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photocoupler ps8821-1,-2 1 mbps analog output type 8-pin ssop (so-8) high-speed photocoupler document no. pn10591ej03v0ds (3rd edition) date published august 2008 ns ? nepoc series ? description the ps8821-1, -2 are optically coupled isolators containing a gaalas led on the light emitting diode (input side) and a pin photodiode and a high-speed amplifie r transistor on the output side on one chip. the ps8821-2 is suitable for high density applications. features ? 40% reduction of mounting area (5-pin sop 2) ? low power consumption (v cc = 3.3 v) pin connection (top view) 1. nc 2. anode 3. cathode 4. nc 5. gnd 6. v o 7. nc 8. v cc 1 234 8 765 ps8821-1 1. anode1 2. cathode1 3. cathode2 4. anode2 5. gnd 6. v o 2 7. v o 1 8. v cc ps8821-2 1 234 8 765 ? high isolation voltage (bv = 2 500 vr.m.s.) ? high-speed response (t phl = 0.6 s max., t plh = 0.9 s max.) ? ordering number of tape produc t: ps8821-1-f3, f4: 1 500 pcs/reel : ps8821-2-f3, f4: 1 500 pcs/reel ? pb-free product ? safety standards ? ul approved: file no. e72422 ? din en60747-5-2 (vde0884 part2) approved (option) applications ? power over ethernet ? computer and peripheral manufactures ? substitutions for relays and pulse transformers ? power supply the mark shows major revised points. the revised points can be easily searched by copying an "" in the pdf file and specifying it in the "find what:" field. 2006, 2008
ps8821-1,-2 package dimensions (unit: mm) 1.27 0.4 +0.10 ?0.05 0.25 m 0.10.1 3.950.1 6.00.2 0.50.3 0.15 +0.10 ?0.05 5.210.25 3.270.2 0.10 s data sheet pn10591ej03v0ds 2
ps8821-1,-2 marking example snbi plating no. 1 pin mark initial of nec (engraved mark) ps8821-1 ps8821-2 no. 1 pin mark initial of nec (engraved mark) n 8821-2 nl831 week assembled n 8821-1 nl831 8 31 year assembled (last 1 digit) l n rank code in-house code (l: pb-free) 8 31 year assembled (last 1 digit) l n rank code in-house code (l: pb-free) week assembled type number assembly lot type number assembly lot ni/pd/au plating no. 1 pin mark initial of nec (engraved mark) ps8821-1 ps8821-2 no. 1 pin mark initial of nec (engraved mark) n 8821-2 nt831 week assembled n 8821-1 nt831 8 31 year assembled (last 1 digit) t n rank code in-house code (t: pb-free) 8 31 year assembled (last 1 digit) t n rank code in-house code (t: pb-free) week assembled type number assembly lot type number assembly lot data sheet pn10591ej03v0ds 3
ps8821-1,-2 ordering information part number order number solder plating specification packing style safety standard approval application part number *1 ps8821-1 ps8821-1-a pb-free 20 pcs (tape 20 pcs cut) standard products ps8821-1 ps8821-1-f3 ps8821-1-f3-a (snbi) embossed tape 1 500 pcs/reel (ul approved) ps8821-1-f4 ps8821-1-f4-a ps8821-2 ps8821-2-a 20 pcs (tape 20 pcs cut) ps8821-2 ps8821-2-f3 ps8821-2-f3-a embossed tape 1 500 pcs/reel ps8821-2-f4 ps8821-2-f4-a ps8821-1-v ps8821-1-v-a 20 pcs (tape 20 pcs cut) din en60747-5-2 ps8821-1 ps8821-1-v-f3 ps8821-1-v-f3-a embossed tape 1 500 pcs/reel (vde0884 part2) ps8821-1-v-f4 ps8821-1-v-f4-a approved (option) ps8821-2-v ps8821-2-v-a 20 pcs (tape 20 pcs cut) ps8821-2 ps8821-2-v-f3 ps8821-2-v-f3-a embossed tape 1 500 pcs/reel ps8821-2-v-f4 ps8821-2-v-f4-a ps8821-1 ps8821-1-ax pb-free 20 pcs (tape 20 pcs cut) standard products ps8821-1 ps8821-1-f3 PS8821-1-F3-AX (ni/pd/au) embossed tape 1 500 pcs/reel (ul approved) ps8821-1-f4 