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| www..com EMIF03-SIM04F3 3-line IPADTM, EMI filter including ESD protection Features EMI symmetrical (I/O) low-pass filter High efficiency in EMI/ESD protection Lead-free package Very thin package High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Lead-free Flip-Chip package (11 bumps) Complies with the following standards Pin configuration (bump side) 1 2 3 A B C D IEC 61000-4-2 level 4 - 15 kV (air discharge) - 8 kV (contact discharge) IEC 61000-4-2 level 1 - 2 kV (air discharge) - 2 kV (contact discharge) Applications Where EMI filtering in ESD sensitive equipment is required: Figure 2. Configuration D1 D2 D3 A3 B3 C3 100 R1 47 R2 100 R3 Mobile phones and communication systems Computers, printers and MCU Boards A1 B1 Description The EMIF03-SIM04F3 Flip Chip is a low capacitance EMI filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. C1 A2 GND C2 GND A2 and C2 bumps must be connected together on the PCB TM: IPAD is a trademark of STMicroelectronics. May 2010 Doc ID 17053 Rev 1 1/7 www.st.com 7 www..com Electrical characteristics EMIF03-SIM04F3 1 Electrical characteristics Table 1. Symbol Absolute maximum ratings (Tamb = 25 C) Parameter Internal pins (A1, B1, C1): ESD discharge IEC 61000-4-2, level 1, air discharge ESD discharge IEC 61000-4-2, level 1, contact discharge External pins (A3, B3, C3, D1, D2 and D3): ESD discharge IEC 61000-4-2, level 4, air discharge ESD discharge IEC 61000-4-2, level 4, contact discharge Line resistance power dissipation at 70 C Operating temperature range Storage temperature range Value Unit VPP 2 2 15 15 60 - 40 to + 85 - 55 to 150 kV Pd Top Tstg mW C C Figure 3. Electrical characteristics (definitions) I Symbol VBR = IRM = Parameter Breakdown voltage Leakage current @ VRM RI/O = Cline = Series resistance between input and output Line capacitance VBR VRM IR IRM IRM IR VRM VBR V Table 2. Symbol VBR IRM R1, R3 R2 Cline Electrical characteristics (Tamb = 25 C) Test conditions IR = 1 mA VRM = 3 V per line Tolerance 20% Tolerance 20% Vline = 0 V, Vosc = 30 mV, F = 1 MHz (measured under zero light conditions)(1) 80 37.6 8 Min. 6 50 100 47 10 100 120 56.4 12 Typ. Max. Unit V nA pF 1. A2 and C2 bumps must be conncted together on the printed circuit board 2/7 Doc ID 17053 Rev 1 www..com EMIF03-SIM04F3 Electrical characteristics Figure 4. S21 (dB) attenuation measurement Figure 5. B3 - B1 S21 (dB) analog crosstalk measurements C3 - A1 0.00 S21 (dB) 0.00 S21 (dB) -10.00 -20.00 - -20.00 -40.00 - -30.00 -60.00 - -40.00 -80.00 - -50.00 100.0k 1.0M 10.0M 100.0M 1.0G f/Hz -100.00 100.0k 1.0M 10.0M 100.0M f/Hz 1.0G Figure 6. 20 V/Div ESD response to IEC 61000-4-2 (+15 kV air discharge) on one line 100 ns/dIV IN Figure 7. C2 ESD response to IEC 61000-4-2 (-15 kV air discharge) on one line IN 10 V/Div C2 100 ns/Div 10 V/Div OUT C3 OUT C3 100 ns/dIV 10 V/Div 100 ns/Div Figure 8. Digital crosstalk measurement 1 V/Div IN C2 20 ns/Div 500 mV/Div OUT C3 20 ns/Div Doc ID 17053 Rev 1 3/7 www..com Ordering information scheme EMIF03-SIM04F3 2 Ordering information scheme Figure 9. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (ohm) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 3: lead-free, pitch = 400 m, bump = 255 m yy - xxx zz Fx 4/7 Doc ID 17053 Rev 1 www..com EMIF03-SIM04F3 Package information 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 10. Package dimensions 255 m 40 400 m 30 400 m 30 605 m 55 1.54 mm 30 m 170 m Figure 11. Footprint Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum Figure 12. Marking Dot, ST logo ECOPACK(R) Grade Solder stencil opening: 220 m recommended xx = marking z = manufacturing location yww = datecode (y = year ww = week) 1.14 mm 30 m 170 m xxz y ww Figure 13. Flip-Chip tape and reel specification 1.75 0.1 4.0 0.1 0.69 0.05 Dot identifying pin A1 location 2.0 0.05 4.0 0.1 O 1.5 0.1 8.0 0.3 1.68 1.31 All dimensions in mm User direction of unreeling Doc ID 17053 Rev 1 3.5 - 0.1 STE STE STE xxz yww xxz yww xxz yww 5/7 www..com Ordering information EMIF03-SIM04F3 4 Ordering information Table 3. Ordering information Marking JI Package Flip Chip Weight 1.74 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF03-SIM04F3 Note: More information is available in the application notes: AN2348: "STMicroelectronics 400 micro-metre Flip Chip: package description and recommendation for use" AN1751: "EMI filters: recommendations and measurements" 5 Revision history Table 4. Date 03-May-2010 Document revision history Revision 1 Initial release. Changes 6/7 Doc ID 17053 Rev 1 www..com EMIF03-SIM04F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 17053 Rev 1 7/7 |
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