 2nd Rd., Kuan-Yin Industry Park Taoyuan, Taiwan, R.O.C. TEL:886-3-483-3231 FAX:886-3-483-3599 PSR-4000 PF9L / CA-40 PF9 (PSR-4000GW / CA-40GW) 1. FEATURES : PSR-4000 PF9L / CA-40 PF9 is a liquid photo imageable hole plugging ink ( alkaline development type ), used for screen printing. Which has the characteristic such as not appear the crack hollow are less fine blistering resistance tack dry window are wider fine solvent resistance 2. SPECIFICATION : Main agent Hardener Color* Mixing ratio Viscosity* Tack free window* Exposure energy* Pot life* Shelf life** * ** PSR-4000 PF9L CA-40 PF9 Green Main agent : 70 / Hardener : 30 150 dPas 80 / 70 min ( By weight ) ) (Cone / Plate Viscometer, 5min-1 / 25 ( Maximum ) ( on the solder mask ) ( stored in dark place at less than 25 ( stored in dark place at less than 25 ) ) 300 ~ 500 mJ/cm2 24 hours 6 months : After mixing : After manufacturing www..com 2/4 DATA SHEET 3. PROCESS CONDITION PROCESS PWB Pre-treatment Printing Hold time FR - 4 , 1.6 mm Acid treatment 100 mesh-count 10 min brushing PSR-4000 PF9L /CA-40 PF9 RANGE 90 ~ 125 mesh 10 ~ 20 min 80 80 80 / 10~20 min / 20~30 min / 20~40 min Tack free Both sides simultaneous exposure 1 st printing : 80 / 15 min 2nd printing : 80 / 25 min ( Hot air convention oven ) Single side exposure 80 / 30 min ( Hot air convection oven ) 400 mJ/cm2 ( on the solder mask ) 10 min Aqueous alkaline solution : 1 wt% Na2CO3 Temperature of developer : 30 Spray pressure : 0.196 MPa Developing time : 60 sec Temperature 25 Spray pressure 0.098 MPa Dwelling time 45sec 80 / 30 min 110 / 30min, 150 ( Hot air convection oven ) Exposure Hold time 300 ~ 500 mJ/cm2 10 ~ 20 min Development 0.196 ~ 2.45 MPa 60 ~ 90 sec 30 or below 0.098~0.147Mpa 45~60 sec Water rinse Post cure 60min 4. ATTENTION ON EACH PROCESS : As to the operation environment. It is desirable to deal with the ink under the yellow lamps in the clean room. Please avoid using it under white fluorescent lamps or sunlight (directly or indirectly). The adequate thickness is 10 ~ 20 um (on the copper after curing). Thin coating possibly reduces its solder heat resistance. On the other hand, thick coating possibly causes the under-cut or low tackiness. Please set the pre-cure conditions and tack free window after the confirmation test because they are influenced according to the type of the drying machine and the quantity of the board to be dried. www..com 3/4 DATA SHEET PSR-4000 PF9L /CA-40 PF9 Please set the exposing energy after the confirmation test of under-cut, surface gloss, back side exposure and so on because it is influenced according to the material of the board, the thickness of ink, etc. Regarding the developing process, please control the developer density, the temperature, the spray pressure and the developer time, etc. The inadequacy of control causes the degradation of the developability and the increase of under-cut. Please set the post cure conditions considering the curing time of the marking ink. Insufficient curing or over curing may cause the degradation of properties. 5. CHARACTERISTIC (1) TACK FREE TOLERANCE WINDOW : Drying time ( 80 / min ) Developability 50 60 70 80 (2) PHOTO SENSITIVITY : Item Thickness Energy 200 mJ/cm2 Sensitivity Kodak No.2 (Step density tablet) 22 2 m 300 mJ/cm2 400 mJ/cm2 200 mJ/cm2 Resolution (Between QFP) 40 2 m 300 mJ/cm2 400 mJ/cm2 The exposure energy is measured on the solder mask by using ORC HMW-680,7Kw,metal halide lamp. 60 sec. 60 sec. Developing time Sensitivity 5 step 6 step 7 step 50 50 50 m m m www..com 4/4 DATA SHEET (3) PROPERTIES : Item Adhesion Pencil hardness Solder heat resistance Solvent resistance Acid resistance Alkaline resistance Test method GIF-007AA Standard Cross-cut tape stripping test GIF-009AA Standard On copper foil, no Cu exposure PSR-4000 PF9L /CA-40 PF9 Test result 100 / 100 6H (min) Passed Passed Passed Passed Initial : 4.2 1013 After : 5.6 1011 Solder float test : Rosin flux, 260 / 30 sec (10sec 3 times) PMA dipping, room temp./ 30 min Scotch tape stripping 10 vol % H2SO4, room temp./ 30 min Scotch tape stripping 10 wt% NaOH, room temp./ 30 min Scotch tape stripping IPC comb type B pattern 25 , 65% RH, 500V / 1 min Moisture conditioned:DC100V 25~65 (cycle), 90% RH, 7 days Insulation resistance Note : The above-mentioned test data is just for reference, not to guarantee the result. 6. Attention A. Operate in area supported by local exhaust or general room ventilation to avoid build-up of high concentration of solvent vapors. B. Use gloves and apron during operation. Wash with soap and water if ink is attached to the skin. C. Wash hands and face with soap and water. Rinse out the mouth before eating or smoking. |
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