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| Surface Mount Chip LEDs Technical Data HSMx-C260 Features * Reverse Mountable SMT LED * Diffused Optics * Small 3.4 x 1.25 mm Footprint * Operating Temperature Range of -25C to +80C * Compatible with IR Solder * Four Colors Available: Red, Orange, Yellow, and Green * Available in 8 mm tape on 7 in. (178 mm) Diameter Reels Description The HSMx-C260 is a reverse mountable chip-type LED for lighting the non-component side of a PC board. In this reverse mounting configuration, this LED is designed to emit light through a small cut-out hole in the PC board. The HSMx-C260 is available in four colors. The small size, narrow footprint, and low profile make this series of LEDs excellent for backlighting, status indication, and front panel illumination applications. Applications * * * * Keypad Backlighting Symbol Backlighting Status Indication Front Panel Indicator Device Selection Guide Part Number HSMS-C260 HSMD-C260 HSMY-C260 HSMG-C260 Color High Efficiency Red Orange Yellow Green Parts Per Reel 3000 3000 3000 3000 2 Package Dimensions LED DIE CATHODE MARK 1.25 (0.049) 3.4 (0.134) DIFFUSED EPOXY 1.1 (0.043) PC BOARD 1.2 (0.047) POLARITY 1.1 (0.043) 0.3 (0.012) 0.50 0.15 (0.020 0.006) 0.50 0.15 (0.020 0.006) SOLDERING TERMINAL HSMx-C260 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. Absolute Maximum Ratings at TA=25C Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMx-C260 Units 25 mA 100 mA 65 mW 5 V 95 C -25 to +80 C -30 to +85 C See IR soldering profile (Figure 6) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. 3 Optical Characteristics at TA=25C Color Luminous Intensity[1] Iv(mcd) @ 20 mA Min. Typ. 2.50 8.0 2.50 8.0 2.50 8.0 4.00 15.0 Peak Wavelength peak(nm) Typ. 639 606 584 570 Dominant Wavelength d(nm) Typ. 626 604 586 572 Viewing Angle 2 1/2 Degrees[2] Typ. 170 170 170 170 HER Orange Yellow Green Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA=25C Color Forward Voltage Reverse Capacitance VF(V) Breakdown C(pF) @ IF=20 mA VR(V) @ IR=100 A @ VF=0 V, f =1 MHz Typ. Max. Min. Typ. 1.9 2.6 5 8 2.1 2.6 5 6 2.1 2.6 5 7 2.2 2.6 5 6 Thermal Resistance RJ-P (C/W) Typ. 250 250 250 250 HER Orange Yellow Green Color Bin Limits[1] Green Color Bins[1] Dom. Wavelength [nm] Bin ID MIN. MAX. A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance: 0.5 nm Orange Color Bins[1] Dom. Wavelength [nm] Bin ID MIN. MAX. A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0 Tolerance: 1 nm Yellow/Amber Color Bins[1] Dom. Wavelength [nm] Bin ID MIN. MAX. A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.5 E 592.0 594.5 F 594.5 597.0 Tolerance: 0.5 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 4 Light Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Tolerance: 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 0.45 0.72 0.72 1.10 1.10 1.80 1.80 2.80 2.80 4.50 4.50 7.20 7.20 11.20 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 5 1.0 GREEN RELATIVE INTENSITY YELLOW 0.5 ORANGE HER 0 500 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative Intensity vs. Wavelength. 100 IF - FORWARD CURRENT - mA 1.6 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) HER 10 GREEN 1.2 0.8 1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 2.3 0.4 0 0 10 20 30 40 VF - FORWARD VOLTAGE - V IF - FORWARD CURRENT - mA Figure 2. Forward Current vs. Forward Voltage. Figure 3. Luminous Intensity vs. Forward Current. IF MAX. - MAXIMUM FORWARD CURRENT - mA 35 RELATIVE INTENSITY - % 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 20 40 60 80 100 30 25 20 15 10 5 0 RJ-A = 600C/W RJ-A = 800C/W 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C ANGLE Figure 4. Maximum Forward Current vs. Ambient Temperature. Figure 5. Relative Intensity vs. Angle. 6 2.2 (0.087) DIA. PCB HOLE 10 SEC. MAX. TEMPERATURE 230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. 3C/SEC. MAX. 1.25 (0.049) 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) Figure 6. Recommended Reflow Soldering Profile. Figure 7. Recommended Solder Pad Pattern. Note: 1. All dimensions in millimeters (inches). USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reeling Orientation. 7 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 20.20 MIN. (O 0.795 MIN.) O 13.1 0.5 (O 0.516 0.020) 3.0 0.5 (0.118 0.020) 178.40 1.00 (7.024 0.039) 59.60 1.00 (2.346 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) Note: 1. All dimensions in millimeters (inches). Figure 9. Reel Dimensions. 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157) CARRIER TAPE USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 1.30 (0.051) HSMx-C260 SERIES 3.70 (0.146) 1.45 (0.057) Figure 10. Tape Dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. Storage Condition: 5 to 30 C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright (c) 2002 Agilent Technologies, Inc. Obsoletes 5988-0366EN April 15, 2002 5988-6269EN |
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