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Pb Free Plating Product ISSUED DATE :2005/03/28 REVISED DATE :2006/12/12B GL3055 N-CHANNEL ENHANCEMENT MODE POWER MOSFET BVDSS RDS(ON) ID 30V 26m 4A The GL3055 provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SOT-223 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. *Dynamic dv/dt Rating *Simple Drive Requirement *Repetitive Avalanche Rated *Fast Switching Description Features Package Dimensions SOT-223 REF. A C D E I H Millimeter Min. Max. 6.70 7.30 2.90 3.10 0.02 0.10 0 10 0.60 0.80 0.25 0.35 REF. B J 1 2 3 4 5 Millimeter Min. Max. 13 TYP. 2.30 REF. 6.30 6.70 6.30 6.70 3.30 3.70 3.30 3.70 1.40 1.80 Absolute Maximum Ratings Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current , VGS@10V Continuous Drain Current , VGS@10V Pulsed Drain Current 1 Symbol VDS VGS ID @TA=25 : ID @TA=70 : IDM PD @TA=25 : Tj, Tstg Ratings 30 20 4.0 3.2 20 2.7 0.02 -55 ~ +150 Unit V V A A A W W/ : : Total Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range Thermal Data Parameter Thermal Resistance Junction-ambient Max. Symbol Rthj-a Value 45 Unit : /W GL3055 Page: 1/4 ISSUED DATE :2005/03/28 REVISED DATE :2006/12/12B Electrical Characteristics (Tj = 25 : unless otherwise specified) Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Symbol BVDSS BVDSS / Tj Min. 30 1.0 - Typ. 0.037 5.4 1.3 3.6 3.6 19.8 13 3.2 260 144 13 Max. 3.0 100 25 250 26 40 - Unit V V/ : V nA uA uA m Test Conditions VGS=0, ID=250Ua Reference to 25 : , ID=1mA VDS=VGS, ID=250uA VGS= 20V VDS=30V, VGS=0 VDS=24V, VGS=0 VGS=10V, ID=4A VGS=4.5V, ID=3A ID=4A VDS=24V VGS=5V VDS=15V ID=1A VGS=10V RG=3.3 RD=1.9 VGS=0V VDS=25V f=1.0MHz Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current(Tj=25 : ) Drain-Source Leakage Current(Tj=70 : ) VGS(th) IGSS IDSS Static Drain-Source On-Resistance Total Gate Charge2 Gate-Source Charge Gate-Drain ("Miller") Change Turn-on Delay Time2 Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance RDS(ON) Qg Qgs Qgd Td(on) Tr Td(off) Tf Ciss Coss Crss nC ns pF Source-Drain Diode Parameter Forward On Voltage2 Continuous Source Current(Body Diode) Pulsed Source Current(Body Diode) 1 Symbol VSD IS ISM Min. - Typ. - Max. 1.3 4 20 Unit V A A Test Conditions IS=2A, VGS=0V, Tj=25 : VD= VG=0V, VS=1.3V Notes: 1. Pulse width limited by safe operating area. 2. Pulse width 300us, duty cycle 2%. GL3055 Page: 2/4 ISSUED DATE :2005/03/28 REVISED DATE :2006/12/12B Characteristics Curve Fig 1. Typical Output Characteristics 45 Fig 2. Typical Output Characteristics 4A 40 A 35 30 25 20 Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristics of Reverse Diode GL3055 Fig 6. Gate Threshold Voltage v.s. Junction Temperature Page: 3/4 ISSUED DATE :2005/03/28 REVISED DATE :2006/12/12B 4A Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Switching Time Circuit Fig 12. Gate Charge Waveform Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C. TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165 GL3055 Page: 4/4 |
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