ps8821-1-f4-ax ps8821-2 ps8821-2-ax 20 pcs (tape 20 pcs cut) ps8821-2 ps8821-2-f3 ps8821-2-f3-ax embossed tape 1 500 pcs/reel ps8821-2-f4 ps8821-2-f4-ax ps8821-1-v ps8821-1-v-ax 20 pcs (tape 20 pcs cut) din en60747-5-2 ps8821-1 ps8821-1-v-f3 ps8821-1-v-f3-ax embossed tape 1 500 pcs/reel (vde0884 part2) ps8821-1-v-f4 ps8821-1-v-f4-ax approved (option) ps8821-2-v ps8821-2-v-ax 20 pcs (tape 20 pcs cut) ps8821-2 ps8821-2-v-f3 ps8821-2-v-f3-ax embossed tape 1 500 pcs/reel ps8821-2-v-f4 ps8821-2-v-f4-ax *1 for the application of the safety stan dard, following part number should be used. data sheet pn10591ej03v0ds 4
ps8821-1,-2 absolute maximum ratings (t a = 25c, unless otherwise specified) parameter symbol ratings unit diode forward current i f 25 ma/ch reverse voltage v r 5.0 v/ch power dissipation *1 p d 45 mw/ch detector supply voltage v cc 7 v output voltage v o 7 v/ch output current i o 8.0 ma/ch power dissipation *2 p c 100 mw/ch isolation voltage *3 bv 2 500 vr.m.s. operating ambient temperature t a ?55 to +100 c storage temperature t stg ?55 to +125 c *1 reduced to 0.45 ma/ c at t a = 25 c or more. *2 reduced to 1.00 ma/ c at t a = 25 c or more. *3 ac voltage for 1 minute at t a = 25c, rh = 60% between input and output. pins 1-4 shorted together, 5-8 shorted together. recommended operating conditions parameter symbol min. typ. max. unit supply voltage v cc 3.0 3.3 3.6 v forward current (on) i f (on) 16 20 ma input voltage (off) v f (off) 0 0.8 v data sheet pn10591ej03v0ds 5
ps8821-1,-2 electrical characteristics (t a = 25c, unless otherwise specified) parameter symbol conditions min. typ. max. unit diode forward voltage v f i f = 16 ma 1.7 2.2 v reverse current i r v r = 3 v 10 a forward voltage temperature coefficient v f / t a i f = 16 ma ? 2.1 mv/ c terminal capacitance c t v = 0 v, f = 1 mhz 30 pf detector high level output current i oh i f = 0 ma, v cc = v o = 3.3 v 0.01 1 a low level output voltage v ol i f = 16 ma, v cc = 3.3 v, i ol = 1.2 ma 0.1 0.4 v high level supply current (ps8821-1) i cch i f = 0 ma, v o = open, v cc = 3.3 v 0.1 10 a high level supply current (ps8821-2) 0.2 20 low level supply current (ps8821-1) i ccl i f = 16 ma, v o = open, v cc = 3.3 v 100 low level supply current (ps8821-2) 200 coupled current transfer ratio ctr i f = 16 ma, v cc = 3.3 v, v o = 0.4 v 20 40 % input-output isolation resistance r i-o v i-o = 1 kv dc , rh = 40 to 60% 10 11 insulation resistance (input-input), (ps8821-2) r i-i v i-i = 5 v dc , rh = 40 to 60% 10 7 input-output isolation capacitance c i-o v = 0 v, f = 1 mhz 0.6 pf insulation capacitance (input-input), (ps8821-2) c i-i 0.3 propagation delay time (h l) *1 t phl i f = 10 ma, v cc = 3.3 v, r l = 1.8 k , c l = 15 pf, v thhl = v thlh = 1.5 v, t a = 0 to 100c 0.3 0.6 s propagation delay time (l h) *1 t plh 0.5 0.9 common mode transient immunity at high level output *2 c mh i f = 0 ma, v cc = 3.3 v, r l = 4.1 k , v cm = 1 kv 1 kv/ s common mode transient immunity at low level output *2 c ml i f = 10 ma, v cc = 3.3 v, r l = 4.1 k , v cm = 1 kv ?1 data sheet pn10591ej03v0ds 6
