|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
STPS1L60 Power Schottky rectifier Features Negligible switching losses Low forward voltage drop Surface mount miniature packages Avalanche capability specified DO-41 STPS1L60 K A Description Axial and surface mount power Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMA, STmite flat and DO-41, this device is especially intended for use in low voltage, high frequency inverters and small battery chargers. K A A K STmite flat (DO222-AA) STPS1L60MF SMA (JEDEC DO-214AC) STPS1L60A Table 1. Device summary Symbol IF(AV) VRRM Tj (max) VF(max) Value 1A 60 V 150 C 0.56 V October 2009 Doc ID 7504 Rev 8 1/10 www.st.com 10 Characteristics STPS1L60 1 Characteristics Table 2. Symbol VRRM IF(RMS) Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage STmite flat Forward rms current SMA, DO-41 SMA TL = 130 C = 0.5 TL = 120 C = 0.5 TC = 135 C = 0.5 tp =10 ms sinusoidal tp = 1 s Tj = 25 C (1) Value 60 2 10 Unit V A A IF(AV) Average forward current DO-41 STmite flat 1 A IFSM PARM Tstg Tj dV/dt 1. Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage 40 1200 - 65 to + 150 150 10000 A W C C V/s 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Symbol Rth(j-a) Thermal resistance Parameter SMA Junction to ambient Lead length = 10 mm Junction to lead Lead length = 10 mm Junction to case DO-41 STmite flat 45 20 C/W DO-41 SMA 100 30 C/W Value 120 C/W Unit Rth(j-l) Rth(j-c) Table 4. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Tests conditions Tj = 25 C Tj = 100 C Tj = 25 C Tj = 100 C IF = 1 A VR = VRRM Min. Typ. Max. 50 1.5 5 0.57 0.56 0.5 0.54 V 0.75 0.68 0.6 0.66 Unit A mA VF(1) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 100 C IF = 2 A Tj = 125 C 1. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.44 x IF(AV) + 0.12 IF2(RMS) 2/10 Doc ID 7504 Rev 8 STPS1L60 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) Average forward current versus ambient temperature ( = 0.5) (SMA) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 PF(AV)(W) = 0.05 = 0.1 = 0.2 = 0.5 1.2 1.0 Rth(j-a) = Rth(j-l) SMA =1 0.8 0.6 0.4 T Rth(j-a) = 120 C/W T 0.2 IF(AV)(A) 0.2 0.4 0.6 0.8 = tp / T tp 0.0 1.2 0 = tp / T tp 50 0.0 0.0 Tamb(C) 75 100 125 150 1.0 25 Figure 3. Average forward current versus ambient temperature ( = 0.5) (DO-41) DO-41 Figure 4. Average forward current versus ambient temperature ( = 0.5) (STmite flat) STmite flat 1.2 1.0 0.8 0.6 0.4 IF(AV)(A) Rth(j-a) = Rth(j-l) 1.2 1.0 0.8 Rth(j-a) = 100 C/W 0.6 0.4 IF(AV)(A) Rth(j-a) = Rth(j-c) Rth(j-a) = 250 C/W T T 0.2 = tp / T 0.2 tp 50 0.0 0 25 Tamb(C) 75 100 125 150 = tp / T tp 50 75 0.0 0 25 Tamb(C) 100 125 150 Figure 5. Normalized avalanche power derating versus pulse duration Figure 6. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1 s) 1 1.2 1 0.1 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1 PARM(Tj) PARM(25 C) 0.01 tp(s) 10 100 1000 Tj(C) 0 25 50 75 100 125 150 Doc ID 7504 Rev 8 3/10 Characteristics STPS1L60 Figure 7. Non repetitive surge peak forward current versus overload duration (maximum values) (SMA) SMA Figure 8. Non repetitive surge peak forward current versus overload duration (maximum values) (DO-41) DO-41 7 6 5 IM(A) 8 7 6 IM(A) Ta = 25 C 4 3 2 1 IM t = 0.5 1.E-03 Ta = 75 C 5 4 3 Ta = 25 C Ta = 75 C Ta = 125 C 2 IM 1 t = 0.5 1.E-03 Ta = 125 C 0 1.E-04 t(s) 1.E-02 1.E-01 1.E+00 t(s) 1.E-02 1.E-01 1.E+00 0 1.E-04 Figure 9. Non repetitive surge peak forward current versus overload duration (maximum values) (STmite flat) STmite flat Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) 1.0 0.9 0.8 0.7 0.6 18 16 14 12 10 8 6 4 2 IM(A) Zth(j-a)/Rth(j-a) Epoxy printed circuit board, copper thickness = 35 m, recommended pad layout SMA Tc = 25 C Tc = 75 C IM t = 0.5 1.E-03 Tc = 125 C 0.5 0.4 0.3 0.2 0.1 Single pulse t(s) 1.E-02 1.E-01 1.E+00 0 1.E-04 0.0 1.E-02 tp(s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-41) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-02 Single pulse Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (STmite flat) 1.0 0.9 Zth(j-a)/Rth(j-a) Epoxy printed circuit board, copper thickness = 35 m, recommended pad layout Zth(j-a)/Rth(j-a) Epoxy printed circuit board, copper thickness = 35 m, recommended pad layout STmite flat DO-41 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse tp(s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0.1 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 tp(s) 1.E+03 4/10 Doc ID 7504 Rev 8 STPS1L60 Characteristics Figure 13. Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 Figure 14. Junction capacitance versus reverse voltage applied (typical values) 1000 IR(mA) Tj = 150 C C(pF) F = 1 MHz Vosc = 30 mVRMS Tj = 25 C 1.E+01 Tj = 125 C Tj = 100 C Tj = 75 C 100 1.E+00 1.E-01 Tj = 50 C 1.E-02 Tj = 25 C 1.E-03 0 VR(V) 5 10 15 20 25 30 35 40 45 50 55 60 10 1 10 VR(V) 100 Figure 15. Forward voltage drop versus forward current (typical values, high level) 10.00 Figure 16. Forward voltage drop versus forward current (typical values, low level) 3.0 IFM(A) Tj = 125 C IFM(A) Tj = 125 C 2.5 1.00 Tj = 25 C 2.0 Tj = 25 C 1.5 0.10 1.0 0.5 0.01 0.0 VFM(V) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.0 0.0 VFM(V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Doc ID 7504 Rev 8 5/10 Characteristics STPS1L60 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMA) 140 120 100 80 Figure 18. Thermal resistance versus lead length (DO-41) Rth(C/W) DO-41 Rth(j-a) Rth(j-a)(C/W) Epoxy printed circuit board FR4 copper thickness = 35 m SMA 120 100 80 60 Rth(j-l) 60 40 40 20 0 0.0 20 Scu(cm) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 5 10 15 20 Lleads(mm) 25 Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat) 250 225 200 175 150 125 100 75 50 25 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Rth(j-a)(C/W) Epoxy printed circuit board FR4 copper thickness = 35 m STmite flat Scu(cm) 4.5 5.0 6/10 Doc ID 7504 Rev 8 STPS1L60 Package information 2 Package information Epoxy meets UL94, V0 Band indicates cathode In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 5. SMA dimensions Dimensions Ref. E1 Millimeters Min. Max. 2.45 0.20 1.65 0.40 2.90 5.35 4.60 1.50 Inches Min. 0.075 0.002 0.049 0.006 0.089 0.189 0.156 0.030 Max. 0.094 0.008 0.065 0.016 0.114 0.211 0.181 0.059 D A1 A2 b 1.90 0.05 1.25 0.15 2.25 4.80 3.95 0.75 E c A1 D E b C L A2 E1 L Figure 20. Footprint, dimensions in mm (inches) 1.4 (0.055) 2.63 (0.103) 1.4 (0.055) 1.64 (0.064) 5.43 (0.214) Doc ID 7504 Rev 8 7/10 Package information Table 6. STmite flat dimensions Dimensions Ref. Millimeters Min. E1 L L1 STPS1L60 Inches Min. Typ. Max. Typ. 0.85 0.55 0.85 0.15 1.90 3.80 2.95 0.55 2.40 0.60 0.35 Max. 0.95 0.65 1.00 0.25 2.05 3.90 3.10 0.80 2.60 0.75 0.50 A L2 0.80 0.40 0.70 0.10 1.75 3.60 2.80 0.50 2.10 0.45 0.20 0.031 0.033 0.037 0.016 0.022 0.026 0.027 0.033 0.039 0.004 0.006 0.009 0.069 0.075 0.081 0.142 0.150 0.154 0.110 0.116 0.122 0.020 0.022 0.031 0.083 0.094 0.102 0.018 0.024 0.030 0.008 0.014 0.020 b D b b2 b2 c D E E1 L L1 L2 L3 E L3 c A Figure 21. Footprint dimensions 0.85 0.63 (0.033) (.025) 2.00 (0.079) 0.65 (.026) (0.026) 0.65 (0.037) 0.95 1.95 (0.077) 4.13 (0.163) millimeters (inches) Table 7. DO-41 (plastic) dimensions Dimensions Ref. OD OB Millimeters Min. Max. 5.20 2.71 Inches Min. 0.160 0.080 1 Max. 0.205 0.107 A C A C 4.07 2.04 25.4 0.71 B C D 0.86 0.028 0.034 8/10 Doc ID 7504 Rev 8 STPS1L60 Ordering information 3 Ordering information Table 8. Ordering information Marking GB6 STPS1L60 STPS1L60 F1L6 Package SMA DO-41 DO-41 STmite flat Weight 0.068 g 0.34 g 0.34 g 0.016 g Base qty 5000 2000 5000 12000 Delivery mode Tape and reel Ammopack Tape and reel Tape and reel Order code STPS1L60A STPS1L60 STPS1L60RL STPS1L60MF 4 Revision history Table 9. Date Jul-2003 Aug-2004 25-Jun-2009 30-Sep-2009 Document revision history Revision 5A 6 7 8 Last update. SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc). Added package STmite flat. Updated ECOPACK statement. Updated table 7 ref. " C ". Changes Doc ID 7504 Rev 8 9/10 STPS1L60 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 Doc ID 7504 Rev 8 |
Price & Availability of STPS1L60MF |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |