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INTEGRATED CIRCUITS
DATA SHEET
TDF8704 8-bit high-speed analog-to-digital converter
Product specification Supersedes data of April 1993 File under Integrated Circuits, IC02 June 1994
Philips Semiconductors
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
FEATURES * 8-bit resolution * Sampling rate up to 50 MHz * Extended temperature range (-40 to +85 C) * High signal-to-noise ratio over a large analog input frequency range (7.4 effective bits at 4.43 MHz full-scale input and at fclk = 50 MHz) * Binary 3-state TTL outputs * Overflow/underflow 3-state TTL output * TTL compatible digital inputs * Low-level AC clock input signal allowed * Stable internal reference voltage regulator included * Power dissipation only 380 mW (typical) * Low analog input capacitance, no buffer amplifier required * No sample-and-hold circuit required. QUICK REFERENCE DATA SYMBOL VCCA VCCD VCCO ICCA ICCD ICCO ILE DLE AILE fclk(max) Ptot Note 1. Full-scale sine wave (fi = 4.43 MHz; fclk = 50 MHz). ORDERING INFORMATION PACKAGE TYPE NUMBER PINS TDF8704T/2 TDF8704T/4 TDF8704T/5 June 1994 24 24 24 PIN POSITION SO24L SO24L SO24L 2 MATERIAL plastic plastic plastic CODE SOT137-1 SOT137-1 SOT137-1 PARAMETER analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current DC integral linear error DC differential linearity error AC integral linearity error maximum clock frequency total power dissipation note 1 CONDITIONS MIN. 4.75 4.75 4.75 - - - - - - 50 - TYP. 5.0 5.0 5.0 37 23 16 0.4 0.2 - - 380 APPLICATIONS
TDF8704
* General purpose high-speed analog-to-digital conversion for extended temperature applications * Automotive * RF, satellite and GPS (Global Positioning System) * Medical * General industrial * Digital video (VCR, TV and satellite). GENERAL DESCRIPTION The TDF8704T is an 8-bit high-speed analog-to-digital converter (ADC) for general industrial applications. It converts the analog input signal into 8-bit binary-coded digital words at a maximum sampling rate of 50 MHz. All digital inputs and outputs are TTL compatible, although a low-level AC clock input signal is allowed.
MAX. 5.25 5.25 5.25 46 35 21 1 0.5 2 - 535 V V V
UNIT
mA mA mA LSB LSB LSB MHz mW
SAMPLING FREQUENCY 20 MHz 40 MHz 50 MHz
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
BLOCK DIAGRAM
TDF8704
handbook, full pagewidth
V CCA 7
CLK 16
VCCD 18
CE 22
STABILIZER
CLOCK DRIVER
DEC 5
VRT 9
TDF8704
12 D7 13 D6 14 D5 MSB
analog voltage input
VI 8
15 D4 ANALOG - TO - DIGITAL CONVERTER LATCHES TTL OUTPUTS 23 D3 24 D2 1 D1 2 D0 LSB VCCO1 VCCO2 overflow / underflow output data outputs
VRB 4
19 21
OGND 20 output ground 6 AGND analog ground 17 DGND
OVERFLOW / UNDERFLOW LATCH
TTL OUTPUT
11
MSA685
digital ground
Fig.1 Block diagram.
June 1994
3
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
PINNING SYMBOL D1 D0 n.c. VRB DEC AGND VCCA VI VRT n.c. O/UF D7 D6 D5 D4 CLK DGND VCCD VCCO1 OGND VCCO2 CE D3 D2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION data output; bit 1 data output; bit 0 (LSB) not connected reference voltage BOTTOM (decoupling) decoupling input (internal stabilization loop decoupling) analog ground analog supply voltage (+5 V) analog input voltage reference voltage TOP (decoupling) not connected overflow/underflow data output data output; bit 7 (MSB) data output; bit 6 data output; bit 5 data output; bit 4 clock input digital ground digital supply voltage (+5 V) supply voltage for output stages 1 (+5 V) output ground supply voltage for output stages 2 (+5 V) chip enable input (TTL level input, active LOW) data output; bit 3 data output; bit 2 Fig.2 Pin configuration.
