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DATA SHEET
TDA3608Q; TDA3608TH Multiple voltage regulators with switch
Product specification Supersedes data of 2001 Jun 29 2003 Nov 28
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
FEATURES General * Two VP-state controlled regulators (regulator 1 and regulator 3) and a power switch * Regulator 2 and reset circuit operate during load dump and thermal shutdown * Separate control pins for switching regulator 1, regulator 3 and power switch * Supply voltage range from -18 to +50 V * Low reverse current of regulator 2 * Low quiescent current (when regulator 1, regulator 3 and power switch are switched off) * Hold output circuit for regulator 1 (only valid when regulator 3 output voltage >1.3 V) * Reset and hold outputs (open-collector outputs) * Adjustable reset delay time * High ripple rejection * Backup capacitor connection to supply regulator 2 and reset circuit up to 25 V. Protections * Reverse polarity safe (down to -18 V without high reverse current) * Able to withstand voltages up to 18 V at the outputs (supply line may be short circuited) * ESD protection on all pins * Thermal protection * Load dump protection * Foldback current limit protection for regulator 1, regulator 2 and regulator 3 ORDERING INFORMATION TYPE NUMBER TDA3608Q TDA3608TH PACKAGE NAME DBS13P HSOP20 DESCRIPTION
TDA3608Q; TDA3608TH
* Delayed foldback current limit protection for power switch (at short-circuit); delay time fixed by reset delay capacitor * All regulator outputs and power switch are DC short-circuited safe to ground and VP. GENERAL DESCRIPTION The TDA3608 is a multiple output voltage regulator with a power switch, intended for use in car radios with or without a microcontroller. It contains: * Two fixed output voltage regulators with a foldback current protection (regulator 1 and regulator 3) and one fixed output voltage regulator (regulator 2) intended to supply a microcontroller, which also operates during load dump and thermal shutdown * A power switch with protections, operated by an enable input * Reset and hold outputs that can be used to interface with the microcontroller; the reset output can be used to call up the microcontroller and the hold output indicates that the regulator 1 output voltage is available and within the range * A supply pin which can withstand load dump pulses and negative supply voltages * Regulator 2 which is switched on at a backup voltage higher than 6.5 V and switched off when the regulator 2 output drops below 1.9 V * A provision for the use of a reserve (backup) supply capacitor that will hold enough energy for regulator 2 (5 V continuous) to allow a microcontroller to prepare for loss of voltage.
VERSION SOT141-6 SOT418-3
plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) plastic, heatsink small outline package; 20 leads; low stand-off height
2003 Nov 28
2
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
QUICK REFERENCE DATA SYMBOL Supply VP supply voltage operating regulator 2 on PARAMETER CONDITIONS
TDA3608Q; TDA3608TH
MIN.
TYP.
MAX.
UNIT
9.5 2.4 - - - - -40
14.4 14.4 - - - 500 - 8.5 5.0 5.0
18 18 -18 30 50 600 +150
V V V V V A C V V V
reverse polarity; non-operating jump start for t 10 minutes load dump protection for t 50 ms and tr 2.5 ms Iq Tj VREG1 VREG2 VREG3 Power switch Vdrop IM dropout voltage peak current ISW = 1 A ISW = 1.8 A quiescent supply current junction temperature 1 mA IREG1 600 mA 0.5 mA IREG2 150 mA 1 mA IREG3 400 mA standby mode; VP = 12.4 V
Voltage regulators output voltage of regulator 1 output voltage of regulator 2 output voltage of regulator 3 8.15 4.75 4.75 - - 2 8.85 5.25 5.25
0.45 1.0 -
0.7 1.8 -
V V A
2003 Nov 28
3
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
BLOCK DIAGRAM
TDA3608Q; TDA3608TH
handbook, full pagewidth
(14.4 V)
VP
1 (3)
POWER SWITCH
(17) 13 SW
(14.2 V/1.8 A)
ENSW
7 (10)
&
TEMPERATURE AND LOAD DUMP PROTECTION
BACKUP SWITCH
(16) 12 BU
(14.2 V/100 mA)
BACKUP CONTROL
REGULATOR 2
(15) 11
REG2
(5 V/150 mA)
&
EN3 4 (6)
REGULATOR 3
(5) 3
REG3
(5 V/400 mA)
&
EN1 6 (9)
REGULATOR 1
(4) 2
REG1
(8.5 V/600 mA)
(11) 8
HOLD
hold enable
TDA3608Q (TDA3608TH)
CRES 9 (12) (1, 2, 7, 13, 18, 19, 20) 10 (14) GND n.c.