ps8821-1,-2 *1 test circuit for propagation delay time input output 50% 1.5 v v ol t phl t plh pulse input (i f ) (pw = 1 s, duty cycle = 1/10) v o (monitor) v cc = 3.3 v input (monitor) 0.1 f c l = 15 pf 47 r l = 1.8 k ps8821-1 pulse input (i f ) (pw = 1 s, duty cycle = 1/10) v o (monitor) v cc = 3.3 v input (monitor) 0.1 f c l = 15 pf 47 r l = 1.8 k ps8821-2 (i f = 10 ma) remark c l is approximately 15 pf which includes probe and stray wiring capacitance. *2 test circuit for common mode transient immunity v o (monitor) v cc = 3.3 v 0.1 f r l = 4.1 k ps8821-1 v cm c l = 15 pf i f v o (monitor) v cc = 3.3 v 0.1 f r l = 4.1 k ps8821-2 v cm sw c l = 15 pf i f 90% 10% 0 v v oh 2 v 0.8 v v ol v cm v o (i f = 0 ma) v o (i f = 10 ma) t r t f 1 kv usage cautions 1. this product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. by-pass capacitor of 0.1 f is used between v cc and gnd near device. also, ensure that the distance between the leads of the photocoupler and ca pacitor is no more than 10 mm. 3. avoid storage at a high te mperature and high humidity. data sheet pn10591ej03v0ds 7
ps8821-1,-2 typical characteristics (t a = 25c, unless otherwise specified) 50 30 20 10 0 40 25 50 75 100 ambient temperature t a (?c) diode power dissipation p d (mw) diode power dissipation vs. ambient temperature 120 100 60 20 0 80 40 25 50 75 100 ambient temperature t a (?c) transistor power dissipation p c (mw) transistor power dissipation vs. ambient temperature 100 0.01 0.1 10 1 1.4 1.8 2.0 2.4 1.0 1.2 1.6 2.2 forward voltage v f (v) forward current i f (ma) forward current vs. forward voltage t a = +100?c +50?c +25?c 0?c ?25?c forward current i f (ma) current transfer ratio vs. forward current current transfer ratio ctr ( % ) 1.6 0.0 1.2 0.4 1.4 1.0 0.8 0.6 0.2 0 50 100 ?50 ?25 25 75 ambient temperature t a (?c) normalized current transfer raio ctr normalized current transfer ratio vs. ambient temperature normalized to 1.0 at t a = 25?c, i f = 10 ma, v cc = 3.3 v, v o = 0.4 v ambient temperature t a (?c) high level output current i oh (na) high level output current vs. ambient temperature 1 000.0 100.0 10.0 1.0 50 100 ?50 ?25 0 25 75 i f = 0 ma, v cc = v o = 3.3 v 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0 10 50 1 v cc = 3.3 v, v o = 0.4 v remark the graphs indicate nominal characteristics. data sheet pn10591ej03v0ds 8
ps8821-1,-2 5 4 2 0 3 1 ?50 0 50 100 ?25 75 25 ambient temperature t a (?c) normalized propagation delay time vs. ambient temperature normalized propagation delay time t phl , t plh normalized to 1.0 at t a = 25?c, i f = 10 ma, v cc = 3.3 v, v o = 0.4 v, r l = 1.8 k t plh t phl forward current i f (ma) propagation delay time vs. forward current propagation delay time t phl , t plh ( s) 2.0 1.0 0 12 14 18 10 8 16 t phl t plh v cc = 3.3 v, r l = 1.8 k remark the graphs indicate nominal characteristics. data sheet pn10591ej03v0ds 9
ps8821-1,-2 taping specifications (unit: mm) outline and dimensions (reel) packing: 1 500 pcs/reel 2.00.5 r 1.0 13.00.2 21.00.8 3302.0 1001.0 2.00.5 11.9 to 15.4 outer edge of flange 17.51.0 13.51.0 13.00.2 1.70.1 2.00.05 4.00.1 1.750.1 6.40.1 5.560.1 0.3 0.05 8.00.1 1.5 +0.1 ?0 5.50.1 12.00.2 3.60.1 4.05 max. outline and dimensions (tape) taping direction ps8821-1-f3 ps8821-2-f3 ps8821-1-f4 ps8821-2-f4 data sheet pn10591ej03v0ds 10
ps8821-1,-2 recommended mount pad dimensions (unit: mm) 1.45 0.8 1.27 5.25 remark all dimensions in this figure must be evaluated before use. data sheet pn10591ej03v0ds 11
