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WIREWOUND TYPE COMMON MODE FILTER
1. PART NO. EXPRESSION : W3F900-RD-10
(a)(b) (d) (c) (e)(f) (g)
W3 SERIES
(a) Series code (b) Dimension code (c) Material code (d) Impedance code : 900 = 90
(e) R : Tape & Reel (f) Rated Current : D = 400mA (g) 10 : Lead Free
2. CONFIGURATION & DIMENSIONS :
A
C
F
B
E
1
2
G2 H
1
2
D2
4
D2 G1 L
3
4
D1
3
D1
PCB Pattern D1 0.45 Typ. D2 0.40 Typ. E 0.17 Typ. F 0.270.05 G1 1.10 Ref. G2 0.45 Ref. H 1.25 Ref.
Unit:m/m L 2.60 Ref.
A 2.00.2
B 1.20.2
C 1.20.2
3. SCHEMATIC : 1 2
4
3
4. MATERIALS : d (a) Core : Ferrite U Core (b) Wire : Enamelled Copper Wire a c b (c) Terminal : Ag / Ni / Sn (d) Capsulate : Ferrite Cap
NOTE : Specifications subject to change without notice. Please check our website for latest information.
14.04.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
WIREWOUND TYPE COMMON MODE FILTER
5. GENERAL SPECIFICATION : a) Operating temp. : -40C to +85C b) Storage temp. : -40C to +85C
W3 SERIES
6. ELECTRICAL CHARACTERISTICS : Part No. W3F900-RD-10 W3F121-RD-10 W3F161-RD-10 W3F221-RC-10 W3F371-RA-10 Common mode Impedance () 9025% 12025% 16025% 22025% 37025% Test Frequency ( MHz ) 100 100 100 100 100 DCR () Max. 0.30 0.15 0.35 0.40 0.50 Rated Current ( mA ) 400 400 350 300 100 Rated Voltage ( Vdc ) 50 50 50 50 50 Withstand Voltage ( Vdc ) 125 125 125 125 125 IR () Min. 10M 10M 10M 10M 10M
7. CHARACTERISTICS CURVES :
W3F900-RD-10 WCM2012F2SF-900
1000
W3F121-RD-10 WCM2012F2SF-121 1000
IMPEDANCE(Ohm)
IMPEDANCE( Ohm)
100
Common Mode
100
Common Mode
10
10
1
Normal Mode
1
Normal Mode
0.1 1 10 100 1000 10000
0.1 1 10 100 1000 10000
FREQUENCY(MHz)
FREQUENCY(M Hz)
W3F161-RD-10 WCM2012F2SF-161
1000
W 3F221-RC-10 WCM2012F2SF-221
1000
IMPEDANCE(Ohm)
10
IMPEDANCE(Ohm)
100
Common Mode
100
Common Mode
10
1
Normal Mode
1
Normal Mode
0.1 1 10 100 1000 10000
0.1 1 10 100 1000 10000
FREQUENCY(MHz)
FREQUENCY( MHz)
W3F371-RA-10
10000
WCM2012F2S-361T01 Common Mode
1000
100
Normal Mode
10
1
0.1 1 10 100 1000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
14.04.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
WIREWOUND TYPE COMMON MODE FILTER
8. RELIABILITY & TEST CONDITION :
W3 SERIES
ITEM
Electrical Characteristics Test Z (common mode) DCR I.R. Rated Current
PERFORMANCE
TEST CONDITION
HP-4291A + HP-16092A
Refer to standard electrical characteristics list
HP-4338B Zentech 702A (Ultra High Resistance Meter) Applied the current to coils the impedance change should be less than 25% to initial value and temperature rise should not be more than 30C.
Operating Temperature Storage Temperature Temperature Rise Test
-40C ~ +85C -40C ~ +85C 30C max. ( t) 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer.
Mechanical Performance Test Solderability Test More than 90% of termincal electrode should be covered with solder.
Preheating Dipping Natural cooling
245C 150C
60 seconds
50.5 seconds
After fluxing component shall be dipped in a melted solder bath at 2455C for 5 seconds. Solder Heat Resistance 1. Components should have not evidence of electrical and mechanical damage.