(8) 5
RES
MGK602
Numbers in parenthesis refer to type number TDA3608TH.
Fig.1 Block diagram.
2003 Nov 28
4
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
PINNING PIN SYMBOL TDA3608Q VP REG1 REG3 EN3 RES EN1 ENSW HOLD CRES GND REG2 BU SW n.c. 1 2 3 4 5 6 7 8 9 10 11 12 13 - TDA3608TH 3 4 5 6 8 9 10 11 12 14 15 16 17 supply voltage regulator 1 output regulator 3 output
TDA3608Q; TDA3608TH
DESCRIPTION
regulator 3 enable input reset output regulator 1 enable input power switch enable input hold output reset delay capacitor connection ground regulator 2 output backup capacitor connection power switch output
1, 2, 7, 13, 18,19 not connected and 20
handbook, halfpage
VP REG1 REG3 EN3 RES EN1 ENSW HOLD CRES
1 2 3 4 5 6 7 8 9 n.c. 13 CRES 12 HOLD 11
MGT566
handbook, halfpage
n.c. 20 n.c. 19 n.c. 18 SW 17
1 n.c. 2 n.c. 3 VP 4 REG1 5 REG3
TDA3608Q
BU 16
TDA3608TH
REG2 15 GND 14 6 EN3 7 n.c. 8 RES 9 EN1 10 ENSW
GND 10 REG2 11
BU 12 SW 13
MGK601
Fig.2 Pin configuration of TDA3608Q.
Fig.3 Pin configuration of TDA3608TH.
2003 Nov 28
5
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
FUNCTIONAL DESCRIPTION The TDA3608 is a multiple output voltage regulator with a power switch, intended for use in car radios with or without a microcontroller. Because of low-voltage operation of the car radio, low-voltage drop regulators are used in the TDA3608. Backup supply The charge of the backup capacitor connected to pin BU can be used to supply regulator 2 for a short period when the supply voltage VP drops to 0 V (the time depends on the value of the capacitor). Regulator 1 When the output voltage of regulator 2 and the supply voltage (VP > 4.5 V) are both available, regulator 1 can be operated by means of enable pin EN1 (see Fig.4). Regulator 2 Regulator 2 switches on (see Fig.5) when the backup voltage exceeds 6.5 V for the first time and switches off when the output voltage of regulator 2 drops below 1.9 V (this is far below an engine start). Regulator 3 When the output voltage of regulator 2 and the supply voltage (VP > 4.5 V) are both available, regulator 3 can be operated by means of enable pin EN3 (see Fig.4). Reset When regulator 2 is switched on and the output voltage of this regulator is within its voltage range, the reset output (see Fig.5) will be enabled (pin RES goes HIGH through an external pull-up resistor) to generate a reset to the microcontroller. The reset cycles can be extended by means of an external capacitor connected to pin CRES. This start-up feature is included to secure a smooth start-up of the microcontroller at first connection, without uncontrolled switching of regulator 2 during the start-up sequence. Hold Regulator 1 has an open-collector hold output (see Fig.4) indicating that the output voltage is settled at 8.5 V. Pin HOLD is held HIGH by an external pull-up resistor. When the supply voltage VP drops or during high load, the output voltage drops out-of-regulation and pin HOLD goes LOW. Power switch
TDA3608Q; TDA3608TH
The hold output is only activated when VREG3 > 1.3 V. When pin HOLD is connected via a pull-up resistor to the output of regulator 3 spikes will be minimized to 1.3 V (maximum value) because the hold output is only disabled when VREG3 < 1.3 V. Pin HOLD will be forced LOW when the load dump protection is activated and also in the standby mode.
