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GS72108ATP/J
SOJ, TSOP Commercial Temp Industrial Temp Features
* Fast access time: 7, 8, 10, 12 ns * CMOS low power operation: 135/115/95/80 mA at minimum cycle time * Single 3.3 V power supply * All inputs and outputs are TTL-compatible * Fully static operation * Industrial Temperature Option: -40 to 85C * Package line up J: 400 mil, 36-pin SOJ package TP: 400 mil, 44-pin TSOP Type II package GP:Pb-free 400 mil, 44-pin TSOP Type II package * Pb-Free TSOP-II package available
A4 A3 A2 A1 A0 CE DQ1 DQ2 VDD VSS DQ3 DQ4 WE A17 A16 A15 A14 A13
256K x 8 2Mb Asynchronous SRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
7, 8, 10, 12 ns 3.3 V VDD Center VDD and VSS
SOJ 256K x 8-Pin Configuration
36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 NC A5 A6 A7 A8 OE DQ8 DQ7 VSS VDD DQ6 DQ5 A9 A10 A11 A12 NC NC
36-pin 400 mil SOJ
Description
The GS72108A is a high speed CMOS Static RAM organized as 262,144 words by 8 bits. Static design eliminates the need for external clocks or timing strobes. The GS operates on a single 3.3 V power supply and all inputs and outputs are TTLcompatible. The GS72108A is available in 400 mil SOJ and 400 mil TSOP Type-II packages.
Package J
Pin Descriptions Symbol
A0-A17 DQ1-DQ8 CE WE OE VDD VSS NC
Description
Address input Data input/output Chip enable input Write enable input Output enable input +3.3 V power supply Ground No connect
Rev: 1.05 10/2004
1/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
TSOP-II 256K x 8-Pin Configuration
NC NC A4 A3 A2 A1 A0 CE DQ1 DQ2 VDD VSS DQ3 DQ4 WE A17 A16 A15 A14 A13 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 NC NC NC A5 A6 A7 A8 OE DQ8 DQ7 VSS VDD DQ6 DQ5 A9 A10 A11 A12 NC NC NC NC
44-pin 400 mil TSOP II
Package TP
Block Diagram
A0 Address Input Buffer
Row Decoder
Memory Array
A17 CE WE OE
Column Decoder
Control
I/O Buffer
DQ1
DQ8
Rev: 1.05 10/2004
2/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
Truth Table CE
H L L L Note: X: "H" or "L"
OE
X L X H
WE
X H L H
DQ1 to DQ8
Not Selected Read Write High Z
VDD Current
ISB1, ISB2
IDD
Absolute Maximum Ratings Parameter
Supply Voltage Input Voltage Output Voltage Allowable power dissipation Storage temperature
Symbol
VDD VIN VOUT PD TSTG
Rating
-0.5 to +4.6 -0.5 to VDD +0.5 ( 4.6 V max.) -0.5 to VDD +0.5 ( 4.6 V max.) 0.7 -55 to 150
Unit
V V V W
o
C
Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Rev: 1.05 10/2004
3/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
Recommended Operating Conditions Parameter
Supply Voltage for -7/-8/-10/-12 Input High Voltage Input Low Voltage Ambient Temperature, Commercial Range Ambient Temperature, Industrial Range
Symbol
VDD VIH VIL TAc TAI
Min
3.0 2.0 -0.3 0 -40
Typ
3.3 -- -- -- --
Max
3.6 VDD +0.3 0.8 70 85
Unit
V V V
oC o
C
Notes: 1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns. 2. Input undershoot voltage should be greater than -2 V and not exceed 20 ns.
Capacitance Parameter
Input Capacitance Output Capacitance
Symbol
CIN COUT
Test Condition
VIN = 0 V VOUT = 0 V
Max
5 7
Unit
pF pF
Notes: 1. Tested at TA = 25C, f = 1 MHz 2. These parameters are sampled and are not 100% tested.