ps8821-1,-2 notes on handling 1. recommended soldering conditions (1) infrared reflow soldering ? peak reflow temperature 260 c or below (package surface temperature) ? time of peak reflow temperature 10 seconds or less ? time of temperature higher than 220 c 60 seconds or less ? time to preheat temperature from 120 to 180 c 120 30 s ? number of reflows three ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) 12030 s (preheating) 220?c 180?c package surface temperature t (?c) time (s) recommended temperature profile of infrared reflow (heating) to 10 s to 60 s 260?c max. 120?c (2) wave soldering ? temperature 260 c or below (molten solder temperature) ? time 10 seconds or less ? preheating conditions 120 c or below (package surface temperature) ? number of times one (allowed to be dipped in solder including plastic mold portion.) ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (3) soldering by soldering iron ? peak temperature (le ad part temperature) 350 c or below ? time (each pins) 3 seconds or less ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (a) soldering of leads should be made at the poi nt 1.5 to 2.0 mm from the root of the lead. (b) please be sure that the temperature of the package would not be heated over 100 c. data sheet pn10591ej03v0ds 12
ps8821-1,-2 (4) cautions ? fluxes avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aware that when voltage is applied suddenly betw een the photocoupler?s input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. usage cautions 1. protect against static el ectricity when handling. 2. avoid storage at a high temperature and high humidity. data sheet pn10591ej03v0ds 13
ps8821-1,-2 specification of vde marks license document parameter symbol speck unit application classification (din en 60664-1 vde0110 part 1) for rated line voltages 300 vr.m.s. for rated line voltages 600 vr.m.s. iv iii climatic test class (din en 60664-1 vde0110) 55/100/21 dielectric strength maximum operating isolation voltage test voltage (partial discharge test, procedure a for type test and random test) u pr = 1.5 u iorm , p d < 5 pc u iorm u pr 566 849 v peak v peak test voltage (partial discharge te st, procedure b for all devices) u pr = 1.875 u iorm , p d < 5 pc u pr 1 061 v peak highest permissible overvoltage u tr 4 000 v peak degree of pollution (din en 60664-1 vde0110 part 1) 2 clearance distance > 4.0 mm creepage distance > 4.0 mm comparative tracking index (din iec 112/vde 0303 part 1) cti 175 material group (din en 60664-1 vde0110 part 1) iii a storage temperature range t stg ?55 to +125 c operating temperature range t a ?55 to +100 c isolation resistance, minimum value v io = 500 v dc at t a = 25c v io = 500 v dc at t a max. at least 100c ris min. ris min. 10 12 10 11 safety maximum ratings (maximum permi ssible in case of fault, see thermal derating curve) package temperature current (input current i f , psi = 0) power (output or total power dissipation) isolation resistance v io = 500 v dc at t a = tsi tsi isi psi ris min. 150 150 600 10 9 c ma mw data sheet pn10591ej03v0ds 14
data sheet pn10591ej03v0ds 15 ps8821-1,-2 the information in this document is current as of august, 2008. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e 02. 11-1 (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific":
ps8821-1,-2 caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinances when disposi ng of the product. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subjec t to special control) up until final disposal. ? do not burn, destroy, cut, crush, or chemically dissolve the product. ? do not lick the product or in any way allow it to enter the mouth.

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