The power switch can be controlled by means of enable pin ENSW (see Fig.6). Protections All output pins are fully protected. The regulators are protected against load dump (regulator 1 and regulator 3 switch off at VP > 18 V) and short-circuit (foldback current protection). The power switch contains a foldback current protection, but this protection is delayed at a short-circuit condition by the reset delay capacitor. During this time the output current is limited to at least 2 A (peak value) and 1.8 A (continuous value) at VP 18 V. During the foldback mode the current is limited to 0.5 A (typical value). The timing diagram is shown in Fig.7. The foldback protection is activated when VSW < 4 V. When regulator 2 is out-of-regulation and generates a reset, the power switch is in the foldback mode immediately when VSW < 4 V. In the standby mode the voltage on the reset delay capacitor is about 4 V and the voltage on the power switch output is VP - 0.45 V (typical value) at ISW = 1 A. During an overload condition or short-circuit the reset delay capacitor will be charged to a higher voltage. The power switch is in the high current mode while the capacitor is charged, after this the switch is in the foldback mode (VSW < 4 V). While the reset delay capacitor is charged the power switch output can reach its correct output voltage. Now the voltage on the reset delay capacitor is decreased rapidly to 4 V. The reset output voltage is not influenced by this change of voltages. The time of the high current mode depends on the value of the reset delay capacitor. At VP > 18 V the power switch is clamped at maximum 17.2 V (to avoid that external connected circuitry is being damaged by an overvoltage) and the power switch will switch off at load dump.
2003 Nov 28
6
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
handbook, full pagewidth
18.0 V
load dump
9.5 V 4.5 V 4.0 V
VP
2.2 V enable regulator 1 2.0 V 8.5 V
regulator 1
0V 2.2 V
enable regulator 3 2.0 V
5.0 V
regulator 3
0V
hold output
MGT568
Fig.4 Timing diagram of regulator 1, regulator 3 and hold output.
handbook, full pagewidth
18.0 V
load dump
VP
4.0 V 6.5 V 5.4 V
backup
regulator 2 reset delay capacitor reset output
5.0 V 1.9 V 0V 5.0 V 3.0 V 0V 5.0 V
MGT567
t d(res)
Fig.5 Timing diagram of backup, regulator 2 and reset output.
2003 Nov 28
7
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
handbook, full pagewidth
18.0 V
load dump
VP enable power switch power switch output
4.5 V 4.0 V 2.2 V 2.0 V 16.2 V
0V
MGT569
Fig.6 Timing diagram of power switch output.
handbook, full pagewidth
regulator 2
5V
t d(sw)
6.4 V
t d(res)
reset delay voltage
4V 3V 0V
reset output enable power switch power switch voltage
5V 0V > 2.2 V < 2.0 V 14 V 4V 0V 2A
power switch current
0.5 A 0A
foldback mode current limit mode
foldback mode
MGT570
Fig.7 Timing diagram of current protection of power switch.
2003 Nov 28
8
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP PARAMETER supply voltage operating reverse polarity; non-operating jump start for t 10 minutes load dump protection for t 50 ms and tr 2.5 ms Ptot Tstg Tamb Tj total power dissipation storage temperature ambient temperature junction temperature non-operating operating operating CONDITIONS
TDA3608Q; TDA3608TH
MIN. - - - - - -55 -40 -40 18
MAX. V V V V W C C C -18 30 50 62 +150 +85 +150
UNIT
THERMAL CHARACTERISTICS SYMBOL Rth(j-c) TDA3608Q TDA3608TH Rth(j-a) thermal resistance from junction to ambient in free air PARAMETER thermal resistance from junction to case 2 3.5 50 K/W K/W K/W CONDITIONS VALUE UNIT
CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measured in test circuit of Fig.12; unless otherwise specified. SYMBOL Supply VP supply voltage operating regulator 2 on; note 1 jump start for t 10 minutes load dump protection for t 50 ms and tr 2.5 ms Iq quiescent supply current standby mode; note 2 VP = 12.4 V VP = 14.4 V Vthr Vthf Vhys Vthr rising threshold voltage falling threshold voltage hysteresis voltage - - 4.0 3.5 - 6.0 500 520 600 - 5.0 4.5 - 7.1 A A V V V 9.5 2.4 - - 14.4 14.4 - - 18 18 30 50 V V V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Schmitt trigger supply voltage for regulator 1, regulator 3 and power switch 4.5 4.0 0.5
Schmitt trigger supply voltage for regulator 2 rising threshold voltage 9 6.5 V
2003 Nov 28
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
SYMBOL Vthf Vhys Vthr Vthf Vhys ILI Vthr Vthf Vhys Vthr Vthf Vhys IsinkL ILO tr tf Ich Idch Vthr(res)
PARAMETER falling threshold voltage hysteresis voltage
CONDITIONS
MIN. 1.7 - 1.7 1.5 1.9 4.6
TYP. 2.2 - 2.7 2.5 0.5 10
MAX.