DC I/O Pin Characteristics Parameter
Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage
Symbol
IIL ILO VOH VOL
Test Conditions
VIN = 0 to VDD Output High Z VOUT = 0 to VDD IOH = -4mA ILO = +4mA
Min
- 1 uA -1 uA 2.4 --
Max
1 uA 1 uA -- 0.4 V
Rev: 1.05 10/2004
4/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
Power Supply Currents Parameter Symbol Test Conditions
CE VIL All other inputs VIH or VIL Min. cycle time IOUT = 0 mA CE VIH All other inputs VIH or VIL Min. cycle time CE VDD - 0.2 V All other inputs VDD - 0.2 V or 0.2 V
0 to 70C 7 ns 8 ns 10 ns 12 ns 7 ns
-40 to 85C 8 ns 10 ns 12 ns
Operating Supply Current
IDD (max)
135 mA
115 mA
95 mA
80 mA
140 mA
120 mA
100 mA
85 mA
Standby Current
ISB1 (max)
25 mA
20 mA
20 mA
15 mA
30 mA
25 mA
25 mA
20 mA
Standby Current
ISB2 (max)
5 mA
10 mA
AC Test Conditions Parameter
Input high level Input low level Input rise time Input fall time Input reference level Output reference level Output load
Conditions
VIH = 2.4 V VIL = 0.4 V tr = 1 V/ns tf = 1 V/ns 1.4 V 1.4 V Fig. 1& 2
Output Load 1
DQ 50 VT = 1.4 V 30pF1
Output Load 2
3.3 V DQ 5pF1 589 434
Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ
Rev: 1.05 10/2004
5/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
AC Characteristics Read Cycle
Parameter Read cycle time Address access time Chip enable access time (CE) Byte enable access time (UB, LB) Output enable to output valid (OE) Output hold from address change Chip enable to output in low Z (CE) Output enable to output in low Z (OE) Byte enable to output in low Z (UB, LB) Chip disable to output in High Z (CE) Output disable to output in High Z (OE) Symbol tRC tAA tAC tAB tOE tOH tLZ* tOLZ* tBLZ* tHZ* tOHZ* -7 Min 7 -- -- -- -- 3 3 0 0 -- -- Max -- 7 7 3 3 -- -- -- -- 3.5 3 Min 8 -- -- -- -- 3 3 0 0 -- -- -8 Max -- 8 8 3.5 3.5 -- -- -- -- 4 3.5 Min 10 -- -- -- -- 3 3 0 0 -- -- -10 Max -- 10 10 4 4 -- -- -- -- 5 4 Min 12 -- -- -- -- 3 3 0 0 -- -- -12 Max -- 12 12 5 5 -- -- -- -- 6 5 Unit ns ns ns ns ns ns ns ns ns ns ns
* These parameters are sampled and are not 100% tested.
Read Cycle 1: CE = OE = VIL, WE = VIH
tRC Address tAA tOH Data Out Previous Data Data valid
Rev: 1.05 10/2004
6/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
Read Cycle 2: WE = VIH
tRC Address tAA CE tAC tLZ OE tOE Data Out tOLZ High impedance
DATA VALID
tHZ
tOHZ
Write Cycle
Parameter Write cycle time Address valid to end of write Chip enable to end of write Data set up time Data hold time Write pulse width Address set up time Write recovery time (WE) Write recovery time (CE) Output Low Z from end of write Write to output in High Z Symbol tWC tAW tCW tDW tDH tWP tAS tWR tWR1 tWLZ* tWHZ* -7 Min 7 5 5 3.5 0 5 0 0 0 3 -- Max -- -- -- -- -- -- -- -- -- -- 3 Min 8 5.5 5.5 4 0 5.5 0 0 0 3 -- -8 Max -- -- -- -- -- -- -- -- -- -- 3.5 Min 10 7 7 5 0 7 0 0 0 3 -- -10 Max -- -- -- -- -- -- -- -- -- -- 4 Min 12 8 8 6 0 8 0 0 0 3 -- -12 Max -- -- -- -- -- -- -- -- -- -- 5 Unit ns ns ns ns ns ns ns ns ns ns ns
* These parameters are sampled and are not 100% tested.