260C Preheating Dipping Natural cooling
2. Impedance : within 25% of initial value.
150C
60 seconds 100.5 seconds
Preheat : 150C 60secs Solder : Sn-Ag3-Cu0.5 Solder temperature : 2605C Flux : rosin Dip time : 105 secs. Component Adhesion (Push Test) Size W4 (S) W3 (S) W4 (N) W3 (N) F (Kg) 0.8 (min.) 0.5 (min.) 0.8 (min.) 0.5 (min.)
Glass Epoxy Substrate with Copper Clad
The device should be reflow solder (2305C for 10 secs.) to a tinned copper substrate. A dynometer force gauge should be applied the side of the component. The device must withstand F(Kg) without failure of the termination attached to component.
Core
F
Component Adhesion (Pull Test)
Size W4 (S) W3 (S) W4 (N) W3 (N)
F (Kg) 0.8 (min.) 0.5 (min.) 0.8 (min.) 0.5 (min.)
1. Insert 10cm wire into the remaining open eye bend, the ends of even wire lengths upward and wind together. 2. Terminal shall not be remarkably damaged.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
14.04.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
WIREWOUND TYPE COMMON MODE FILTER
8. RELIABILITY & TEST CONDITION :
W3 SERIES
ITEM
Reliabilty Test High Temperature Life Test
PERFORMANCE
TEST CONDITION
Temperature : 855C Time : 50012hr. Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber.
Low Temperature Life Test
1. Appearance : No damage. 2. Impedance : within 25% of initial value. No disconnection or short circuit.
Temperature : -405C Time : 50012hr. Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Conditions of 1 cycle Step 1 2 3 4 Temperature (C) -403 Room Temperature 853 Room Temperature Times (min.) 303 Within 3 303 Within 3
Thermal Shock
Conditions of 1 cycle Total : 10 cycle Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Humidity Resistance Temperature : 405C Humidity : 90 to 95% Applied current : Rated current Time : 50012hr Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Appearance : Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Impedance: within 30% Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours).
Random Vibration Test
NOTE : Specifications subject to change without notice. Please check our website for latest information.
14.04.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
WIREWOUND TYPE COMMON MODE FILTER
9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 1 2
W3 SERIES
4
1.10 2.60
3
PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure.
0.45
9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150C. d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 280C tip temperature (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 3 secs.
Preheating
Soldering
20~40s
TEMPERATURE C
TEMPERATURE C
Natural cooling
1.25
Preheating
260 245 150
Soldering
Natural cooling
TP(260C/10s max.) 217 200 150
60~180s 480s max. 60~150s
25
Time(sec.) Figure 1. Re-flow Soldering
Over 2min.
Gradual Cooling
Within 3s
Figure 2. Wave Soldering
Preheating Soldering
3s (max.) 10s (max.)
TEMPERATURE C
Natural cooling
350 330 150
Over 1min.
Gradual Cooling
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
14.04.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
WIREWOUND TYPE COMMON MODE FILTER
10. PACKAGING INFORMATION : 10-1. Reel Dimension
A
W3 SERIES
Type 7" x 8mm
D B C
A(mm) 9.00.5
B(mm) 60.02.0
C(mm)
D(mm)
13.50.5 178.02.0
20.5
13.50.5 R10.5
7" x 8mm
7" x 12mm
R1.9
R0.5
120
10-2 Tape Dimension / 8mm
Po:40.1 D:1.5+0.1 A W:8.00.1 t
P2:20.05 E:1.750.1
Series W3 (S) W4 (S)
Bo
Size 201212 321620 201209 321615
Bo(mm) 2.350.10 3.500.10 2.500.10 3.500.10
Ao(mm) 1.500.10 1.880.10 1.600.10 1.880.10
Ko(mm) 1.450.10 2.100.10 1.250.10 1.800.10
P(mm) 4.00.1 4.00.1 4.00.1 4.00.1
t(mm) 0.220.05 0.220.05 0.220.05 0.220.05
F:3.50.05
W3 (N)
Ko
P
A D1:10.1
Ao
W4 (N)
Section A-A
10-1. Reel Dimension
Chip Size Chip / Reel Inner Box Middle Box Carton W3 2000 / 3000 10000 / 15000 50000 / 75000 100000 / 150000 W4 2000 10000 50000 100000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
14.04.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6

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