UNIT V V
Schmitt trigger voltage for enable input (regulator 1, regulator 3 and power switch) rising threshold voltage falling threshold voltage hysteresis voltage input leakage current IREG = ISW = 1 mA VEN = 5 V 2.2 2.0 0.2 5 VREG2 - 0.15 VREG2 - 0.35 0.2 VREG1 - 0.15 VREG1 - 0.35 0.2 - - 7 1 V V V A
0.1 1
Schmitt trigger voltage for reset rising threshold voltage of regulator 2 falling threshold voltage of regulator 2 hysteresis voltage VP rising; IREG2 = 50 mA; note 3 - VP falling; IREG2 = 50 mA; note 3 4.3 0.1 - 7.7 0.1 Vo 0.8 V Vo = 5 V; VP = 14.4 V note 4 note 4 VREG2 - 0.075 V - 0.3 V V
Schmitt trigger voltage for hold rising threshold voltage of regulator 1 falling threshold voltage of regulator 1 hysteresis voltage VP rising; note 3 VP falling; note 3 VREG1 - 0.075 V - 0.3 - 2 50 50 V V
Reset and hold output LOW-level sink current output leakage current rise time fall time 2 - - - 2 500 2.8 mA A s s A A V
Reset delay capacitor circuit charge current discharge current rising threshold voltage for delayed reset pulse rising threshold note 5 voltage for delayed power switch foldback mode reset delay time C7 = 47 nF; note 6 3 800 3.0 4 - 3.2
Vthr(sw)
-
6.4
-
V
td(res)
32
47
70
ms
2003 Nov 28
10
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
SYMBOL
PARAMETER
CONDITIONS
MIN. -
TYP.
MAX.
UNIT
Regulator 1; IREG1 = 5 mA; unless otherwise specified VREG1(off) VREG1 Vline Vload Iq SVRR Vdrop Im Isc output voltage with regulator off output voltage line regulation load regulation quiescent current supply voltage ripple rejection dropout voltage current limit short-circuit current 1 mA IREG1 600 mA 9.5 V VP 18 V 9.5 V VP 18 V 1 mA IREG1 600 mA IREG1 = 600 mA fi = 3 kHz; Vi = 2 V (p-p) VP = 8.5 V; IREG1 = 550 mA; note 7 RL 0.5 ; see Fig.8; note 9 0.5 mA IREG2 150 mA IREG2 = 300 mA; note 10 7 V VP 18 V 18 V VP 50 V; IREG2 150 mA Vline Vload SVRR Vdrop line regulation load regulation supply voltage ripple rejection dropout voltage 6 V VP 18 V 18 V VP 50 V 1 mA IREG2 150 mA 1 mA IREG2 300 mA fi = 3 kHz; Vi = 2 V (p-p) normal supply; note 7 VP = 4.75 V; IREG2 = 100 mA VP = 5.75 V; IREG2 = 200 mA backup supply; note 11 VBU = 4.75 V; IREG2 = 100 mA - VBU = 5.75 V; IREG2 = 200 mA - Im Isc current limit short-circuit current VREG2 > 4.5 V; see Fig.9; note 8 0.32 RL 0.5 ; see Fig.9; note 9 20 - 1 mA IREG3 400 mA 7 V VP 18 V Vline Vload line regulation load regulation 7 V VP 18 V 1 mA IREG3 400 mA 11 4.75 4.75 - - 0.2 0.8 0.37 100 0.5 1.0 - - V V A mA - - 0.4 0.8 0.6 1.2 V V 1 8.5 8.5 2 20 25 70 0.4 1.2 800 400 8.85 8.85 75 50 60 - 0.7 - - mV V V mV mV mA dB V A mA
8.15 8.15 - - - 60 -
VREG1 > 7.5 V; see Fig.8; note 8 0.65 250
Regulator 2; IREG2 = 5 mA; unless otherwise specified VREG2 output voltage 4.75 4.75 4.75 4.75 - - - - 60 5.0 5.0 5.0 5.0 2 15 20 - 70 5.25 5.25 5.25 5.25 50 75 50 100 - V V V V mV mV mV mV dB
Regulator 3; IREG3 = 5 mA; unless otherwise specified VREG3(off) VREG3 output voltage with regulator off output voltage 1 5.0 5.0 2 20 400 5.25 5.25 50 50 mV V V mV mV
2003 Nov 28
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
SYMBOL Iq SVRR Vdrop Im Isc Vdrop Vcl Vfb Idc IM Isc
PARAMETER quiescent current supply voltage ripple rejection dropout voltage current limit short-circuit current
CONDITIONS IREG3 = 400 mA fi = 3 kHz; Vi = 2 V (p-p) VP = 5.75 V; IREG3 = 400 mA; note 7 VREG3 > 4.5 V; see Fig.10; note 8 RL 0.5 ; see Fig.10; note 9 ISW = 1 A; note 12 ISW = 1.8 A; note 12 VP 18 V ISW = -100 mA VP = 16 V; VSW = 13.5 V VP = 17 V; see Fig.11; note 13 VP = 14.4 V; VSW < 3.5 V; see Fig.11; note 14
MIN. - 60 - 0.45 100 - - 15 - 1.8 2 - 15 70 1 0.70 400
TYP. 40 - 1.5 - - 0.7 1.8
MAX.
