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| Advance Product Information Aug 16, 2005 5.6 Watt 3.5GHz Packaged HPA Key Features * * * * * * * * * * * TGA2925-SG 3.5 GHz Application Frequency Range 11 dB Nominal Gain 2.5%EVM @29dBm OFDM signal at 3.5GHz 37.5 dBm Nominal Psat Internally Partially Matched IMD3 -50 dBc @ 24 dBm SCL, Typical Bias Conditions: 8 V @ 0.75 A (Quiescent) 0.5 m HFET Technology 2 lead Cu-alloy base package 802.16 and WiMax S-Band Power Amplifiers Primary Applications Product Description The TGA2925-SG HPA provides 11 dB of gain, 5.6 W of output power at 3.5 GHz and 2.5% EVM at 29 dBm output power. The device is ideally suited for high linearity, high power wireless data applications such as 802.16 and WiMax. The package has a high thermal conductivity copper alloy base. Internal partial matching simplifies system board layout by requiring a minimum of external components. Lead-Free & RoHS compliant. TGA2925 Fixture Measured Performance Bias Conditions: Vd = 8 V, Idq =0.75 A Performance data taken in a 3.5 GHz application circuit 15 S11 10 S-parameter (dB) 5 0 -5 -10 -15 -20 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 Frequency (GHz) 39 37 35 Pout (dBm) 33 31 29 27 25 18 20 22 24 26 Pin (dBm) 28 30 32 34 3.4GHz 3.45GHz 3.5GHz 3.55GHz 3.6GHz S21 S22 Evaluation Boards are available. Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to change without notice. 1 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TABLE I MAXIMUM RATINGS 1/ Symbol Vd Vg Idq | Ig | PIN PD TCH TM TSTG Parameter Drain Supply Voltage Gate Supply Voltage Range Drain Supply Current (Quiescent) Gate Current Input Continuous Wave Power Power Dissipation Operating Channel Temperature Mounting Temperature (6-10 Seconds) Storage Temperature Value 10 V -0.5 V to -5 V 2.1 A 30 mA 35 dBm 8.2 W 175 C 260 C -65 to 150 C Notes 2/ 2/ 2/ 2/, 3/ 4/ 1/ 2/ 3/ 4/ These ratings represent the maximum operable values for this device. Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. When operated at this bias condition with a base plate temperature of 70 C, the MTTF life is 2E+8 hours. Junction operating temperature will directly affect the device median time to failure (T M). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. 2 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TABLE II RF CHARACTERIZATION TABLE (TA = 25qC, Nominal) (Vd = 8 V, Idq = 0.75 A) TEST CONDITION f = 3.5 GHz f = 3.5 GHz f = 3.5 GHz SYMBOL Gain IRL ORL Psat PARAMETER Small Signal Gain Input Return Loss Output Return Loss Saturated Output Power TYPICAL 11 10 8 37.5 UNITS dB dB dB dBm TABLE III THERMAL INFORMATION Parameter RJC Thermal Resistance (channel to backside of package) Test Conditions Vd = 8 V ID = 0.75 A Pdiss = 6 W TCH (oC) 143 RTJC (qC/W) 12.2 TM (HRS) 1.2E+9 Note: Package backside SnPb soldered to carrier at 70C baseplate temperature. At saturated output power, the DC power consumption is 13.2W with 5.6W RF power delivered to the load and 7.6W dissipated. 3 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TGA2925 Measured Fixtured Data Application Circuit tuned to 3.5 GHz Bias Conditions: Vd = 8 V, Idq = 0.75 A 15 S11 10 S-parameter (dB) 5 0 -5 -10 -15 -20 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 Frequency (GHz) S21 S22 39 37 35 Pout (dBm) 33 31 29 27 25 18 20 22 24 26 Pin (dBm) 28 30 32 34 3.4GHz 3.45GHz 3.5GHz 3.55GHz 3.6GHz 4 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TGA2925 Measured Fixtured Data Application Circuit tuned to 3.5 GHz Bias Conditions: Vd = 8 V, Idq = 0.75 A OFDM 64QAM 7 6 5 EVM (%) 4 3 2 1 0 15 17 19 21 23 25 27 29 31 33 Output Power (dBm) 3.45GHz 3.5GHz 3.55GHz 3.6GHz 3.65GHz 5 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TGA2925 Measured Fixtured Data Application Circuit tuned to 3.5 GHz Bias Conditions: Vd = 8 V, Idq = 0.75 A 2 1.8 1.6 Id (A) 1.4 1.2 1 0.8 0.6 18 20 22 24 26 Pin (dBm) 28 30 32 34 3.4GHz 3.45GHz 3.5GHz 3.55GHz 3.6GHz 70 60 IMD3 (dBc) 50 40 30 20 10 0 16 3.4GHz 3.45GHz 3.5GHz 3.55GHz 3.6GHz 18 20 22 24 26 28 30 Output Power/ Tone (dBm) 6 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG Mechanical Drawing TGA2925-SG 0.068 Note: All dimensions are in inches with 5 mil tolerance 7 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG 3.5 GHz Application Circuit Schematic PCB is 20 mil thick Rogers 4003 substrate Bias Procedure 1. 2. 3. 4. 5. Ensure no RF power is applied to the device. Pinch off device by setting Vg to -3V. Increase Vd to 8.0V while monitoring drain current. Increase Vg until drain current reaches 0.75A Apply RF power. 8 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG Typical Evaluation Board Layout * C3 R1 C5 C4 493 mil 675 mil C1 C2 207 mil 518 mil *The layout is a general purpose drawing that needs to be tuned for the specific application. PCB is RO4003 20 mil thickness, 0.5 oz standard copper cladding, with r = 3.38. External Component Listing Part Type Capacitor Capacitor Capacitor Capacitor Capacitor Resistor Reference C1 C2 C3 C4 C5 R1 Description AVX 06035J5R6BBT, 2.7 pF AVX 06035J5R6BBT, 2.7 pF 4.7uF AVX 06035J8R2BBT, 8.2 pF 0.01 uF 0805, 50 Contact TriQuint Applications Engineering for additional info 9 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Clean the assembly with alcohol. Typical Solder Reflow Profiles Reflow Profile Ramp-up Rate Activation Time and Temperature Time above Melting Point Max Peak Temperature Time within 5 C of Peak Temperature Ramp-down Rate SnPb 3 C/sec 60 - 120 sec @ 140 - 160 C 60 - 150 sec 240 C 10 - 20 sec 4 - 6 C/sec Pb Free 3 C/sec 60 - 180 sec @ 150 - 200 C 60 - 150 sec 260 C 10 - 20 sec 4 - 6 C/sec Ordering Information Part TGA2925-SG Package Style Gull Wing Leads 10 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com |
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