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ECG040B
InGaP HBT Gain Block
Product Features
* DC - 4 GHz * +18.5 dBm P1dB at 1 GHz * +35 dBm OIP3 at 1 GHz * 16 dB Gain at 1 GHz * 5.5 dB Noise Figure * Available in Lead-free / green SOT-89 Package Style * Internally matched to 50
Product Description
The ECG040B is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1 GHz, the ECG040B typically provides 15.8 dB of gain, +35 dBm Output IP3, and +18.5 dBm P1dB. The ECG040B consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a lowcost, surface-mountable lead-free/green/RoHS-compliant SOT-89 package. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the ECG040B will work for other various applications within the DC to 4 GHz frequency range such as CATV and mobile wireless.
Functional Diagram
GND 4
1 RF IN
2 GND
3 RF OUT
Applications
* * * * * Mobile Infrastructure CATV / FTTX W-LAN / ISM RFID WiMAX / WiBro
Function Input Output/Bias Ground
Pin No. 1 3 2, 4
Specifications (1)
Parameter
Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (2) Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current
Typical Performance (1)
Units
MHz MHz dB dBm dBm MHz dB dB dB dBm dBm dB V mA
Min
DC
Typ
1000 15.8 +18.5 +35 2000 15.3 22 16 +18 +35 5.5 4.8 70
Max
4000
Parameter
Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure
Units
MHz dB dB dB dBm dBm dB 500 16.0 -24 -27 +18.5 +35.5 4.6
Typical
900 15.8 -24 -23 +18.5 +35 5.5 1900 15.3 -23 -16 +18 +34.5 5.8 2140 15.1 -21 -16 +19 +30.5 3.8
12.8
17.5
1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +6 V, Rbias = 16 , 50 System. 2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Storage Temperature RF Input Power (continuous) Device Current Junction Temperature Thermal Resistance, Rth -65 to +150 C +12 dBm 130 mA +160 C 128 C/W
Rating
Ordering Information
Part No.
ECG040B-G ECG040B-PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
700 -2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
TriQuint Semiconductor, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6633 * e-mail: info-sales@tqs.com * Web site: www. TriQuint.com
Page 1 of 4 February 2009
ECG040B
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +6 V, Rbias = 16 , Icc = 70 mA
Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure MHz dB dB dB dBm dBm dB 100 16.2 -23 -32 +18.4 +35.6 4.6 500 16.0 -24 -27 +18.5 +35.5 4.7 900 15.8 -24 -23 +18 +35 4.9 1900 15.3 -23 -16 +18 +33.2 5.1 2140 15.1 -21 -16 +18 +32.9 5.3 2400 14.8 -20 -15 +18 +32.4 5.4 3500 13.9 -17 -11 +17.5
1. Test conditions: T = 25 C, Supply Voltage = +6 V, Device Voltage = 4.8 V, Rbias = 16 , Icc = 70 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain
18 16 14 12 10 8
Return Loss
Icc vs. Vcc 200 180 160 140 120 100 80 60 40 20 0 0
0 -10 -20 -30
S11 S22
Icc (mA)
S 1 1 , S 2 2 (d B )
G a in (d B )
25C
-40 0 1 2 3 4 5 6
0
1
2
3
4
5
6
1
2
Frequency (GHz)
OIP3 vs. Frequency 40 35 NF (dB) 30 25 25C 20 500 1000 85C -40C 2500 3000 6 5 4 3 2 500
Frequency (GHz)
Noise Figure vs. Frequency 24 22
3 Vcc (V)
4
5
6
P1dB vs. Frequency
OIP3 (dBm)
P1dB (dBm)
20 18 16 14 25C 85C 2000 -40C 2500 3000
1500 2000 Frequency (MHz)
1000
1500
2000
12 500
1000
1500
Frequency (MHz)
Frequency (MHz)
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6633 * e-mail: info-sales@tqs.com * Web site: www. TriQuint.com
Page 2 of 4 February 2009
ECG040B
InGaP HBT Gain Block
Recommended Application Circuit
Vcc Icc = 70 mA
R4 Bias Resistor C4 Bypass Capacitor C3 0.018 F L1 RF Choke RF IN C2 Blocking Capacitor RF OUT
C1 Blocking Capacitor
Reference Designator L1 C1, C2, C4
50 820 nH .018 F
Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF
2500 18 nH 56 pF
3500 15 nH 39 pF
1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig. L1 C1, C2 C3 C4 R4
Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 F chip capacitor Do Not Place 16 1% tolerance
Size 0603 0603 0603 0805
Recommended Bias Resistor Values Supply R1 value Size Voltage 6V 17.1 ohms 0805 7V 31.4 ohms 1210 8V 46 ohms 1210 9V 60 ohms 2010 10 V 74 ohms 2010 12 V 103 ohms 2512
The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +6 V. A 1% tolerance resistor is recommended.
Typical Device S-Parameters
S-Parameters (Vdevice = +4.8 V, ICC = 70 mA, T = 25 C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000
-23.31 -23.69 -23.45 -22.70 -22.13 -19.60 -19.24 -16.99 -15.40 -13.81 -11.78 -11.08 -9.31
-179.51 170.90 162.60 156.61 148.64 139.22 121.52 115.00 97.66 84.99 64.76 52.37 35.87
16.19 16.04 15.79 15.50 15.16 14.76 14.31 13.86 13.33 12.88 12.19 11.70 10.98
177.81 158.74 138.37 118.53 99.02 79.46 61.06 41.97 23.55 4.82 -13.55 -30.90 -50.95
-19.40 -19.30 -19.12 -19.03 -18.71 -18.36 -18.13 -17.78 -17.23 -16.82 -16.84 -16.58 -16.15
-0.03 -5.83 -12.26 -19.16 -26.80 -32.98 -41.04 -51.05 -58.84 -68.93 -79.74 -89.82 -102.41
-36.95 -27.31 -21.40 -18.24 -16.09 -14.17 -12.61 -11.16 -10.31 -9.04 -7.54 -7.37 -6.42
-170.80 -130.75 -141.51 -153.77 -175.02 167.68 152.88 130.54 115.55 97.41 76.41 64.41 46.46
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6633 * e-mail: info-sales@tqs.com * Web site: www. TriQuint.com
Page 3 of 4 February 2009
ECG040B
InGaP HBT Gain Block
ECG040B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an "E040G" designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an "E040" designator followed by an alphanumeric lot code; it may also have been marked with a "J" designator followed by a 3-digit numeric lot code. Tape and reel specifications for this part are located on the website in the "Application Notes" section.
MSL / ESD Rating Land Pattern
ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6633 * e-mail: info-sales@tqs.com * Web site: www. TriQuint.com
Page 4 of 4 February 2009

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