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| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC2710T 5 V, MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER DESCRIPTION The PC2710T is a silicon monolithic integrated circuits designed as PA driver for 900 MHz band cellular telephone tuners. This IC is packaged in minimold package. This IC is manufactured using NEC's 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES * * * * * Supply voltage Wideband response Medium output power Power gain Port impedance : VCC = 4.5 to 5.5 V : fu = 1.0 GHz TYP. @ 3 dB bandwidth : PO(sat) = +13.5 dBm TYP. @ f = 500 MHz with external inductor : GP = 33 dB TYP. @ f = 500 MHz : input/output 50 APPLICATION * PA driver for PDC900M ORDERING INFORMATION Part Number Package 6-pin minimold Marking C1F Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel PC2710T-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC2710T) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Document No. P12427EJ3V0DS00 (3rd edition) Date Published September 1998 N CP(K) Printed in Japan (c) 1994 PC2710T PIN CONNECTIONS (Top View) 3 (Bottom View) 4 4 3 Pin No. 1 Pin Name INPUT GND GND OUTPUT GND VCC C1F 2 3 4 2 5 5 2 1 6 6 1 5 6 PRODUCT LINE-UP OF PC2710 (TA = +25C, VCC = Vout = 5.0 V, ZL = ZS = 50 ) fu (GHz) 1.0 PO(sat) (dBm) +13.5 GP (dB) 33 NF (dB) 3.5 ICC (mA) 22 6-pin super minimold Part No. Package 6-pin minimold Marking PC2710T PC2710TB C1F Remark Notice Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. The package size distinguishes between minimold and super minimold. SYSTEM APPLICATION EXAMPLE EXAMPLE OF 900 MHz BAND DIGITAL CELLULER TELEPHONE RX DEMO I Q SW PLL PLL 0 Driver TX PA I 90 Q PC2710T/TB 2 PC2710T PIN EXPLANATION Pin No. 1 Applied Voltage V - Pin Voltage V 0.90 Note Pin Name INPUT Function and Applications Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors. IN 1 Internal Equivalent Circuit 4 OUTPUT Voltage as same as VCC through external inductor 4.5 to 5.5 - 6 VCC 4 OUT 6 VCC - Power supply pin, which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 3 GND 25 GND 2 3 5 GND 0 - Note Pin voltage is measured at VCC = 5.0 V 3 PC2710T ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Total Circuit Current Power Dissipation Symbol VCC ICC PD Conditions TA = +25C, Pin 4 and 6 TA = +25C Mounted on double copper clad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85C) Ratings 5.8 60 280 -40 to +85 -55 to +150 TA = +25C +10 Unit V mA mW Operating Ambient Temperature Storage Temperature Input Power TA Tstg Pin C C dBm RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Symbol VCC MIN. 4.5 -40 TYP. 5.0 MAX. 5.5 Unit V Notice The same voltage should be applied to pin 4 and 6. Operating Ambient Temperature TA +25 +85 C ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Circuit Current Power Gain Maximum Output Level Noise Figure Upper Limit Operating Frequency Symbol ICC GP PO(sat) NF fu No Signal f = 500 MHz f = 500 MHz, Pin = -8 dBm f = 500 MHz 3 dB down below flat gain at f = 0.1 GHz f = 500 MHz f = 500 MHz f = 500 MHz f = 0.1 to 0.6 GHz Test Conditions MIN. 16 30 +11 - 0.7 TYP. 22 33 +13.5 3.5 1.0 MAX. 29 36.5 - 5.0 - Unit mA dB dBm dB GHz Isolation Input Return Loss Output Return Loss Gain Flatness ISL RLin RLout GP 34 3 9 - 39 6 12 0.8 - - - - dB dB dB dB 4 PC2710T TEST CIRCUIT VCC 1 000 pF C3 L 6 50 IN 1 000 pF C1 1 4 C2 1 000 pF 50 OUT 2, 3, 5 COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type C3 L C1 to C2 Capacitor Bias Tee Bias Tee Value 1 000 pF 1 000 nH 1 000 pF C1 to C3 L Type Chip Capacitor Chip Inductor Value 1 000 pF 300 nH 100 nH 10 nH Operating Frequency 100 MHz or higher 10 MHz or higher 100 MHz or higher 1.0 GHz or higher EXAMPLE OF ACTURAL APPLICATION COMPONENTS INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 Rfc). 5 PC2710T ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Top View 3 1 2 IN 1F OUT C C L C Mounting Direction VCC C 6 5 4 COMPONENT LIST Value C L 1 000 pF 300 nH Notes 1. 30 x 30 x 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P12152E). 6 PC2710T TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 40 VCC = 5.0 V 35 ICC - Circuit Current - mA CIRCUIT CURRENT vs. SUPPLY VOLTAGE 40 ICC - Circuit Current - mA 35 30 25 20 15 10 5 1 2 3 4 5 6 0 -60 -40 -20 0 +20 +40 +60 +80 +100 30 25 20 15 10 5 0 VCC - Supply Voltage - V NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY 35 GP - Insertion Power Gain - dB GP - Insertion Power Gain - dB TA - Operating Ambient Temperature - C INSERTION POWER GAIN vs. FREQUENCY 35 VCC = 5.0 V VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V GP NF - Noise Figure - dB TA = -40C TA = +25C 30 TA = +85C 30 VCC = 5.5 V 4 3.5 3 25 0.1 NF VCC = 4.5 V 0.3 VCC = 5.0 V 1.0 2.0 25 0.1 0.3 f - Frequency - GHz 1.0 2.0 f - Frequency - GHz ISOLATION vs. FREQUENCY 0 VCC = 5.0 V RLin - Input Return Loss - dB RLout - Output Return Loss - dB INPUT RETURN LOSS, OUTPUT RETURN LOSS vs.FREQUENCY 0 -10 VCC = 5.0 V -10 ISL - Isolation - dB -20 -20 RLin RLout -30 -30 -40 -50 0.1 -40 -50 0.1 0.3 f - Frequency - GHz 1.0 2.0 0.3 f - Frequency - GHz 1.0 2.0 7 PC2710T OUTPUT POWER vs. INPUT POWER +20 f = 0.5 GHz PO - Output Power - dBm PO - Output Power - dBm OUTPUT POWER vs. INPUT POWER +20 +15 +10 TA = +25C +5 0 -5 -10 TA = -40C VCC = 5.0 V f = 0.5 GHz TA = +85C +15 +10 +5 0 -5 -10 -15 -40 -35 -30 -25 -20 -15 -10 -5 Pin - Input Power - dBm 0 +5 +10 VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V -15 -40 -35 -30 -25 -20 -15 -10 -5 Pin - Input Power - dBm 0 +5 +10 OUTPUT POWER vs. INPUT POWER +20 f = 1.0 GHz PO - Output Power - dBm PO - Output Power - dBm OUTPUT POWER vs. INPUT POWER +20 VCC = 5.0 V +15 f = 0.5 GHz +10 f = 1.0 GHz +5 0 -5 -10 +15 +10 +5 0 -5 -10 VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V -15 -40 -35 -30 -25 -20 -15 -10 -5 Pin - Input Power - dBm 0 +5 +10 -15 -40 -35 -30 -25 -20 -15 -10 -5 Pin - Input Power - dBm 0 +5 +10 PO(sat) - Saturated Output Power - dBm +20 Pin = -8 dBm +18 +16 +14 +12 +10 +8 +6 0.1 0.2 0.5 f - Frequency - GHz 1 2 VCC = 4.5 V VCC = 5.5 V VCC = 5.0 V IM3 - 3rd Order Intermodulation Distortion - dBc SATURATED OUTPUT POWER vs. FREQUENCY THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE -60 f1 = 0.500 GHz f2 = 0.502 GHz -50 VCC = 5.0 V VCC = 5.5 V -30 -40 -20 VCC = 4.5 V -10 -10 -8 -6 -4 -2 0 +2 +4 +6 +8 +10 PO(each) - Output Power of Each Tone - dBm 8 S11-FREQUENCY S22-FREQUENCY WAVELE WAVELE 0.1 0.2 0.1 0.1 0.1 0.3 0.2 0.2 0.2 NGTH 0 S 0.01 0.49 0.02 TOWARD 0.48 0 0.49 0.01 0.0 GENE 7 0.48 3 RA 0.4 0.02 CTION COEFFCIENT 0.4 0.0TOR 3 OF REFLE 6 IN DE 7 0.0 GLE 4 GRE 0.4 0 AN 0.4 ES 0 -16 .04 6 0.0 0 5 15 0.4 5 0 0.4 5 0 15 0 - 5 0. 0. 4 0 4 POS 0.1 14 0.4 6 0. 06 40 ENT ITIV ON 0 ER 4 MP 0. -1 EA CO C 0.3 0.3 NGTH 0 S 0.01 0.49 0.02 TOWARD 0.48 0 0.49 0.01 0.0 GENE 7 0.48 3 RA 0.4 0.02 CTION COEFFCIENT 0.4 0.0TOR 3 OF REFLE 6 IN DE 7 0.0 GLE 4 GRE 0.4 0 AN 0.4 ES 0 -16 .04 6 0.0 0 5 15 0.4 5 0 0 .4 5 0 15 0 - 5 0. 0. 4 0 4 POS 0.1 14 0.4 6 0. 06 40 ENT ITIV ON 0 ER 4 MP 0. -1 EA CO C 0.3 0. 0. 4 0. 07 43 0. 0 13 -1 S-PARAMETER (VCC = Vout = 5.0 V) NE G 20 0.3 0.4 02 .08 0 00 .43 0. 07 30 NE G 0. .08 5 E IV AT ( -1 0 N 0. 5 5 0. E NC TA AC - JX- - RE --ZO 4 ) 0.2 O ( -Z-+-J-XTANCE CO ) MPO E IV AT 0.3 E NC TA AC - JX- - RE --ZO ( 0.4 ) 0.2 ( -Z-+-J-XTANCE CO ) MPO O 0. 4 0.6 - 2 0.4 20 1 07 0. 3 4 0. 0 13 12 0 0. 4 N 5 0. 8 0.0 2 0.4 20 1 T EN T EN 0 0.6 .09 0.4 1 0.0 0.4 9 02 -1 .08 0 00 .43 0. 07 30 0.4 1 0.0 9 9 0.0 1 0.4 1 0.4 0.4 0.7 0.7 0.6 0.6 0 0.40 0.10 -11 0.40 0.10 -11 0 0.10 0.40 110 0.10 0.40 110 0.7 0.5 0.6 0.8 0.8 0.5 0.6 0.7 0.8 0.8 () 0.11 0.39 100 0.11 0.39 100 () 0.7 0.8 0.9 0.7 0.8 0.9 0.9 0.9 0.9 0.12 0.38 0.12 0.38 0.38 0.39 0.12 0.11 -100 -90 0.2 0.2 REACTANCE COMPONENT R --- 0.2 ZO -90 REACTANCE COMPONENT R ---- 0.2 ZO 1.0 90 90 1.0 0.2 1.0 1.0 0.38 0.39 0.12 0.11 -100 0.9 1.0 0.2 0.4 1.0 0.2 0.4 0.2 0.4 0.13 0.37 0.4 0.13 0.37 0.37 0.13 0.37 0.13 0.6 0.6 1.2 0.4 0.6 1.2 0.6 0.4 0.4 0.4 0.6 0.6 0.6 8 0.6 0. 0.8 0 1. 1. 0 1. 0.14 0.36 80 0.14 0.36 80 0.36 0.04 -80 1.4 1.8 2.0 1.4 1.4 0.36 0.04 -80 1.6 0 1. 0 0 1. 0.8 1.2 1.2 0. 0.15 0.35 -70 0. 0.2 0.8 0. 1.4 1.4 8 0.2 0.8 8 8 1. 0 1.6 1. 0 1. 