Rev: 1.05 10/2004
7/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
Write Cycle 1: WE control
tWC Address tAW OE tCW CE tAS WE tDW Data In tWHZ Data Out
HIGH IMPEDANCE DATA VALID
tWR
tWP tDH
tWLZ
Write Cycle 2: CE control
tWC Address tAW OE tAS CE tWP WE tDW Data In Data Out
DATA VALID
tWR1
tCW
tDH
HIGH IMPEDANCE
Rev: 1.05 10/2004
8/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
36-Pin SOJ, 400 mil
Dimension in inch D L c E HE GE Symbol A A1 A2 B B1
A
Dimension in mm min -- 0.66 2.67 0.33 0.61 0.15 23.37 10.04 -- 10.93 9.00 2.08 -- 0o nom -- -- 2.80 0.43 0.71 0.20 23.47 10.16 1.27 11.05 9.30 -- -- -- max 3.70 -- 2.92 0.53 0.81 0.30 23.60 10.28 -- 11.17 9.60 -- 0.10 10o
min -- 0.026 0.105 0.013 0.024 0.006 0.920 0.395 -- 0.430 0.354 0.082 -- 0o
nom -- -- 0.110 0.017 0.028 0.008 0.924 0.400 0.05 0.435 0.366 -- -- --
max 0.146 -- 0.115 0.021 0.032 0.012 0.929 0.405 -- 0.440 0.378 -- 0.004 10o
1
e
c D E
A
A2
A1
y
B B1
e Detail A Q HE GE L y Q
Notes: 1. Dimension D& E do not include interlead flash. 2. Dimension B1 does not include dambar protrusion/intrusion. 3. Controlling dimension: inches
Rev: 1.05 10/2004
9/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
44-Pin, 400 mil TSOP-II
44
D
23
c
Dimension in inch Symbol A A1 A2 B c D E e min -- 0.002 0.037 0.01 -- 0.721 0.396 -- 0.455 0.016 -- -- 0o nom -- -- 0.039 0.014 0.006 0.725 0.400 0.031 0.463 0.020 0.031 -- -- max 0.047 -- 0.041 0.018 -- 0.729 0.404 -- 0.471 0.024 -- 0.004 5o
Dimension in mm min -- 0.05 0.95 0.25 -- 18.31 10.06 -- 11.56 0.40 -- -- 0o nom -- -- 1.00 0.35 0.15 18.41 10.16 0.80 11.76 0.50 0.80 -- -- max 1.20 -- 1.05 0.45 -- 18.51 10.26 -- 11.96 0.60 -- 0.10 5o
1 A2
e
22 B
A
HE
A
E
A1
y L1 L
HE L L1 y Q Q
Detail A
Notes: 1. Dimension D& E do not include interlead flash. 2. Dimension B does not include dambar protrusion/intrusion. 3. Controlling dimension: mm
Rev: 1.05 10/2004
10/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
Ordering Information Part Number*
GS72108ATP-7 GS72108ATP-8 GS72108ATP-10 GS72108ATP-12 GS72108ATP78I GS72108ATP-8I GS72108ATP-10I GS72108ATP-12I GS72108AGP-7 GS72108AGP-8 GS72108AGP-10 GS72108AGP-12 GS72108AGP78I GS72108AGTP-8I GS72108AGP-10I GS72108AGP-12I GS72108AJ-7 GS72108AJ-8 GS72108AJ-10 GS72108AJ-12 GS72108AJ-7I GS72108AJ-8I GS72108AJ-10I GS72108AJ-12I
*
Package
400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II Pb-free 400 mil TSOP-II Pb-free 400 mil TSOP-II Pb-free 400 mil TSOP-II Pb-free 400 mil TSOP-II Pb-free 400 mil TSOP-II Pb-free 400 mil TSOP-II Pb-free 400 mil TSOP-II Pb-free 400 mil TSOP-II 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ
Access Time
7 ns 8 ns 10 ns 12 ns 7 ns 8 ns 10 ns 12 ns 7 ns 8 ns 10 ns 12 ns 7 ns 8 ns 10 ns 12 ns 7 ns 8 ns 10 ns 12 ns 7 ns 8 ns 10 ns 12 ns
Temp. Range
Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial
Status
Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. For example: GS72108ATP-8T
Rev: 1.05 10/2004
11/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS72108ATP/J
2Mb Asynchronous Datasheet Revision History Rev. Code: Old; New
72108A_r1 72108A_r1; 72108A_r1_01 72108A_r1_01; 72108A_r1_02 72108A_r1_02; 72108A_r1_03 72108A_r1_03; 72108A_r1_04 72108A_r1_04; 72108A_r1_05 Content Content Content Content Content
Types of Changes Format or Content
Page #/Revisions/Reason
* Creation of new datasheet * Added 6 ns speed bin * Updated all power numbers * Updated Recommended Operating Conditions table on page 4 * Changed FPBGA package from 6 x 10 to 6 x 8 (package U) * Removed all references to "U" package * Removed 6 ns speed bin from entire document * Added 7 ns speed bin to entire document * Updated format * Added Pb-free information for TSOP-II package
Rev: 1.05 10/2004
12/12
(c) 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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