handbook, halfpage
TDF8704
D1 D0 n.c. V RB DEC AGND V CCA VI V RT n.c. O/UF D7
1 2 3 4 5 6
24 23 22 21
D2 D3 CE VCCO2
20 OGND 19 VCCO1 V CCD DGND CLK D4 D5 D6
TDF8704
7 8 9 10 11 12
MSA686
18 17 16 15 14 13
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL VCCA VCCD VCCO VCC VCC VCC VI Vclk(p-p) IO Tstg Tamb Tj HANDLING PARAMETER analog supply voltage digital supply voltage output stages supply voltage supply voltage differences between VCCA and VCCD supply voltage differences between VCCO and VCCD supply voltage differences between VCCA and VCCO input voltage AC input voltage for switching (peak-to-peak value) output current storage temperature operating ambient temperature junction temperature referenced to AGND referenced to DGND CONDITIONS MIN. -0.3 -0.3 -0.3 -1.0 -1.0 -1.0 -0.3 - - -55 -40 -
TDF8704
MAX. +7.0 +7.0 +7.0 +1.0 +1.0 +1.0 +7.0 VCCD 10 +150 +85 +150
UNIT V V V V V V V V mA C C C
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 75 UNIT K/W
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDF8704
CHARACTERISTICS (see Tables 1 and 2) VCCA = V7 to V6 = 4.75 to 5.25 V; VCCD = V18 to V17 = 4.75 to 5.25 V; VCCO = V19 and V21 to V20 = 4.75 to 5.25 V; AGND and DGND shorted together; VCCA to VCCD = -0.25 to +0.25 V; VCCO to VCCD = -0.25 to +0.25 V; VCCA to VCCD = -0.25 to +0.25 V; Tamb = -40 to +85 C; typical readings taken at VCCA = VCCD = 5 V and Tamb = 25 C; unless otherwise specified. SYMBOL Supply VCCA VCCD VCCO ICCA ICCD ICCO Inputs CLOCK INPUT CLK (REFERENCED TO DGND) VIL VIH IIL IIH ZI CI VI(B) VI(0) Vos(B) VI(T) VI(255) Vos(T) VI(p-p) IL IIL IIH ZI CI LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current input impedance input capacitance Vclk = 0.4 V Vclk = 2.7 V Vclk = VCCD fclk = 50 MHz fclk = 50 MHz 0 2.0 -400 - - - - 1.21 output code = 0 VI(0) to VI(B) output code = 255 VI(T) to VI(255) 1.42 210 3.37 3.14 225 1.69 -300 VI = 1.25 V VI = 3.46 V fi = 4.43 MHz fi = 4.43 MHz - 40 - - - - - - - 2 4.5 0.8 VCCD - 100 300 - - 1.29 1.51 240 3.58 3.30 255 1.79 +300 - 400 - - V V A A A k pF analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current all outputs LOW 4.75 4.75 4.75 - - - 5.0 5.0 5.0 37 23 16 5.25 5.25 5.25 46 35 21 V V V mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VI (ANALOG INPUT VOLTAGE REFERENCED TO AGDN; SEE FIGS 3 AND 4 AND TABLE 1) input voltage (BOTTOM) input voltage offset voltage (BOTTOM) input voltage (TOP) input voltage offset voltage (TOP) input voltage amplitude (peak-to-peak value) load current on VRT and VRB LOW level input current HIGH level input current input impedance input capacitance 1.25 1.48 225 3.46 3.22 240 1.74 - 0 150 10 14 V V V V V V V A A A k pF
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDF8704
SYMBOL
PARAMETER
CONDITIONS
MIN. - - - -
TYP.
MAX.