0 1.4 0.15 0.35 70 70 0.35 0.15 -70 0.1 G 0.1 G 1.6 0.35 0.15 1.6 1.6 1.8 1.6 0.5 G 0.1 6 0.3 4 0.1 6 0.3 4 0.5 G 3.0 1.8 1.8 3.0 2.0 1.8 6 00 6 00 0.1 0.3 7 3 0.1 0.3 7 3 2.0 4.0 5.0 2.0 4.0 5.0 2.0 50 0. 0. 18 32 50 0. 0. 18 32 4 0.3 6 3 0.1 0.3 7 0.1 60 2 32 - 0. 8 0 1 0. 0 5 -5 0 4 0.3 6 3 0.1 0.3 7 0.1 60 2 - .3 0. 8 1 1 0. 0 -5 - 3. 0 3. 0 3. 4.0 4.0 6.0 6.0 10 10 20 20 50 50 0 0 .2 0 1 0 .2 9 0.2 0.24 0.23 0.26 2 0.2 0.27 8 10 0.2 20 0.25 0.25 0 0.26 0.24 -10 0.27 0.23 0.2 8 0.2 2 -20 0 .2 00 9 0.2 0.3 1 0 -3 0 0 0 0.2 0 0.3 50 50 20 0 .3 30 10 50 .20 20 6.0 20 19 0. 31 0. 40 10 -4 0 0. 0. 31 19 19 0. 31 0. 40 10 4.0 3. 0 1 0.2 9 0.2 30 0.24 0.23 0.26 2 0.2 0.27 8 10 0.2 20 0.25 0.25 0 0.26 0.24 -10 0.27 0.23 0.2 8 0.2 2 -20 0.2 9 0 00 .21 0.3 -3 0.2 0 0 0 10 20 -4 50 0 4.0 0. 0. 31 19 6.0 PC2710T 9 PC2710T TYPICAL S-PARAMETER VALUES (TA = +25C) PC2710T VCC = Vout = 5.0 V, ICC = 21 mA FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 S11 MAG .322 .346 .383 .429 .465 .486 .487 .468 .423 .392 .349 .301 .257 .217 .184 ANG -0.3 3.3 2.1 -1.7 -9.4 -17.8 -27.2 -36.5 -44.5 -50.3 -56.6 -61.0 -63.2 -63.5 -59.9 MAG 37.668 38.808 40.192 41.567 42.130 42.282 41.075 39.129 35.399 32.933 30.025 26.823 23.836 21.128 18.841 S21 ANG -5.9 -17.0 -28.0 -40.4 -54.1 -68.3 -83.2 -97.9 -111.7 -123.4 -135.5 -146.8 -156.8 -165.9 -174.2 MAG .013 .012 .009 .009 .012 .013 .013 .013 .013 .014 .014 .015 .016 .016 .017 S12 ANG 17.1 19.8 22.5 25.1 27.8 30.5 33.1 35.8 38.5 41.2 43.9 46.6 49.2 51.6 54.5 MAG .200 .208 .231 .258 .273 .305 .319 .320 .297 .260 .240 .216 .192 .173 .155 S22 ANG -11.7 -15.4 -23.5 -34.2 -47.2 -60.9 -77.8 -96.2 -115.4 -128.2 -142.2 -156.3 -169.7 176.0 162.3 1.06 1.07 1.21 1.10 0.86 0.79 0.82 0.89 1.04 1.10 1.22 1.31 1.40 1.56 1.65 K 10 PC2710T PACAGE DIMENSIONS 6 pin minimold (Unit: mm) 0.3 -0.05 +0.1 0.130.1 1 2.8 -0.3 1.5 -0.1 +0.2 +0.2 2 3 0 to 0.1 6 5 0.95 4 0.95 0.8 1.1 -0.1 +0.2 1.9 2.90.2 11 PC2710T NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be attached to input pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. PC2710T Recommended Condition Symbol IR35-00-3 Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Count: 3, Exposure limitNote: None Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Count: 3, Exposure limitNote: None Soldering bath temperature: 260C or below Time: 10 seconds or less Count: 1, Exposure limitNote: None Pin temperature: 300C Time: 3 seconds or less (per side of device) Exposure limitNote: None VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating - Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 12 PC2710T [MEMO] 13 PC2710T [MEMO] 14 PC2710T [MEMO] 15 PC2710T NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5 |
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