UNIT mA dB V A mA
Power switch dropout voltage clamping voltage flyback voltage behaviour continuous current peak current short-circuit current 0.45 1.0 16.2 VP + 3 2.0 - 0.5 V V V V A A A
17.2 22 - - -
Backup switch Idc Vcl Ir Notes 1. The minimum value is the minimum operating voltage, only if VP has exceeded 6.5 V. 2. The quiescent current is measured in the standby mode. Therefore, the enable inputs of regulator 1, regulator 3 and the power switch are grounded and RL(REG2) = . 3. The voltage of the regulator drops as a result of a VP drop. 4. The rise and fall time is measured with a 10 k pull-up resistor and CL = 50 pF. 5. This is the threshold voltage for the delay time of the power switch. The voltage on the reset delay capacitor increases only at low output voltage of the power switch (for example at short circuit). When the voltage on this capacitor exceeds this threshold voltage, the power switch is set to the foldback mode. The power switch is also protected by the temperature protection. 6. Delay time calculation: C 3 a) Reset pulse delay: t d(res) = ----- x V C(th1) = C x 1000 x 10 [sec] The delay time is 47 ms for C = 47 nF. I ch C 3 b) Power switch delay: t d(sw) = ----- x V C(th2) = C x 500 x 10 [sec] The delay time is 23.5 ms for C = 47 nF. I ch 7. The dropout voltage of regulator 1, regulator 2 and regulator 3 is measured between pin VP and pins REG1, REG2 or REG3 respectively. 8. During current limit, current Im is held constant. 9. The foldback current protection limits the dissipated power at short-circuit. continuous current clamping voltage reverse current VP 16.7 V VP = 0; VBU = 12.4 V; note 15 0.3 - - 0.35 - - - 16 900 A V mA
2003 Nov 28
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Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
10. The peak current of 300 mA can only be applied for short periods (t < 100 ms). 11. The dropout voltage is measured between pins BU and REG2. 12. The dropout voltage of the power switch is measured between pins VP and SW. 13. The maximum output current of the power switch is limited to 1.8 A when VP > 18 V. 14. During short-circuit, current Isc of the power switch is held constant to a lower value than the continuous current after a delay of at least 10 ms. Furthermore, a foldback function is activated after the delay. When VSW < 3.5 V, the short-circuit current is reduced to 0.5 A (typical value). The short-circuit protection of the power switch functions best when C1 = 220 F and C2 = 10 F. 15. The reverse current of the backup switch is the current which is flowing out of pin VP at VP = 0 V.
handbook, halfpage
MGT571
8.5
handbook, halfpage
VREG2 VREG1 (V) (V) 5.0
MGT572
2 1 Isc 300 I REG1 (mA) Im I sc 50 Im
I REG2 (mA)
Fig.8 Foldback current protection of regulator 1.
Fig.9 Foldback current protection of regulator 2.
handbook, halfpage
MGT573
VREG3 (V) 5.0
handbook, halfpage
MGT574
14.2
VSW (V) 3 I sc 200 I REG3 (mA) Im 0.5
(1)
1
I SW (A)
2
(1) Delayed; time depends on value of capacitor C7.
Fig.10 Foldback current protection of regulator 3.
Fig.11 Current protection of power switch.
2003 Nov 28
13
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TEST AND APPLICATION INFORMATION Test information
TDA3608Q; TDA3608TH
VP VP C1 220 nF
(1)
1 (3)
(17) 13
SW C9 (2) >10 F R4 2.2 C2 220 nF
14.2 V RL(SW) 1 k
ENSW VENSW EN1 VEN1 EN3 VEN3
7 (10)
(15) 11
REG2 C3 10 F
5V RL(REG2) 1 k 8.5 V C4 10 F RL(REG1) 1 k 5V C5 10 F R2 10 k C6 50 pF RL(REG3) 1 k
6 (9)
(4) 2
REG1
TDA3608Q (TDA3608TH)
4 (6) (5) 3 REG3
CRES C7 47 nF R1 Vbu 1 k BU C8 220 nF
9 (12)
(8) 5
RES
R3 10 k
12 (16) 10 GND
HOLD (11) 8
C10 50 pF
mgk605
Numbers in parenthesis refer to type number TDA3608TH. (1) Capacitor not required for stability. (2) Value depends on application.