UNIT
INPUT CE (REFERENCED TO DGND) SEE TABLE 2 VIL VIH IIL IIH Rref Outputs DIGITAL OUTPUTS D7 TO D0 (REFERENCED TO DGND) VOL LOW level output voltage IO = 1 mA; Tamb = 0 to +85 C IO = 1 mA; Tamb = 0 to -40 C VOH IOZ HIGH level output voltage output current in 3-state mode IO = -0.4 mA 0.4 V < VO < VCCD 0 - 2.7 -20 - - - - 0.4 0.6 VCCD +20 V V V A LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current VIL = 0.4 V VIH = 2.7 V VRT to VRB 0 2.0 -400 - - 0.8 VCCD - 20 - V V A A
Reference resistance reference resistance 200
Switching characteristics CLOCK INPUT CLK (NOTE 1; SEE FIG.15) fclk(max) maximum clock frequency TDF8704T/2 TDF8704T/4 TDF8704T/5 tCPH tCPL clock pulse width HIGH clock pulse width LOW 20 40 50 7 7 - - - - - - - - - - MHz MHz MHz ns ns
Analog signal processing LINEARITY ILE DLE AILE DC integral linearity error DC differential linearity error AC integral linearity error -0.5 dB analog bandwidth (note 3) analog input settling time LOW-to-HIGH analog input settling time HIGH-to-LOW note 2 - - - - - - - 0.4 0.2 - 12 16 2.5 3.0 1.0 0.5 2.0 - - 3.5 4.0 LSB LSB LSB
BANDWIDTH (fclk = 40 MHZ) B tSTLH tSTHL full-scale sine wave 75% full-scale sine wave full-scale square wave; Fig.8; note 4 full-scale square wave; Fig.8; note 4 MHz MHz ns ns
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDF8704
SYMBOL
PARAMETER
CONDITIONS -
MIN. -
TYP.
MAX.
UNIT
HARMONICS (fclk = 40 MHZ) h1 hall fundamental harmonics (full scale) harmonics (full scale); all components second harmonics third harmonics THD total harmonic distortion fi = 4.43 MHz without harmonics; fclk = 40 MHz; fi = 4.43 MHz SIGNAL-TO-NOISE RATIO S/N signal-to-noise ratio 46 48 - dB fi = 4.43 MHz fi = 4.43 MHz - - - -64 -58 -56 -60 -55 - dB dB dB 0 dB
EFFECTIVE BITS; NOTE 5; SEE FIGS 9, 10 AND 11 EB effective bits TDF8704T/2 fclk = 20 MHz fi = 1.25 MHz fi = 4.43 MHz effective bits TDF8704T/4 fclk = 40 MHz fi = 4.43 MHz fi = 7.5 MHz fi = 10 MHz effective bits TDF8704T/5 fclk = 50 MHz fi = 4.43 MHz fi = 7.5 MHz fi = 10 MHz TWO-TONE (NOTE 6) TTIR two-tone intermodulation rejection fclk = 40 MHz - -56 - dB - - - 7.4 7.2 6.9 - - - bits bits bits - - - 7.5 7.3 7.0 - - - bits bits bits - - 7.8 7.6 - - bits bits
BIT ERROR RATE BER bit error rate fclk = 40 MHz; - fi = 4.43 MHz; VI = 16 LSB at code 128 fclk = 20 MHz; fi = 4.43 MHz fclk = 40 MHz; fi = 4.43 MHz - 10-11 - times/ samples
DIFFERENTIAL GAIN (NOTE 7) Gdiff differential gain 0.6 - %
DIFFERENTIAL PHASE (NOTE 7) diff differential phase - 0.8 - deg
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDF8704
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Timing (note 8; see Figs 5 and 7; fclk = 50 MHz) tds th td tdZH tdZL tdHZ tdLZ Notes 1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must be less than 1 ns. 2. Full-scale sine wave (fi = 4.43 MHz; fclk = 50 MHz). 3. Determined by beat frequency method on a reconstructed sine wave signal for no missing codes and no glitches. 4. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square-wave signal) in order to sample the signal and obtain correct output data. 5. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 4K acquisition points per period. The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB x 6.02 + 1.76 dB. 6. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter. 7. Measurement taken using video analyser VM700A. 8. Output data acquisition: the output data is available after the maximum delay time of td. sampling delay time output hold time output delay time - 5 - - - - - - - 12 2 - 15 ns ns ns
3-state output delay times (see Figs 6 and 7) enable HIGH enable LOW disable HIGH disable LOW 6 12 50 10 10 16 54 14 ns ns ns ns
handbook, halfpage
3.49
MBD868
1.29 V I (B) (V) 1.27
andbook, halfpage
3.44
MSA689
1.28 V I (B) (V) 1.26
V I (T) (V) 3.47 0.1 mV/K V I (T) 3.45 0.05 mV/K V I (B)
V I (T) (V) 3.42 V I (T) 17 mV/V
1.25
3.40 V I (B) 7 mV/V
1.24
3.43 60 20 20
1.23 60 100 Tamb ( o C)
3.38 4.25
4.75
5.25
1.22 VCC (V) 5.75
Fig.3
Influence of Tamb on VI(T) and VI(B) under 5 V supply.
Fig.4
Influence of supply voltage on VI(T) and VI(B) under Tamb = 25 C.
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
Table 1 Output coding and input voltage (typical values; referenced to AGND). BINARY OUTPUT BITS STEP Underflow 0 1 . . 254 255 Overflow Table 2 Mode selection. CE 1 0 high impedance active; binary D7 TO D0 high impedance active O/UF VI(p-p) <1.48 1.48 - . . . 3.46 >3.46 O/UF D7 1 0 0 . . 0 0 1 1 0 0 . . 1 1 1 . 1 1 1 D6 0 0 0 D5 0 0 0 . . 1 1 1 D4 0 0 0 . . 1 1 1 D3 0 0 0 . . 1 1 1 D2 0 0 0 . . 1 1 1
TDF8704
D1 0 0 0 . . 1 1 1
D0 0 0 1 . . 0 1 1
handbook, full pagewidth
t CPL t CPH CLK 1.4 V
sample N
sample N 1
sample N 2
Vl
N
t ds DATA D0 to D7 DATA N2 DATA N1 td
th 2.4 V DATA N DATA N1
MSA688 - 1
1.4 V 0.4 V
Fig.5 Timing diagram for data output.
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDF8704
handbook, full pagewidth
V CCD CE 50 %
t dHZ HIGH 90 % output data t dLZ HIGH output data LOW 10 % 50 % t dZL LOW
t dZH
50 %
TEST tdLZ
V CCD
S1 VCCD VCCD GND GND
tdZL tdHZ tdZH
MLB880
3.3 k TDF8704 15 pF CE S1
fCE = 100 kHz.
Fig.6 Timing diagram and test conditions of 3-state output delay time.
handbook, halfpage
D0 to D7 15 pF
MBB956 - 1
Fig.7 Load circuit for timing measurement.
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDF8704
handbook, full pagewidth
t STLH code 255 VI code 0 2 ns 50 %
t STHL
50 %
2 ns
CLK
50 %
50 %
MBD869
0.5 ns
0.5 ns
Fig.8 Analog input settling-time diagram.
handbook, full pagewidth
0
MBD870
amplitude (dB) 20
40
60
80
100
120 0 1.25 2.49 3.74 4.98 6.23 7.47 8.72 f (MHz) 9.96
Effective bits: 7.89; THD = -61.05 dB. Harmonic levels (dB): 2nd = -84.07; 3rd = -62.50; 4th = -92.01; 5th = -66.56; 6th = -101.15.
Fig.9 Fast Fourier Transform (fclk = 20 MHz; fi = 1.25 MHz). June 1994 12
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDF8704
handbook, full pagewidth
0
MBD871
amplitude (dB) 20
40
60
80
100
120 0 2.48 4.96 7.44 9.93 12.4 14.9 17.4 f (MHz) 19.9
Effective bits: 7.61; THD = -57.11 dB. Harmonic levels (dB): 2nd = -68.53; 3rd = -58.36; 4th = -74.89; 5th = -65.37; 6th = -76.08.
Fig.10 Fast Fourier Transform (fclk = 40 MHz; fi = 4.43 MHz).
handbook, full pagewidth
0
MBD872
amplitude (dB) 20
40
60
80
100
120 0 3.12 6.24 9.35 12.5 15.6 18.7 21.8 f (MHz) 24.9
Effective bits: 6.91; THD = -46.13 dB. Harmonic levels (dB): 2nd = -59.66; 3rd = -46.67; 4th = -70.80; 5th = -57.96; 6th = -72.16.
Fig.11 Fast Fourier Transform (fclk = 50 MHz; fi = 10 MHz). June 1994 13
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
INTERNAL PIN CONFIGURATIONS
TDF8704
handbook, halfpage
VCCO1
handbook, halfpage
VCCO2
V CCA
D7 to D0 O/UF
(x 90) VI
DGND
MLB036
AGND
MLB037
Fig.12 TTL data and overflow/underflow outputs.
Fig.13 Analog inputs.
book, halfpage
VCCO1
CE
DGND
MLB038
Fig.14 CE (3-state) input.
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDF8704
handbook, full pagewidth
V CCA
VRT
VRB DEC
AGND
MSA687
Fig.15 VRB, VRT and DEC.
handbook, full pagewidth
VCCD
CLK 30 k 30 k
V ref
DGND
MCD189 - 1
Fig.16 CLK input.
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
APPLICATION INFORMATION
TDF8704
handbook, halfpage
D1
1
24
D2
D0
(2)
2
23
D3
n.c. V RB 47 pF DEC AGND 10 nF AGND AGND V CCA VI V RT 100 nF
(1) (1)
3
22
CE VCCO2 OGND VCCO1 VCCD
4
21
5
20
6 TDF8704 7
19
18
8
17
DGND
9
16
CLK
(2)
n.c. AGND O / UF
10
15
D4
11
14
D5
D7
12
13
MSA684
D6
The analog and digital supplies should be separated and decoupled. (1) VRB and VRT are decoupling pins for the internal reference ladder; do not draw current from these pins in order to achieve good linearity. (2) Pins 3 and 10 should be connected to DGND in order to prevent noise influence.
Fig.17 Application diagram.
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
PACKAGE OUTLINE
TDF8704
handbook, full pagewidth
15.6 15.2
7.6 7.4
A
S 0.9 (4x) 0.4
0.1 S
10.65 10.00
24
13 2.45 2.25 1.1 1.0 0.3 0.1 0.32 0.23 2.65 2.35
pin 1 index 1 12 detail A 1.1 0.5 0 to 8o
MBC235 - 1
1.27
0.49 0.36
0.25 M (24x)
Dimensions in mm.
Fig.18 Plastic small outline package; 24 leads; large body; SOT137-1.
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
SOLDERING Plastic small-outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C. A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be
TDF8704
applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
June 1994
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
NOTES
TDF8704
June 1994
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Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2327, Fax. (011)829-1849 Canada: INTEGRATED CIRCUITS: Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 601 Milner Ave, SCARBOROUGH, ONTARIO, M1B 1M8, Tel. (0416)292 5161 ext. 2336, Fax. (0416)292 4477 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: PHILIPS COMPONENTS UB der Philips G.m.b.H., P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: PHILIPS HONG KONG Ltd., Components Div., 6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)428 6729 India: Philips INDIA Ltd, Components Dept, Shivsagar Estate, A Block , Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)640 000, Fax. (01)640 200 Italy: PHILIPS COMPONENTS S.r.l., Viale F. Testi, 327, 20162 MILANO, Tel. (02)6752.3302, Fax. (02)6752 3300. Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5028, Fax. (03)3740 0580 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: Philips Components, 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB Tel. (040)783749, Fax. (040)788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546. Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)14163160/4163333, Fax. (01)14163174/4163366. Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., Components Division, 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382. Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319. Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 2770, Fax. (0212)269 3094 United Kingdom: Philips Semiconductors Limited, P.O. Box 65, Philips House, Torrington Place, LONDON, WC1E 7HD, Tel. (071)436 41 44, Fax. (071)323 03 42 United States: INTEGRATED CIRCUITS: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd., P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404, Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BAF-1, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD31 (c) Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/03/pp20 Document order number: Date of release: June 1994 9397 734 10011
Philips Semiconductors

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