Fig.12 Test circuit.
2003 Nov 28
14
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
Application information NOISE The noise on the supply line depends on the value of the supply capacitor and is caused by a current noise (the output noise of the regulators is translated into a current noise by means of the output capacitors). Table 1 shows the noise figure with the corresponding output capacitor Co for each regulator. The noise is minimal when a high frequency capacitor of 220 nF in parallel with an electrolytic capacitor of 100 F is connected directly to pins VP and GND. Table 1 Noise figure; note 1 NOISE FIGURE (V) REGULATOR 1 2 3 Note 1. Measured at a bandwidth of 200 kHz. STABILITY The regulators are made stable with the externally connected output capacitors. The output capacitors can be selected using the graphs of Figs 13 and 14. When an electrolytic capacitor is used, the temperature behaviour of this output capacitor can cause oscillations at low temperature. The next two examples show how an output capacitor value is selected. Co = 10 F 225 225 255 Co = 47 F 150 150 200 Co = 100 F 135 135 180
0 1 2
TDA3608Q; TDA3608TH
Solution
Use a tantalum capacitor of 10 F or a larger electrolytic capacitor. The use of tantalum capacitors is recommended to avoid problems with stability at low temperatures.
handbook, halfpage
MBK100
4 R () 3
maximum ESR
stable region
1 minimum ESR 10 C (F) 100
Fig.13 Curves for selecting value of output capacitor for regulator 1 and regulator 3.
handbook, halfpage
14
MBK099
maximum ESR
R 12 () 10 8
Example 1
The regulator 1 is made stable with an electrolytic output capacitor of 220 F with ESR = 0.15 . At Tamb = -30 C the capacitor value is decreased to 73 F and the ESR is increased to 1.1 . The regulator remains stable at Tamb = -30 C (see Fig.13).
6 4 2 0 minimum ESR
0.22
stable region
Example 2
The regulator 2 is made stable with an electrolytic capacitor of 10 F with ESR = 3 . At Tamb = -30 C the capacitor value is decreased to 3 F and the ESR is increased to 23.1 . The regulator will be instable at Tamb = -30 C (see Fig.14).
1
10 C (F)
100
Fig.14 Curves for selecting value of output capacitor for regulator 2.
2003 Nov 28
15
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
PACKAGE OUTLINES
TDA3608Q; TDA3608TH
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave x D Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c vM
1 Z e e1 bp wM
13 m e2
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-6 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45
ISSUE DATE 99-12-17 03-03-12
2003 Nov 28
16
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
E D x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 20 Z e bp 11 wM (A3) A 10
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1.27 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.5 2.0 8 0
+0.08 0.53 0.32 16.0 13.0 -0.04 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT418-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 02-02-12 03-07-23
2003 Nov 28
17
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor
TDA3608Q; TDA3608TH
type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all the BGA, HTSSON..T and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
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Philips Semiconductors
Product specification
Multiple voltage regulators with switch
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
TDA3608Q; TDA3608TH
MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Suitability of IC packages for wave, reflow and dipping soldering methods MOUNTING Through-hole mount CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL Through-holesurface mount Surface mount PMFP(4) BGA, HTSSON..T(5), LBGA, LFBGA, SQFP, SSOP-T(5), TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(7), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L(11), PMFP(10), WQCCN32L(11) Notes 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. Hot bar soldering or manual soldering is suitable for PMFP packages. 5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 7. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 10. Hot bar or manual soldering is suitable for PMFP packages. 11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. PACKAGE(1) suitable suitable(3) not suitable not suitable not suitable(6) SOLDERING METHOD WAVE REFLOW(2) DIPPING - - not suitable suitable suitable suitable - - - -
suitable not not recommended(7)(8) recommended(9)
suitable suitable suitable not suitable
- - - -
not suitable
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20
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development
TDA3608Q; TDA3608TH
DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R32/04/pp22
Date of release: 2003
Nov 28
Document order number:
9397 750 12339

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